Texas Instruments MSP430G2102IRSA16R
- Part No.:
- MSP430G2102IRSA16R
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 16-VQFN Exposed Pad
- Datasheet:
-
MSP430G2102IRSA16R.pdf
- Description:
- IC MCU 16BIT 1KB FLASH 16QFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,337
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430G2102IRSA16R from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 1 kB Flash, 128 B RAM, one 16-bit Timer_A with three capture/compare registers, Universal Serial Interface (USI) supporting SPI and I²C, and up to 16 capacitive-touch enabled I/O pins. It operates from 1.8 V to 3.6 V and targets battery-powered sensor nodes and simple control systems requiring fast wake-up (<1 µs) and sub-µA standby current.
For engineers reviewing the MSP430G2102IRSA16R datasheet, MSP430G2102IRSA16R pinout, MSP430G2102IRSA16R application, or MSP430G2102IRSA16R equivalent, key selection criteria include its QFN-16 package, absence of integrated ADC10 (distinguishing it from G2x32 variants), Spy-Bi-Wire debug interface, and support for five low-power modes - critical for energy-constrained embedded designs.
Technical Context
The MSP430G2102IRSA16R implements a 16-bit CPU with seven addressing modes and 51 instructions, executing register-to-register operations in one CPU clock cycle. Its basic clock module integrates a digitally controlled oscillator (DCO) calibrated at 1/8/12/16 MHz, internal LF oscillator, and external crystal support (32 kHz), enabling flexible clock sourcing for MCLK, SMCLK, and ACLK.
It features two 8-bit digital I/O ports (P1 and P2), each with individually programmable pullup/pulldown resistors, edge-selectable interrupts, and pin-oscillator capability for capacitive touch. The USI module provides hardware-level SPI and I²C protocol handling without CPU intervention, while the WDT+ module supports both watchdog reset and interval timer interrupt functions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16 general-purpose registers and constant generators for optimized code efficiency |
| Memory | 1 kB Flash (512-byte segments), 128 B RAM - sufficient for small firmware images and real-time data buffers |
| Power Consumption | Active mode: 220 µA @ 1 MHz, 2.2 V; Standby: 0.5 µA; Off mode (RAM retention): 0.1 µA |
| Clock System | Digital Controlled Oscillator (DCO) with four factory-calibrated frequencies (1/8/12/16 MHz); supports 32-kHz crystal and internal LF oscillator |
| Peripherals | 1× 16-bit Timer_A (TA0) with three capture/compare registers; USI supporting SPI/I²C; WDT+; Brownout detector |
| I/O Capability | Up to 16 capacitive-touch enabled pins across P1 and P2; all pins support individually configurable pullup/pulldown resistors |
| Debug Interface | Spy-Bi-Wire (2-wire JTAG) - enables in-system programming and debugging with minimal pin count |
Pinout & Package
Package: 16-pin QFN (RSA), 4 mm × 4 mm, 0.65 mm pitch, exposed thermal pad connected to DVSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DVCC (Pin 1) | Supply voltage input | Primary digital power supply (1.8–3.6 V); requires local decoupling capacitor |
| P1.0/TA0CLK/ACLK/A0 (Pin 2) | Multi-function I/O | Timer_A clock input, auxiliary clock output, or analog input A0 - function selected via port control registers |
| P1.1/TA0.0/A1 (Pin 3) | Multi-function I/O | Timer_A capture/compare channel 0, or analog input A1 - supports interrupt-on-change and capacitive touch |
| P1.2/TA0.1/A2 (Pin 4) | Multi-function I/O | Timer_A capture/compare channel 1, or analog input A2 - usable for PWM generation or touch sensing |
| P1.3/ADC10CLK/VREF-/VEREF-/A3 (Pin 5) | Multi-function I/O | ADC10 clock output, reference voltage inputs, or analog input A3 - not functional on MSP430G2102 (no ADC10) |
| P1.4/TA0.2/SMCLK/A4/VREF+/VEREF+/TCK (Pin 6) | Multi-function I/O | Timer_A capture/compare channel 2, sub-main clock output, JTAG test clock - TCK active only during programming |
| P1.5/TA0.0/SCLK/A5/TMS (Pin 7) | Multi-function I/O | Timer_A compare output, USI clock, JTAG test mode select - TMS active only during programming |
| P1.6/TA0.1/SDO/SCL/A6/TDI/TCLK (Pin 8) | Multi-function I/O | Timer_A compare output, USI data out / I²C clock, JTAG test data in - SDO/SCL used in normal operation |
