Texas Instruments MSP430FR5994IRGZR
- Part No.:
- MSP430FR5994IRGZR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430FR5994IRGZR.pdf
- Description:
- IC MCU 16BIT 256KB FRAM 48VQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430FR5994IRGZR from Texas Instruments is a 16-bit ultra-low-power FRAM microcontroller with 256KB FRAM, 8KB RAM, integrated low-energy accelerator (LEA), 12-bit ADC (20-channel), and 4 eUSCI_A + 4 eUSCI_B serial interfaces. It operates from 1.8 V to 3.6 V and supports real-time clock (RTC) in LPM3.5 mode at 350 nA - deployed in battery-powered grid infrastructure and wearable fitness monitors.
For engineers reviewing the MSP430FR5994IRGZR datasheet, MSP430FR5994IRGZR pinout, MSP430FR5994IRGZR application, or MSP430FR5994IRGZR equivalent, key selection criteria include FRAM endurance (10¹⁵ write cycles), LEA-accelerated FFT performance, capacitive-touch I/O capability, and UART/I²C bootloader support across its 48-pin VQFN package.
Technical Context
The MSP430FR5994IRGZR implements a CPUXV2 core with 16 registers and a dedicated Low-Energy Accelerator (LEA) subsystem sharing 4KB of RAM - enabling independent execution of signal-processing kernels like 256-point complex FFT without CPU intervention. Its memory architecture unifies program and data storage in nonvolatile FRAM, eliminating erase-before-write latency.
Power management includes six low-power modes (LPM0–LPM4.5), with LPM3.5 (RTC active, 3.7-pF crystal) drawing only 350 nA and LPM4.5 (shutdown) consuming 45 nA. Clock sources comprise DCO (10 factory-trimmed frequencies), LFXT (32 kHz crystal), HFXT (up to 24 MHz), and VLO - all configurable via software-controlled clock system registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2, up to 16 MHz - enables deterministic real-time control with minimal instruction cycles per operation. |
| Memory | 256 KB FRAM + 8 KB RAM (4 KB shared with LEA) - supports over-the-air firmware updates without flash wear-out or erase delays. |
| ADC | 12-bit SAR ADC with 20 external inputs, window comparator, internal reference - suitable for sensor signal acquisition with programmable thresholds. |
| Ultra-Low-Power Modes | LPM3.5: 350 nA (RTC active); LPM4.5: 45 nA (full shutdown) - extends battery life in energy-constrained IoT endpoints. |
| Serial Interfaces | 4 × eUSCI_A (UART/IrDA/SPI) + 4 × eUSCI_B (I²C/SPI) - provides flexible connectivity for multi-protocol sensor hubs and metering systems. |
| Security | 128/256-bit AES coprocessor + IP encapsulation - protects firmware and sensitive data against physical and logical attacks. |
| Capacitive Touch | All I/O pins support CTSIO without external components - reduces BOM cost and PCB area in wearable UI designs. |
Pinout & Package
VQFN-48 (RGZ) package, 7 mm × 7 mm, thermally enhanced with exposed pad connected to DVSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO | Reset / Non-maskable interrupt / JTAG debug input | Single-pin multifunction interface for safe reset initiation, critical fault handling, and Spy-Bi-Wire programming. |
| P1.0–P1.7, P2.0–P2.7, P3.0–P3.7, P4.0–P4.7, P5.0–P5.7, P6.0–P6.7, P7.0–P7.7, P8.0–P8.3, PJ.0–PJ.7 | Configurable GPIO with peripheral multiplexing | Each pin supports capacitive touch sensing, edge-selectable wake-up from LPM, and programmable pullup/pulldown - simplifies low-power human-interface design. |
| LFXT pins (PJ.4/LFXIN, PJ.5/LFXOUT) | Low-frequency crystal oscillator interface | Supports 32.768 kHz crystal for RTC operation in LPM3.5 - enables calendar timekeeping with sub-microamp quiescent current. |
| HFXT pins (PJ.6/HFXIN, PJ.7/HFXOUT) | High-frequency crystal oscillator interface | Drives system clock up to 24 MHz for high-throughput signal processing or communication bursts. |
| AVCC1/AVSS1–AVSS3 | Analog power supply and ground | Dedicated analog domain rails isolate noise-sensitive ADC and comparator circuits from digital switching transients. |
Key Features
| Feature | Design Value |
|---|---|
| Ferroelectric RAM (FRAM) | 256 KB unified memory with 10¹⁵ write endurance and 125 ns word write - eliminates flash wear leveling and enables logging at sensor sampling rates. |
| Low-Energy Accelerator (LEA) | Hardware DSP engine executing 256-point complex FFT up to 40× faster than Cortex-M0+, offloading CPU for continuous sensor analytics. |
| Capacitive Touch I/O | All 68 GPIO pins support CTSIO with no external RC network - reduces component count and layout complexity in compact wearables. |
| Real-Time Clock (RTC_C) | Calendar mode with alarm, powered from LPM3.5 at 350 nA using 3.7-pF crystal - delivers precise timekeeping during multi-year battery operation. |
| Hardware AES-256 | Dedicated encryption/decryption coprocessor with random number seed generator - secures firmware updates and telemetry without CPU overhead. |
Applications
| Smart Electricity Metering | Industrial Sensor Node |
|---|---|
Use Scenario: Two-way communication and tamper detection in ANSI C12.19-compliant smart meters with 10+ year battery life. IC Role / Device Role / Timing Role: Main controller managing metrology ADC sampling, secure DLMS/COSEM protocol stack, and RTC-based billing intervals. Use Value: FRAM enables reliable event logging under brownout; LPM3.5 RTC maintains billing accuracy at 350 nA; AES-256 secures firmware OTA updates. |
Use Scenario: Wireless vibration and temperature monitoring on rotating machinery in hazardous factory environments. IC Role / Device Role / Timing Role: Edge processor acquiring accelerometer data, running FFT via LEA, and transmitting spectral features via UART-to-LoRaWAN gateway. Use Value: LEA accelerates FFT 40× vs. CPU-only - enabling real-time anomaly detection; 1.8 V operation tolerates degraded battery voltage. |
| Wearable Fitness Tracker | Building Automation Controller |
