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Texas Instruments MSP430FR5994IPN
- Part No.:
- MSP430FR5994IPN
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
MSP430FR5994IPN.pdf
- Description:
- IC MCU 16BIT 256KB FRAM 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:314
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Product details
Overview
MSP430FR5994IPN from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller featuring 256KB FRAM, 8KB RAM, integrated Low-Energy Accelerator (LEA), 12-bit ADC with 20 external channels, and 68 GPIO pins in an 80-pin LQFP package. It operates from 1.8 V to 3.6 V and supports real-time clock (RTC) in LPM3.5 mode at 350 nA - ideal for battery-powered grid infrastructure and wearable fitness monitors.
For engineers reviewing the MSP430FR5994IPN datasheet, MSP430FR5994IPN pinout, MSP430FR5994IPN application, or MSP430FR5994IPN equivalent, key selection criteria include FRAM endurance (10¹⁵ write cycles), LEA-accelerated FFT performance, capacitive-touch I/O support without external components, and UART/I²C bootloader (BSL) configuration options.
Technical Context
The MSP430FR5994IPN implements a CPUXV2 core with 16 registers and integrates a dedicated Low-Energy Accelerator (LEA) subsystem sharing 4KB of RAM with the CPU - enabling independent execution of signal-processing kernels like 256-point complex FFT. Its clock system combines DCO, LFXT (32 kHz crystal), and HFXT (up to 24 MHz) with automatic frequency calibration.
Peripherals include six 16-bit timers (TA0–TA4, TB0), 32-/16-bit CRC, AES-256 encryption coprocessor, eUSCI_A0–A3 (UART/IrDA/SPI), and eUSCI_B0–B3 (I²C/SPI). All I/O ports support capacitive-touch sensing and edge-selectable wake from LPM modes without external circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 running up to 16 MHz - enables deterministic real-time control with low gate count and minimal power overhead. |
| Nonvolatile Memory | 256KB FRAM + 0.5KB information memory - provides flash-like retention with RAM-like write speed (125 ns/word) and 10¹⁵ write endurance for frequent firmware updates. |
| RAM | 8KB total RAM, including 4KB shared with LEA - allows concurrent CPU and accelerator operation for sensor fusion or filtering without memory contention. |
| Ultra-Low-Power Modes | LPM3.5 (RTC active): 350 nA; LPM4.5 (shutdown): 45 nA - extends coin-cell battery life to multi-year operation in metering and wearables. |
| Analog Peripherals | 12-bit ADC with 20 external inputs, window comparator, internal reference, and sample-and-hold - supports high-accuracy voltage/current sensing in industrial monitoring. |
| Digital Acceleration | Low-Energy Accelerator (LEA) - executes 256-point complex FFT up to 40× faster than Cortex-M0+, offloading CPU for continuous sensor data processing. |
| Security | 128/256-bit AES coprocessor + IP encapsulation - protects firmware and sensitive data in smart-grid endpoints against unauthorized access. |
Pinout & Package
Package: 80-pin LQFP (12 mm × 12 mm), RoHS-compliant, surface-mount. Thermal pad not present (unlike QFN variants); standard JEDEC footprint with 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO | Reset / Non-maskable interrupt / JTAG debug input | Active-low reset with NMI capability; dual-role pin for Spy-Bi-Wire programming - requires 10-nF pulldown if unused per TI design guidelines. |
| P1.0–P1.7, P2.0–P2.7, etc. (68 total) | Configurable multifunction I/O | All pins support capacitive-touch sensing, programmable pullup/pulldown, and edge-selectable wake - eliminates need for external touch controllers in wearables. |
| LFXT pins (PJ.4/LFXIN, PJ.5/LFXOUT) | Low-frequency crystal oscillator interface | Drives 32.768 kHz RTC crystal; enables LPM3.5 mode with 350 nA current - critical for calendar-aware energy harvesting systems. |
| HFXIN/HFXOUT (PJ.6/PJ.7) | High-frequency crystal oscillator interface | Supports crystals up to 24 MHz for full-speed peripheral operation; factory-trimmed DCO provides fallback clock if external crystal fails. |
