My Inquiry
My Account
Texas Instruments MSP430FR5994IZVWR
- Part No.:
- MSP430FR5994IZVWR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 87-VFBGA
- Datasheet:
-
MSP430FR5994IZVWR.pdf
- Description:
- IC MCU 16BIT 256KB FRAM 87NFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,520
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430FR5994IZVWR from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller featuring 256KB FRAM, 8KB RAM, integrated Low-Energy Accelerator (LEA), 12-bit ADC with 20 external channels, and 68 GPIO pins in an 87-ball NFBGA package. It operates from 1.8 V to 3.6 V and delivers 40× faster FFT performance than Arm® Cortex®-M0+ cores-enabling real-time sensor analytics in battery-constrained industrial metering and wearable fitness monitors.
For engineers reviewing the MSP430FR5994IZVWR datasheet, MSP430FR5994IZVWR pinout, MSP430FR5994IZVWR application, or MSP430FR5994IZVWR equivalent, key selection criteria include FRAM endurance (10¹⁵ write cycles), LPM3.5 current (350 nA with RTC), LEA subsystem independence, capacitive-touch I/O support on all pins, and UART/I²C bootloader compatibility.
Technical Context
The MSP430FR5994IZVWR implements a CPUXV2 core with 16 registers and a dedicated LEA coprocessor that executes 256-point complex FFTs using shared 4KB RAM-operating independently of the CPU without interrupting real-time control. Its clock system integrates DCO, LFXT (32 kHz crystal), and HFXT (up to 24 MHz) with automatic failover and low-power VLO.
Peripherals include six 16-bit timers (TA0–TA4, TB0), dual CRC engines (16/32-bit), AES-128/256 encryption, 32-bit hardware multiplier, and six-channel DMA. All I/O ports support edge-selectable wake-from-LPM, programmable pullup/pulldown, and capacitive-touch sensing without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | CPUXV2 16-bit RISC, up to 16 MHz operation-enables deterministic real-time execution with minimal power overhead. |
| Nonvolatile Memory | 256 KB FRAM + 0.5 KB information memory-supports instant firmware updates, data logging without wear leveling, and radiation-resistant storage. |
| RAM | 8 KB total RAM, including 4 KB shared with LEA-allows concurrent signal processing and application code execution. |
| Ultra-Low-Power Modes | LPM3.5 draws 350 nA with RTC active (3.7-pF crystal); LPM4.5 draws 45 nA-extends battery life in always-on sensing nodes. |
| Analog Peripherals | 12-bit ADC with 20 external inputs, window comparator, internal reference, and sample-and-hold-enables high-accuracy sensor interfacing with minimal external circuitry. |
| Digital Interfaces | Four eUSCI_A (UART/IrDA/SPI) and four eUSCI_B (I²C/SPI) modules-supports multi-protocol communication for sensor fusion gateways and smart meters. |
| Security | AES-128/256 coprocessor + IP encapsulation + random number seed-provides hardware-accelerated encryption for secure firmware updates and data transmission. |
Pinout & Package
Package: 87-ball NFBGA (ZVW), 6 mm × 6 mm, 0.5 mm pitch, thermal pad connected to DVSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO | Reset / Non-maskable interrupt / JTAG debug I/O | Active-low reset with NMI capability; enables Spy-Bi-Wire debugging without dedicated JTAG pins. |
| P1.0–P1.7, P2.0–P2.7, etc. (68 total) | Configurable multifunction I/O | All pins support capacitive-touch sensing, edge-selectable LPM wake, and programmable pullup/pulldown-eliminates external RC networks for touch buttons. |
| LFXT pins (PJ.4/LFXIN, PJ.5/LFXOUT) | Low-frequency crystal oscillator interface | Drives 32-kHz crystal for RTC operation in LPM3.5 at 350 nA-critical for calendar-aware energy harvesting systems. |
| HFXIN/HFXOUT (PJ.6/PJ.7) | High-frequency crystal oscillator interface | Supports up to 24-MHz crystals for high-speed ADC sampling or USB-like timing precision in protocol stacks. |
| AVCC1/AVSS1–AVSS3 | Analog power supply and ground | Independent analog domain with dedicated low-noise supplies-ensures <1 LSB INL error in 12-bit ADC measurements. |
