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Texas Instruments MSP430G2102IRSA16R

Part No.:
MSP430G2102IRSA16R
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
16-VQFN Exposed Pad
Datasheet:
AetrixMSP430G2102IRSA16R.pdf
Description:
IC MCU 16BIT 1KB FLASH 16QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,337

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Product details

Overview

MSP430G2102IRSA16R from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 1 kB Flash, 128 B RAM, one 16-bit Timer_A with three capture/compare registers, Universal Serial Interface (USI) supporting SPI and I²C, and up to 16 capacitive-touch enabled I/O pins. It operates from 1.8 V to 3.6 V and targets battery-powered sensor nodes and simple control systems requiring fast wake-up (<1 µs) and sub-µA standby current.

For engineers reviewing the MSP430G2102IRSA16R datasheet, MSP430G2102IRSA16R pinout, MSP430G2102IRSA16R application, or MSP430G2102IRSA16R equivalent, key selection criteria include its QFN-16 package, absence of integrated ADC10 (distinguishing it from G2x32 variants), Spy-Bi-Wire debug interface, and support for five low-power modes - critical for energy-constrained embedded designs.

Technical Context

The MSP430G2102IRSA16R implements a 16-bit CPU with seven addressing modes and 51 instructions, executing register-to-register operations in one CPU clock cycle. Its basic clock module integrates a digitally controlled oscillator (DCO) calibrated at 1/8/12/16 MHz, internal LF oscillator, and external crystal support (32 kHz), enabling flexible clock sourcing for MCLK, SMCLK, and ACLK.

It features two 8-bit digital I/O ports (P1 and P2), each with individually programmable pullup/pulldown resistors, edge-selectable interrupts, and pin-oscillator capability for capacitive touch. The USI module provides hardware-level SPI and I²C protocol handling without CPU intervention, while the WDT+ module supports both watchdog reset and interval timer interrupt functions.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecture16-bit RISC CPU with 16 general-purpose registers and constant generators for optimized code efficiency
Memory1 kB Flash (512-byte segments), 128 B RAM - sufficient for small firmware images and real-time data buffers
Power ConsumptionActive mode: 220 µA @ 1 MHz, 2.2 V; Standby: 0.5 µA; Off mode (RAM retention): 0.1 µA
Clock SystemDigital Controlled Oscillator (DCO) with four factory-calibrated frequencies (1/8/12/16 MHz); supports 32-kHz crystal and internal LF oscillator
Peripherals1× 16-bit Timer_A (TA0) with three capture/compare registers; USI supporting SPI/I²C; WDT+; Brownout detector
I/O CapabilityUp to 16 capacitive-touch enabled pins across P1 and P2; all pins support individually configurable pullup/pulldown resistors
Debug InterfaceSpy-Bi-Wire (2-wire JTAG) - enables in-system programming and debugging with minimal pin count

Pinout & Package

Package: 16-pin QFN (RSA), 4 mm × 4 mm, 0.65 mm pitch, exposed thermal pad connected to DVSS.