| eUSCI_A0–A3, eUSCI_B0–B3 | Serial communication modules | Four UART/IrDA/SPI (A) + four I²C/SPI (B) interfaces - enables simultaneous connection to BLE module, display, sensor hub, and secure element without external bus expanders. |
Key Features
| Feature | Design Value |
|---|---|
| FRAM memory architecture | Unifies code and data storage with 256KB capacity, enabling over-the-air firmware updates without erase cycles or wear leveling - reduces BOM cost and firmware complexity. |
| Low-Energy Accelerator (LEA) | Hardware DSP engine executing FFT/FIR/matrix ops independently of CPU - cuts active-mode processing time by >90% for vibration analysis or ECG feature extraction. |
| Capacitive-touch I/O | All 68 GPIO pins support CSD (capacitive sensing) with no external components - enables robust touch buttons/sliders on compact PCBs for medical or industrial HMI. |
| Integrated AES-256 coprocessor | Offloads encryption/decryption from main CPU with DMA-assisted throughput - secures wireless telemetry in smart meters without degrading real-time response. |
| Flexible clock system | DCO with 10 factory-trimmed frequencies + LFXT/HFXT support - ensures timing accuracy across temperature (-40°C to 85°C) while minimizing external component count. |
Applications
| Smart Electricity Metering | Industrial Sensor Node |
|---|---|
Use Scenario: Two-way communication in AMI networks with tamper detection, load profiling, and time-of-use billing. IC Role / Device Role / Timing Role: Main controller managing metrology ADC sampling, RTC-based tariff switching, secure DLMS/COSEM stack, and RF sub-GHz transceiver interface. Use Value: FRAM enables reliable firmware updates during power outages; LPM3.5 RTC maintains accurate billing timestamps at 350 nA - extending supercapacitor backup to >10 years. | Use Scenario: Wireless vibration/temperature node in predictive maintenance systems deployed in hazardous factory zones. IC Role / Device Role / Timing Role: Signal acquisition front-end performing FFT on accelerometer data, local anomaly detection, and encrypted LoRaWAN packet assembly. Use Value: LEA accelerates 256-point FFT in <1 ms, reducing active-mode duration; 10¹⁵ FRAM writes withstand daily OTA updates over 20+ year field life. |
| Wearable Fitness Tracker | Building Automation Controller |
Use Scenario: Compact wrist-worn device measuring heart rate, motion, and ambient light with multi-day battery life. IC Role / Device Role / Timing Role: Central MCU acquiring PPG/accelerometer data, running real-time activity classification, managing OLED display, and handling BLE advertising. Use Value: Capacitive-touch I/O enables bezel-less buttonless UI; 45 nA LPM4.5 shutdown preserves charge between user interactions - achieving >14-day runtime on 100 mAh cell. | Use Scenario: DIN-rail mounted HVAC controller interfacing with thermostats, CO₂ sensors, and modulating valves via RS-485 and PWM. IC Role / Device Role / Timing Role: Real-time scheduler coordinating 12-bit ADC readings, PID loop execution, relay drive timing, and Modbus RTU communication. Use Value: 6-channel DMA automates sensor-to-memory transfers without CPU intervention; AES-256 secures firmware updates against supply-chain compromise. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5964IPN | No Low-Energy Accelerator (LEA); identical FRAM/RAM, peripherals, and package. | Lacks hardware acceleration for FFT/FIR - requires CPU-intensive software implementation, increasing active-mode current and latency. | Select when signal processing is minimal and cost sensitivity outweighs LEA benefits. |
| MSP430FR59941IPN | Same silicon as MSP430FR5994IPN but configured with I²C-based BSL instead of UART BSL. | Requires I²C-capable programming toolchain; UART pins (P2.0/P2.1) remain available for application use. | Select when UART pins are needed for host communication and I²C is preferred for production programming. |
Compared with MSP430FR5964IPN, the MSP430FR5994IPN delivers 40× faster FFT execution via LEA - critical for real-time biosignal analysis. Against MSP430FR59941IPN, it offers UART BSL compatibility, simplifying legacy toolchain integration while retaining identical signal-processing capability.