Use Scenario: Compact wrist-worn device measuring heart rate, motion, and ambient light with multi-day battery runtime. IC Role / Device Role / Timing Role: Central MCU interfacing optical PPG sensor, 3-axis accelerometer, and capacitive touch UI buttons. Use Value: All-GPIO capacitive touch eliminates mechanical switches; FRAM stores raw sensor buffers without wear concerns; 45 nA LPM4.5 extends sleep duration. |
Use Scenario: Battery-powered HVAC zone controller with occupancy sensing, temperature regulation, and BACnet MS/TP communication. IC Role / Device Role / Timing Role: System-on-chip managing analog sensor conditioning, PID loop execution, and RS-485 transceiver control. Use Value: 12-bit ADC with internal reference ensures stable temperature readings; eUSCI_B0 supports I²C sensor expansion; SVS monitors supply down to 1.8 V. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power FRAM microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5964IRGZR | No LEA subsystem; identical FRAM/RAM size, ADC, and serial peripheral count. | Suitable where FFT or matrix math acceleration is unnecessary - reduces code complexity and power during signal processing. | Select when DSP offload is not required and cost optimization is prioritized over LEA-enabled analytics. |
| MSP430FR5994IPN | Same core, memory, and peripherals; packaged in 80-pin LQFP (12 mm × 12 mm) instead of 48-pin VQFN (7 mm × 7 mm). | Better suited for prototyping or applications requiring more GPIOs (68 vs. 40) and easier hand-soldering or test probe access. | Choose for development flexibility or production designs needing higher I/O count and thermal margin. |
Compared with MSP430FR5994IPN, the MSP430FR5994IRGZR offers 30% smaller footprint and lower thermal resistance but fewer GPIOs; versus MSP430FR5964IRGZR, it adds LEA-based signal processing at identical power and memory specs - making it optimal for embedded analytics in space-constrained, battery-operated systems.
Availability
MSP430FR5994IRGZR is available at Aetrix Electronics and suitable for grid infrastructure metering, industrial sensor nodes, and wearable fitness trackers requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for MSP430FR5994IRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency and system integration.
The MSP430FR599x product line targets ultra-low-power sensing and measurement applications - combining FRAM nonvolatility, LEA-accelerated signal processing, and sub-microamp LPM states to enable decade-long battery operation in intelligent endpoints.
FAQ
What is the maximum operating frequency of the MSP430FR5994IRGZR?
The MSP430FR5994IRGZR supports a maximum system clock frequency of 16 MHz using the DCO or HFXT oscillator. This speed is fully supported across its entire specified voltage range (1.8 V to 3.6 V) and enables real-time execution of control loops and communication stacks without timing violations.
Does the MSP430FR5994IRGZR support hardware-accelerated FFT?
Yes, the MSP430FR5994IRGZR integrates a Low-Energy Accelerator (LEA) that executes 256-point complex FFT up to 40× faster than the CPU alone. The LEA operates independently with dedicated 4KB RAM, allowing concurrent background signal analysis while the CPU handles system tasks - confirmed in the SLASE54D datasheet Section 9.3.
How many I/O pins does the MSP430FR5994IRGZR provide in its VQFN-48 package?
The MSP430FR5994IRGZR in the RGZ (VQFN-48) package provides 40 general-purpose I/O pins. This count is explicitly listed in Table 6-1 of the SLASE54D datasheet under the "I/Os" column for the 48 RGZ row - distinct from the 54-pin (PM) and 68-pin (PN/ZVW) variants in the same family.
What bootloader interfaces are supported by the MSP430FR5994IRGZR?
The MSP430FR5994IRGZR supports both UART-based and I²C-based hardware bootloaders (BSL). UART BSL uses P2.0 (BSLTX) and P2.1 (BSLRX); I²C BSL uses P1.6 (BSLSDA) and P1.7 (BSLSCL). These are fixed-function pins during BSL activation and do not require external level shifters for standard 3.3 V operation.
Is the MSP430FR5994IRGZR qualified for extended temperature operation?
Yes, the MSP430FR5994IRGZR is rated for operation from –40°C to 85°C ambient temperature, as specified in Section 8.3 (Recommended Operating Conditions) of the SLASE54D datasheet. This industrial-grade temperature range supports deployment in outdoor metering, factory automation, and building control environments.
MSP430FR5994IRGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR5994IRGZR FAQ
1.How can I place an order for MSP430FR5994IRGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR5994IRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR5994IRGZR reliable?
The price and inventory of MSP430FR5994IRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR5994IRGZR is usually 5 days.
3.What payment methods are accepted for MSP430FR5994IRGZR?
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MSP430FR5994IRGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR5994IRGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR5994IRGZR?
For technical support, including MSP430FR5994IRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR5994IRGZR requirements.
6.How does Aetrix verify that MSP430FR5994IRGZR is sourced from the original manufacturer or authorized distributors?
All MSP430FR5994IRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR5994IRGZR meets industry standards.
7.What is the process for return or replacement of MSP430FR5994IRGZR?
All MSP430FR5994IRGZR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR5994IRGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR5994IRGZR part is unused and in its original packaging.
Return procedure for MSP430FR5994IRGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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