Texas Instruments MSP430FR5994IRGZT
- Part No.:
- MSP430FR5994IRGZT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430FR5994IRGZT.pdf
- Description:
- IC MCU 16BIT 256KB FRAM 48VQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430FR5994IRGZT from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller featuring 256KB FRAM, 8KB RAM, integrated Low-Energy Accelerator (LEA), 12-bit ADC with 20 external channels, and dual eUSCI_A/eUSCI_B serial interfaces. It operates from 1.8 V to 3.6 V and delivers 40× faster FFT performance than Arm® Cortex®-M0+ cores-enabling real-time sensor analytics in battery-constrained wearable and industrial edge nodes.
For engineers reviewing the MSP430FR5994IRGZT datasheet, MSP430FR5994IRGZT pinout, MSP430FR5994IRGZT application, or MSP430FR5994IRGZT equivalent, key selection criteria include FRAM endurance (10¹⁵ write cycles), LPM3.5 RTC current (350 nA), LEA subsystem independence, capacitive-touch I/O support on all pins, and UART/I²C bootloader compatibility.
Technical Context
The MSP430FR5994IRGZT implements a CPUXV2 core with 16 registers and a dedicated LEA coprocessor that executes signal-processing kernels (e.g., 256-point complex FFT) without CPU intervention-sharing 4KB of RAM while maintaining priority arbitration. Its clock system integrates DCO, LFXT (32 kHz crystal), and HFXT (up to 24 MHz) with automatic failover and low-power VLO.
Peripherals include six 16-bit timers (TA0–TA4, TB0), 32-/16-bit CRC, AES-128/256 encryption, 16-channel analog comparator, and six-channel DMA. All I/O ports support capacitive-touch sensing, edge-selectable wake from LPM, and programmable pullup/pulldown-eliminating external components for proximity and gesture interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | CPUXV2 16-bit RISC core, up to 16 MHz operation-enables deterministic real-time control with minimal power overhead. |
| Nonvolatile Memory | 256 KB FRAM + 0.5 KB information memory-supports instant firmware updates, data logging without wear leveling, and radiation-resistant storage. |
| RAM | 8 KB total RAM (4 KB shared with LEA)-provides buffer space for concurrent signal processing and application execution. |
| Ultra-Low-Power Modes | LPM3.5 draws 350 nA with RTC active (3.7-pF crystal); LPM4.5 draws 45 nA-extends battery life in always-on sensing applications. |
| Analog Peripherals | 12-bit ADC with 20 external inputs, window comparator, internal reference, and sample-and-hold-enables high-accuracy sensor interfacing without external precision references. |
| Digital Interfaces | Four eUSCI_A (UART/IrDA/SPI) and four eUSCI_B (I²C/SPI) modules-supports multi-protocol communication stacks for sensor hubs and gateway nodes. |
| Security | Hardware AES-128/256 coprocessor + IP encapsulation + random number seed-meets basic firmware integrity and secure boot requirements. |
Pinout & Package
VQFN-48 (RGZ) package, 7 mm × 7 mm body, exposed thermal pad recommended to be connected to DVSS. Pin count: 48 terminals, including 40 configurable I/Os, 4 power/ground, 2 crystal inputs (LFXIN/LFXOUT), and 2 high-frequency crystal inputs (HFXIN/HFXOUT).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0–P1.7 | General-purpose I/O with RTCCLK, TA0/TA1, UCB0, UCA0 functions | Supports capacitive touch, timer capture/compare, and I²C/UART-enables compact sensor node design with single-port peripheral routing. |
| P2.0–P2.7 | General-purpose I/O with BSLTX/BSLRX, TB0, UCA0/UCA1, UCB0 functions | Configurable UART bootloader interface (P2.0/P2.1) and timer-based PWM generation-simplifies field firmware updates and motor/solenoid control. |
| P3.0–P3.7 | General-purpose I/O with A12–A15, TB0, SMCLK, COUT functions | Provides address bus capability for external memory expansion and system clock distribution-supports hybrid FRAM + SRAM architectures. |
| P4.0–P4.7 | General-purpose I/O with A8–A11, TB0, UCA2 functions | Enables additional analog input mapping (A8–A11) and secondary UART channel-expands sensor multiplexing and diagnostics capability. |
| PJ.0–PJ.5 | JTAG/SWD debug and LFXT/HFXT crystal interface | Combines boundary-scan test access (TDO/TDI/TMS/TCK) with low- and high-frequency crystal connections-reduces PCB footprint versus discrete debug + timing solutions. |
| DVCC1/DVCC2/DVCC3 | Digital supply voltage pins (1.8–3.6 V) | Three independent digital rails allow localized decoupling and noise isolation between CPU, peripherals, and I/O banks. |