Pin/TerminalCircuit RoleDesign Meaning
DVCC (Pin 1)Supply voltage inputPrimary digital power supply (1.8–3.6 V); requires local decoupling capacitor
P1.0/TA0CLK/ACLK/A0 (Pin 2)Multi-function I/OTimer_A clock input, auxiliary clock output, or analog input A0 - function selected via port control registers
P1.1/TA0.0/A1 (Pin 3)Multi-function I/OTimer_A capture/compare channel 0, or analog input A1 - supports interrupt-on-change and capacitive touch
P1.2/TA0.1/A2 (Pin 4)Multi-function I/OTimer_A capture/compare channel 1, or analog input A2 - usable for PWM generation or touch sensing
P1.3/ADC10CLK/VREF-/VEREF-/A3 (Pin 5)Multi-function I/OADC10 clock output, reference voltage inputs, or analog input A3 - not functional on MSP430G2102 (no ADC10)
P1.4/TA0.2/SMCLK/A4/VREF+/VEREF+/TCK (Pin 6)Multi-function I/OTimer_A capture/compare channel 2, sub-main clock output, JTAG test clock - TCK active only during programming
P1.5/TA0.0/SCLK/A5/TMS (Pin 7)Multi-function I/OTimer_A compare output, USI clock, JTAG test mode select - TMS active only during programming
P1.6/TA0.1/SDO/SCL/A6/TDI/TCLK (Pin 8)Multi-function I/OTimer_A compare output, USI data out / I²C clock, JTAG test data in - SDO/SCL used in normal operation
P1.7/SDI/SDA/A7/TDO/TDI (Pin 9)Multi-function I/OUSI data in / I²C data, JTAG test data out/in - SDI/SDA used in normal operation; TDO/TDI selected by JTAG instruction
P2.0–P2.5 (Pins 10–13, 14, 15)General-purpose I/OEight total I/O pins (P2.0–P2.5 + P2.6–P2.7); P2.0–P2.5 are standard GPIO with pulldown enable (P2REN.x=1 required)
XIN/P2.6/TA0.1 (Pin 16)Oscillator inputCrystal oscillator input or general-purpose I/O; TA0.1 function available only when configured as GPIO
RST/NMI/SBWTDIO (Pin 10)Reset/debug I/OActive-low reset, non-maskable interrupt, or Spy-Bi-Wire data I/O - dual-mode pin shared with debug interface
TEST/SBWTCK (Pin 11)Debug clockJTAG test mode select or Spy-Bi-Wire clock - required for programming and emulation
XOUT/P2.7 (Pin 12)Oscillator outputCrystal oscillator output or general-purpose I/O; must be left unconnected if using internal DCO only
DVSS (Pin 14)Digital groundPrimary digital ground reference; connects to QFN thermal pad for thermal management
AVSS (Pin 13)Analog groundNot connected internally on MSP430G2102 - must be tied to DVSS externally per layout guidelines
AVCC (Pin 15)Analog supplyNot connected internally on MSP430G2102 - must be tied to DVCC externally per layout guidelines

Key Features

FeatureDesign Value
Ultra-low-power operationSub-µA standby (0.5 µA) and off-mode (0.1 µA with RAM retention) extends battery life in coin-cell applications
Fast wake-up from LPM4Less than 1 µs wake-up time enables responsive event-driven operation without sacrificing energy savings
Capacitive-touch I/O capabilityAll 16 I/O pins support pin-oscillator mode for low-cost touch-button interfaces without external components
Spy-Bi-Wire debug interface2-pin (SBWTDIO + SBWTCK) in-circuit debugging and programming reduces PCB footprint and BOM cost
Factory-calibrated DCOFour precision DCO frequencies (1/8/12/16 MHz) eliminate need for external crystal in many timing-critical applications
Five software-selectable low-power modesLPM0–LPM4 provide granular power control - e.g., LPM3 retains ACLK for RTC while disabling CPU and SMCLK

Applications

Smart Sensor NodeIndustrial Control Panel

Use Scenario: Battery-powered temperature/humidity sensor transmitting data wirelessly every 5 minutes.

IC Role / Device Role / Timing Role: Main controller managing sensor readout, low-power sleep scheduling, and SPI communication with RF transceiver.

Use Value: Sub-µA standby current and <1 µs wake-up minimize average system current, enabling >5-year operation on CR2032.

Use Scenario: Front-panel interface with tactile buttons, LED indicators, and serial communication to PLC.

IC Role / Device Role / Timing Role: Local I/O manager handling button debouncing, LED PWM dimming, and UART/I²C host interface.

Use Value: Integrated capacitive-touch I/O eliminates external RC networks; USI handles I²C slave communication without CPU load.

Portable Medical DeviceEnergy Monitoring Module

Use Scenario: Handheld pulse oximeter with OLED display and user controls.

IC Role / Device Role / Timing Role: System coordinator reading analog front-end, driving display interface, and managing button/touch inputs.

Use Value: 16-bit Timer_A generates precise PWM for OLED brightness control; low-voltage operation (1.8 V) supports single-cell Li-ion use.

Use Scenario: DIN-rail mounted electricity meter add-on module measuring AC line parameters via external ADC.

IC Role / Device Role / Timing Role: Communication bridge between isolated sigma-delta ADC and host MCU over SPI, with local calibration storage.