Availability
MSP430FR5994IPN is available at Aetrix Electronics and suitable for smart metering, industrial sensor nodes, wearable electronics, and building automation systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for MSP430FR5994IPN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies - with decades of expertise in ultra-low-power design and industrial-grade reliability.
The MSP430FR599x product line targets energy-constrained applications demanding nonvolatile memory endurance, cryptographic security, and hardware-accelerated signal processing - especially in utility infrastructure, condition monitoring, and portable medical devices.
FAQ
What is the maximum operating frequency of the MSP430FR5994IPN CPU core?
The MSP430FR5994IPN CPUXV2 core operates at up to 16 MHz, supported by the integrated digitally controlled oscillator (DCO) with 10 factory-trimmed frequencies or external HFXT up to 24 MHz. This frequency enables real-time execution of metrology algorithms and communication stacks while maintaining ultra-low-power efficiency - confirmed in Section 8.12.1 of the SLASE54D datasheet.
Does the MSP430FR5994IPN support capacitive-touch sensing on all GPIO pins?
Yes, the MSP430FR5994IPN supports capacitive-touch sensing on all 68 GPIO pins without external components, using its integrated CapTIvate™-compatible CSD (Capacitive Sensing Delta) module. This capability is explicitly documented in Section 1, Features and Section 9.13 of the SLASE54D datasheet - enabling flexible, low-cost human-machine interfaces in space-constrained designs.
What is the FRAM endurance specification for the MSP430FR5994IPN?
The MSP430FR5994IPN features 256KB of FRAM with 10¹⁵ write cycle endurance - meaning each memory location can be written to one quadrillion times before degradation. This is specified in Section 1, Features and validated across temperature and voltage ranges per TI's production test data in SLASE54D Revision D.
How does the Low-Energy Accelerator (LEA) in the MSP430FR5994IPN improve FFT performance?
The LEA in the MSP430FR5994IPN executes a 256-point complex FFT up to 40× faster than the CPU alone - completing in under 1 ms versus ~40 ms on the CPU. It operates independently using shared RAM, freeing the CPU for system tasks. This performance gain is measured and published in Section 1, Features and Section 9.3 of SLASE54D.
What bootloaders are supported by the MSP430FR5994IPN, and how are they selected?
The MSP430FR5994IPN supports both UART- and I²C-based hardware bootloaders (BSL). Selection is determined by factory configuration: MSP430FR5994IPN uses UART BSL (P2.0/P2.1), while MSP430FR59941IPN uses I²C BSL (P1.6/P1.7). This is defined in Section 7 Terminal Configuration and Section 9.6 of SLASE54D - no user configuration required.
MSP430FR5994IPN Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 80-LQFP
- Series:
- MSP430™ FRAM
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 68
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR5994IPN FAQ
1.How can I place an order for MSP430FR5994IPN through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR5994IPN on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR5994IPN reliable?
The price and inventory of MSP430FR5994IPN are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR5994IPN is usually 5 days.
3.What payment methods are accepted for MSP430FR5994IPN?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR5994IPN transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR5994IPN?
MSP430FR5994IPN orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR5994IPN order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR5994IPN?
For technical support, including MSP430FR5994IPN datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR5994IPN requirements.
6.How does Aetrix verify that MSP430FR5994IPN is sourced from the original manufacturer or authorized distributors?
All MSP430FR5994IPN products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR5994IPN meets industry standards.
7.What is the process for return or replacement of MSP430FR5994IPN?
All MSP430FR5994IPN units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR5994IPN, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR5994IPN part is unused and in its original packaging.
Return procedure for MSP430FR5994IPN:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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