Key Features
| Feature | Design Value |
|---|---|
| FRAM memory technology | Enables 125 ns per-word writes and 10¹⁵ write-cycle endurance-ideal for frequent data logging in smart utility meters without flash wear-out management. |
| Low-Energy Accelerator (LEA) | Executes 256-point complex FFT in hardware, independent of CPU-reduces DSP computation time by 40× vs Cortex-M0+, freeing CPU for control tasks. |
| Capacitive-touch I/O | All 68 GPIO pins support touch sensing with no external components-reduces BOM cost and PCB area in wearable UIs and industrial HMI panels. |
| Real-time clock with calendar | RTC runs in LPM3.5 at 350 nA using 3.7-pF crystal-maintains accurate timekeeping during multi-year battery operation in remote monitoring nodes. |
| Hardware AES encryption | 128/256-bit AES coprocessor with DMA support-accelerates secure OTA updates and encrypted sensor data transmission without CPU load. |
Applications
| Smart Utility Metering | Industrial Predictive Maintenance Sensor Node |
|---|---|
Use Scenario: Battery-powered electricity/water/gas meters collecting hourly consumption data and transmitting via NB-IoT or LoRaWAN. IC Role / Device Role / Timing Role: Main controller executing metrology algorithms, managing FRAM-based data logs, and driving secure wireless communication stack. Use Value: 256KB FRAM enables 10+ years of tamper-proof hourly logs; LPM3.5 RTC ensures precise timestamping; AES-256 secures firmware updates over air. | Use Scenario: Vibration/temperature/pressure sensor node mounted on rotating machinery, performing FFT-based spectral analysis locally before sending alerts. IC Role / Device Role / Timing Role: Real-time signal processor using LEA for on-device FFT, low-power scheduler managing sensor sampling intervals, and secure data aggregator. Use Value: LEA accelerates 256-point FFT 40× faster than Cortex-M0+, enabling local anomaly detection without cloud dependency; 45 nA LPM4.5 extends battery life to >5 years. |
| Wearable Fitness Tracker | Building Automation Occupancy Sensor |
Use Scenario: Wrist-worn device measuring heart rate, motion, and skin temperature with continuous 24/7 operation on coin-cell battery. IC Role / Device Role / Timing Role: Central MCU handling optical sensor interface, capacitive-touch UI, BLE connectivity, and power-state orchestration across sleep modes. Use Value: All-GPIO capacitive touch eliminates mechanical buttons; 350 nA RTC maintains accurate activity tracking; FRAM stores biometric history without flash wear degradation. | Use Scenario: Ceiling-mounted passive infrared (PIR) + ambient light sensor controlling HVAC and lighting in office spaces. IC Role / Device Role / Timing Role: Ultra-low-power event processor waking only on motion detection, performing ambient light compensation, and transmitting occupancy status via Zigbee. Use Value: 45 nA LPM4.5 shutdown mode minimizes quiescent draw; 16-channel analog comparator enables fast PIR signal conditioning; FRAM stores calibration offsets across power cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR5964IZVWR | No Low-Energy Accelerator (LEA); identical FRAM, RAM, peripherals, and package. | Lacks hardware-accelerated FFT/matrix math-requires CPU for signal processing, increasing active-mode current and latency. | Select when LEA is unnecessary and cost optimization is prioritized over computational throughput. |
| MSP430FR5994IPN | Same silicon die, but in 80-pin LQFP (12 mm × 12 mm) instead of 87-ball NFBGA (6 mm × 6 mm). | Requires larger PCB footprint and different layout constraints; easier hand-soldering but lower I/O density. | Select for prototyping, manual assembly, or designs where thermal pad soldering is impractical. |
Compared with MSP430FR5994IPN, the MSP430FR5994IZVWR offers 39% smaller board area and superior thermal dissipation via exposed thermal pad, while MSP430FR5964IZVWR removes LEA to reduce cost-making it suitable only for non-DSP workloads despite identical power and memory specs.