Use Value: 1 kB Flash stores device-specific calibration coefficients; Spy-Bi-Wire enables field firmware updates without disassembly.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSP430G2202IRSA162 kB Flash, 256 B RAM, same peripherals and package - no ADC10, identical pinout and power profileSupports larger firmware (e.g., BLE stack integration or expanded sensor fusion algorithms)Select when firmware size exceeds 1 kB or additional RAM improves real-time buffer handling
MSP430G2112IRSA161 kB Flash, 128 B RAM, adds built-in 10-bit ADC10 with 8-channel autoscan - same package and coreEnables direct analog sensor interfacing (e.g., thermistor, potentiometer) without external ADCSelect when analog signal acquisition is required and board space prohibits external ADC solution

Compared with MSP430G2202IRSA16, the MSP430G2102IRSA16 offers identical low-power performance and peripheral set at lower memory cost; versus MSP430G2112IRSA16, it trades ADC functionality for marginally lower system BOM cost where analog inputs are handled externally.

Availability

MSP430G2102IRSA16R is available at Aetrix Electronics and suitable for smart sensor nodes, industrial HMI panels, portable medical devices, and energy monitoring modules requiring stable component supply, long-term lifecycle support, and consistent parametric performance.

Supply support for MSP430G2102IRSA16R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with decades of expertise in ultra-low-power microcontrollers and precision analog ICs.

The MSP430G2xx family was designed specifically for cost-sensitive, battery-operated applications demanding nanowatt-level power management, rapid wake-up response, and integrated mixed-signal peripherals - targeting sensor, metering, and human-interface markets.

FAQ

Does the MSP430G2102IRSA16R include an integrated analog-to-digital converter (ADC)?

No, the MSP430G2102IRSA16R does not include the ADC10 module. This distinguishes it from the MSP430G2x32 series (e.g., MSP430G2132). The MSP430G2102IRSA16R is part of the G2x02 series, which omits the 10-bit ADC but retains all other core peripherals including Timer_A, USI, and capacitive-touch I/O. External ADCs must be used if analog signal conversion is required.

What is the maximum operating frequency of the MSP430G2102IRSA16R?

The MSP430G2102IRSA16R supports a maximum system clock frequency of 16 MHz via its factory-calibrated DCO. This frequency is achievable across the full 1.8 V–3.6 V supply range and ambient temperature range, as verified in the SLAS723H datasheet. The DCO is stable enough for UART communication at 115.2 kbps and precise PWM generation without external crystal.

Can the MSP430G2102IRSA16R be programmed using standard JTAG tools?

The MSP430G2102IRSA16R uses the Spy-Bi-Wire (SBW) interface - a 2-wire subset of JTAG - for programming and debugging. It is compatible with TI's MSP-FET and compatible third-party debuggers that support SBW. Standard 4-wire JTAG tools are not directly compatible unless they explicitly support SBW mode and the correct pin mapping (SBWTDIO on RST/NMI, SBWTCK on TEST).

What are the recommended decoupling practices for the MSP430G2102IRSA16R QFN package?

TI recommends placing a 100 nF ceramic capacitor between DVCC and DVSS as close as possible to Pins 1 and 14. A second 4.7 µF tantalum or ceramic capacitor should be placed near the power entry point. AVCC and AVSS (Pins 15 and 13) must be externally shorted to DVCC and DVSS respectively, with no separate filtering - the MSP430G2102IRSA16R has no internal analog circuitry requiring isolated supplies.

Is the MSP430G2102IRSA16R pin-compatible with other devices in the MSP430G2xx family?

Yes, the MSP430G2102IRSA16R shares the same 16-pin QFN (RSA) package and pinout with other G2xx devices in that package option, including MSP430G2202IRSA16, MSP430G2112IRSA16, and MSP430G2212IRSA16. Functional differences (e.g., ADC presence, Flash/RAM size) do not affect physical compatibility, enabling drop-in replacement where firmware and system requirements align.

MSP430G2102IRSA16R Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
16-VQFN Exposed Pad
Series:
MSP430G2xx
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430G2102IRSA16R FAQ

1.How can I place an order for MSP430G2102IRSA16R through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430G2102IRSA16R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430G2102IRSA16R reliable?

The price and inventory of MSP430G2102IRSA16R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2102IRSA16R is usually 5 days.

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Once your MSP430G2102IRSA16R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430G2102IRSA16R?

For technical support, including MSP430G2102IRSA16R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2102IRSA16R requirements.

6.How does Aetrix verify that MSP430G2102IRSA16R is sourced from the original manufacturer or authorized distributors?

All MSP430G2102IRSA16R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2102IRSA16R meets industry standards.

7.What is the process for return or replacement of MSP430G2102IRSA16R?

All MSP430G2102IRSA16R units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2102IRSA16R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430G2102IRSA16R part is unused and in its original packaging.

Return procedure for MSP430G2102IRSA16R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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