| AVCC1/AVSS1–AVSS3 | Analog supply and ground pins | Dedicated analog power domains minimize coupling noise into ADC/comparator circuits-critical for <12-bit effective resolution stability. |
| RST/NMI | Reset and non-maskable interrupt input | Accepts external reset pulses or NMI events; internal SVS monitors supply-ensures reliable startup and brownout recovery without external supervisor IC. |
Key Features
| Feature | Design Value |
|---|---|
| FRAM endurance | 10¹⁵ write cycles-enables continuous data logging (e.g., every 10 ms for 3 years) without memory degradation. |
| LEA subsystem | Executes 256-point complex FFT in hardware, 40× faster than CPU-only-reduces active-mode time for vibration or ECG analysis by >97%. |
| Capacitive-touch I/O | All 40 GPIOs support touch sensing with no external components-cuts BOM cost and board area in wearables and HMI designs. |
| Low-power RTC domain | LPM3.5 mode draws only 350 nA with calendar alarm-allows decade-scale coin-cell operation in smart metering and environmental monitors. |
| Flexible clock sources | DCO (10 factory-trimmed frequencies), VLO, LFXT, HFXT-permits dynamic clock scaling across operating modes without external oscillators. |
| Hardware security | AES-128/256 coprocessor + memory protection unit (MPU) + IP encapsulation-protects firmware and sensor data against physical and logical attacks. |
Applications
| Grid Infrastructure Monitoring | Factory Automation Sensor Node |
|---|---|
Use Scenario: Real-time current/voltage waveform capture and harmonic analysis at distribution transformers using CT/PT sensors. IC Role / Device Role / Timing Role: MSP430FR5994IRGZT acts as the primary data acquisition and edge-analytics engine, synchronizing ADC sampling to grid frequency via LFXT and executing FFT via LEA. Use Value: Eliminates need for external DSP or FPGA; 256KB FRAM stores 72 hours of waveform snapshots at 10 kS/s, enabling post-fault root-cause analysis without cloud dependency. | Use Scenario: Wireless vibration and temperature monitoring on CNC spindles and robotic joints using MEMS accelerometers and thermistors. IC Role / Device Role / Timing Role: MSP430FR5994IRGZT serves as the local intelligence hub-acquiring sensor data, detecting anomalies via time-domain thresholds, and transmitting alerts via UART-to-LoRa module. Use Value: LPM3.5 RTC wakes the system every 5 seconds for 2 ms of sensing-achieving 10-year battery life on a CR2032 cell while maintaining sub-100-ms response latency. |
| Building Automation Occupancy Sensor | Wearable Fitness Tracker |
Use Scenario: Dual-mode occupancy detection using IR PIR and capacitive-touch wall panels in smart lighting systems. IC Role / Device Role / Timing Role: MSP430FR5994IRGZT runs both PIR signal conditioning (analog comparator) and capacitive-touch scanning (all-GPIO touch engine) in parallel, with independent LPM entry per subsystem. Use Value: Single-chip solution replaces discrete PIR signal chain + separate touch controller-reducing bill-of-materials by 32% and PCB area by 45%. | Use Scenario: Continuous heart-rate monitoring via photoplethysmography (PPG) with motion artifact compensation using accelerometer fusion. IC Role / Device Role / Timing Role: MSP430FR5994IRGZT performs synchronized ADC sampling of red/IR LEDs and 3-axis accelerometer, then applies FIR filtering via LEA to isolate cardiac signal. Use Value: LEA processes 128-sample PPG windows in <150 µs-freeing CPU for BLE advertising and reducing total system power by 38% versus software-only filtering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5964IRGZT | No LEA subsystem; identical FRAM/RAM, ADC, timers, and serial interfaces. | Suitable for applications requiring FRAM endurance and low-power operation but no hardware-accelerated signal processing. | Select when FFT/FIR/matrix operations are handled externally or omitted-reduces cost by ~12% with no layout change required. |
| MSP430FR5994IPN | Same die, 80-pin LQFP package (12 mm × 12 mm) vs. 48-pin VQFN (7 mm × 7 mm); adds 8 extra GPIOs and PJ.6/PJ.7 HFXIN/HFXOUT pins. | Better suited for prototyping, higher I/O count needs, or designs requiring full HFXT support without pin multiplexing constraints. | Choose for development flexibility or production designs needing >40 GPIOs-requires PCB redesign due to larger footprint and different pinout. |
Compared with MSP430FR5964IRGZT, the MSP430FR5994IRGZT adds LEA-driven signal processing at identical power and memory specs; compared with MSP430FR5994IPN, it trades I/O count and HFXT routing simplicity for 43% smaller board area and lower assembly cost.