Availability
MSP430FR5994IZVWR is available at Aetrix Electronics and suitable for smart utility metering, industrial predictive maintenance sensors, and wearable fitness trackers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for MSP430FR5994IZVWR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The MSP430FR599x product line targets ultra-low-power sensing and measurement applications-designed to maximize battery life while delivering FRAM-based flexibility and hardware-accelerated signal processing for edge intelligence.
FAQ
What is the maximum operating frequency of the MSP430FR5994IZVWR?
The MSP430FR5994IZVWR supports a maximum system clock frequency of 16 MHz via its factory-trimmed DCO or external HFXT crystal. This allows deterministic real-time execution of metrology algorithms and high-speed ADC sampling up to 200 kSPS. The CPUXV2 core maintains full instruction set compatibility and timing predictability at this speed, and the LEA subsystem operates concurrently without affecting CPU clock domain integrity.
Does the MSP430FR5994IZVWR support capacitive-touch sensing on all I/O pins?
Yes, the MSP430FR5994IZVWR supports capacitive-touch sensing on all 68 GPIO pins without external components. This capability is implemented in hardware using the built-in analog comparators and timer-based charge-transfer measurement, eliminating the need for dedicated touch controller ICs or external RC networks. Each pin can be individually configured as a touch electrode, enabling flexible UI design in space-constrained wearables and industrial HMIs.
What is the purpose of the Low-Energy Accelerator (LEA) in the MSP430FR5994IZVWR?
The Low-Energy Accelerator (LEA) in the MSP430FR5994IZVWR is a dedicated hardware subsystem that performs digital signal processing operations-including 256-point complex FFT, FIR filtering, and matrix multiplication-without CPU intervention. It uses 4 KB of shared RAM and executes these functions up to 40× faster than an Arm® Cortex®-M0+ core, reducing active-mode current and enabling real-time analytics in battery-powered edge devices like vibration sensors and portable medical instruments.
How does the FRAM memory in the MSP430FR5994IZVWR differ from traditional flash memory?
The FRAM memory in the MSP430FR5994IZVWR combines the nonvolatility of flash with the speed and endurance of RAM: it supports 125 ns per-word writes, 10¹⁵ write cycles, and zero write-delay-eliminating flash erase blocks and wear-leveling firmware. Unlike flash, FRAM retains data without power, withstands radiation, and requires no high-voltage programming, making it ideal for frequent data logging in smart meters and industrial controllers where reliability and write speed are critical.
What ultra-low-power modes are available on the MSP430FR5994IZVWR, and what are their typical currents?
The MSP430FR5994IZVWR offers multiple ultra-low-power modes: Active mode draws 118 µA/MHz; LPM3 (standby with VLO) draws 500 nA; LPM3.5 (standby with RTC) draws 350 nA using a 3.7-pF crystal; and LPM4.5 (shutdown) draws just 45 nA. These modes are controlled via software-configurable status registers and support fast wake-up times (<1 µs from LPM3), enabling aggressive power gating in battery-operated IoT endpoints without sacrificing responsiveness.
MSP430FR5994IZVWR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 87-VFBGA
- Series:
- MSP430™ FRAM
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 68
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FRAM
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430FR5994IZVWR FAQ
1.How can I place an order for MSP430FR5994IZVWR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430FR5994IZVWR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430FR5994IZVWR reliable?
The price and inventory of MSP430FR5994IZVWR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430FR5994IZVWR is usually 5 days.
3.What payment methods are accepted for MSP430FR5994IZVWR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430FR5994IZVWR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430FR5994IZVWR?
MSP430FR5994IZVWR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430FR5994IZVWR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430FR5994IZVWR?
For technical support, including MSP430FR5994IZVWR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430FR5994IZVWR requirements.
6.How does Aetrix verify that MSP430FR5994IZVWR is sourced from the original manufacturer or authorized distributors?
All MSP430FR5994IZVWR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430FR5994IZVWR meets industry standards.
7.What is the process for return or replacement of MSP430FR5994IZVWR?
All MSP430FR5994IZVWR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430FR5994IZVWR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430FR5994IZVWR part is unused and in its original packaging.
Return procedure for MSP430FR5994IZVWR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430FR5994IZVWR Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