Availability
MSP430FR5994IRGZT is available at Aetrix Electronics and suitable for grid infrastructure monitoring, factory automation sensor nodes, and wearable fitness trackers requiring stable component supply, long-term lifecycle assurance, and TI-qualified FRAM reliability.
Supply support for MSP430FR5994IRGZT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and personal electronics markets.
The MSP430FR599x product line was engineered for ultra-low-power sensing and measurement applications-prioritizing FRAM-based firmware agility, sub-µA real-time clock operation, and hardware-accelerated signal processing in space- and energy-constrained edge devices.
FAQ
What is the maximum operating frequency of the MSP430FR5994IRGZT?
The MSP430FR5994IRGZT supports a maximum CPU clock frequency of 16 MHz using the integrated DCO or external HFXT crystal. This frequency is fully supported across the entire 1.8 V to 3.6 V supply range and enables deterministic real-time execution of time-critical tasks such as ADC sampling control and PWM generation. The MSP430FR5994IRGZT maintains this speed while consuming only 118 µA/MHz in active mode.
Does the MSP430FR5994IRGZT support hardware-accelerated FFT computation?
Yes, the MSP430FR5994IRGZT includes a dedicated Low-Energy Accelerator (LEA) subsystem that executes 256-point complex FFT in hardware-delivering up to 40× higher performance than the CPU alone. The LEA operates independently of the CPU, uses shared RAM, and requires no DSP expertise; TI provides an optimized DSP library to integrate FFT into firmware. This capability is exclusive to the MSP430FR599x series and is confirmed for the MSP430FR5994IRGZT.
How many I/O pins does the MSP430FR5994IRGZT provide in its VQFN-48 package?
The MSP430FR5994IRGZT in the RGZ (VQFN-48) package provides 40 general-purpose I/O pins across ports P1–P4 and PJ. All 40 pins support capacitive-touch sensing, edge-selectable wake from low-power modes, and programmable pullup/pulldown-eliminating external RC networks. Additional pins include power/ground, crystal connections (LFXIN/LFXOUT/HFXIN/HFXOUT), JTAG debug, and reset.
What are the low-power mode current specifications for the MSP430FR5994IRGZT?
The MSP430FR5994IRGZT achieves 500 nA in LPM3 (standby with VLO), 350 nA in LPM3.5 (standby with RTC clocked by 3.7-pF crystal), and 45 nA in LPM4.5 (shutdown). These values are measured under specified conditions (VCC = 3.0 V, TA = 25°C) and reflect actual silicon characterization-not typical estimates. The LPM3.5 current enables decade-scale operation on coin cells in time-stamped sensor logging applications.
Is the MSP430FR5994IRGZT pin-compatible with other members of the MSP430FR599x family?
No-pin compatibility is package-dependent, not family-wide. The MSP430FR5994IRGZT (VQFN-48) shares the same pinout only with identical RGZ-package variants like MSP430FR5992IRGZT and MSP430FR5964IRGZT. It is not pin-compatible with the 80-pin PN or 64-pin PM variants. Engineers must verify pin mappings per package drawing; for example, TA4 functionality is limited in the RGZ package per device-specific documentation.
MSP430FR5994IRGZT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 40
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR5994IRGZT FAQ
1.How can I place an order for MSP430FR5994IRGZT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR5994IRGZT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR5994IRGZT reliable?
The price and inventory of MSP430FR5994IRGZT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR5994IRGZT is usually 5 days.
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Once your MSP430FR5994IRGZT order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for MSP430FR5994IRGZT?
For technical support, including MSP430FR5994IRGZT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR5994IRGZT requirements.
6.How does Aetrix verify that MSP430FR5994IRGZT is sourced from the original manufacturer or authorized distributors?
All MSP430FR5994IRGZT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR5994IRGZT meets industry standards.
7.What is the process for return or replacement of MSP430FR5994IRGZT?
All MSP430FR5994IRGZT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR5994IRGZT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR5994IRGZT part is unused and in its original packaging.
Return procedure for MSP430FR5994IRGZT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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