| P1.7/SDI/SDA/A7/TDO/TDI (Pin 9) | Multi-function I/O | USI data in / I²C data, JTAG test data out/in - SDI/SDA used in normal operation; TDO/TDI selected by JTAG instruction |
| P2.0–P2.5 (Pins 10–13, 14, 15) | General-purpose I/O | Eight total I/O pins (P2.0–P2.5 + P2.6–P2.7); P2.0–P2.5 are standard GPIO with pulldown enable (P2REN.x=1 required) |
| XIN/P2.6/TA0.1 (Pin 16) | Oscillator input | Crystal oscillator input or general-purpose I/O; TA0.1 function available only when configured as GPIO |
| RST/NMI/SBWTDIO (Pin 10) | Reset/debug I/O | Active-low reset, non-maskable interrupt, or Spy-Bi-Wire data I/O - dual-mode pin shared with debug interface |
| TEST/SBWTCK (Pin 11) | Debug clock | JTAG test mode select or Spy-Bi-Wire clock - required for programming and emulation |
| XOUT/P2.7 (Pin 12) | Oscillator output | Crystal oscillator output or general-purpose I/O; must be left unconnected if using internal DCO only |
| DVSS (Pin 14) | Digital ground | Primary digital ground reference; connects to QFN thermal pad for thermal management |
| AVSS (Pin 13) | Analog ground | Not connected internally on MSP430G2102 - must be tied to DVSS externally per layout guidelines |
| AVCC (Pin 15) | Analog supply | Not connected internally on MSP430G2102 - must be tied to DVCC externally per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power operation | Sub-µA standby (0.5 µA) and off-mode (0.1 µA with RAM retention) extends battery life in coin-cell applications |
| Fast wake-up from LPM4 | Less than 1 µs wake-up time enables responsive event-driven operation without sacrificing energy savings |
| Capacitive-touch I/O capability | All 16 I/O pins support pin-oscillator mode for low-cost touch-button interfaces without external components |
| Spy-Bi-Wire debug interface | 2-pin (SBWTDIO + SBWTCK) in-circuit debugging and programming reduces PCB footprint and BOM cost |
| Factory-calibrated DCO | Four precision DCO frequencies (1/8/12/16 MHz) eliminate need for external crystal in many timing-critical applications |
| Five software-selectable low-power modes | LPM0–LPM4 provide granular power control - e.g., LPM3 retains ACLK for RTC while disabling CPU and SMCLK |
Applications
| Smart Sensor Node | Industrial Control Panel |
|---|---|
Use Scenario: Battery-powered temperature/humidity sensor transmitting data wirelessly every 5 minutes. IC Role / Device Role / Timing Role: Main controller managing sensor readout, low-power sleep scheduling, and SPI communication with RF transceiver. Use Value: Sub-µA standby current and <1 µs wake-up minimize average system current, enabling >5-year operation on CR2032. | Use Scenario: Front-panel interface with tactile buttons, LED indicators, and serial communication to PLC. IC Role / Device Role / Timing Role: Local I/O manager handling button debouncing, LED PWM dimming, and UART/I²C host interface. Use Value: Integrated capacitive-touch I/O eliminates external RC networks; USI handles I²C slave communication without CPU load. |
| Portable Medical Device | Energy Monitoring Module |
Use Scenario: Handheld pulse oximeter with OLED display and user controls. IC Role / Device Role / Timing Role: System coordinator reading analog front-end, driving display interface, and managing button/touch inputs. Use Value: 16-bit Timer_A generates precise PWM for OLED brightness control; low-voltage operation (1.8 V) supports single-cell Li-ion use. | Use Scenario: DIN-rail mounted electricity meter add-on module measuring AC line parameters via external ADC. IC Role / Device Role / Timing Role: Communication bridge between isolated sigma-delta ADC and host MCU over SPI, with local calibration storage. Use Value: 1 kB Flash stores device-specific calibration coefficients; Spy-Bi-Wire enables field firmware updates without disassembly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430G2202IRSA16 | 2 kB Flash, 256 B RAM, same peripherals and package - no ADC10, identical pinout and power profile | Supports larger firmware (e.g., BLE stack integration or expanded sensor fusion algorithms) | Select when firmware size exceeds 1 kB or additional RAM improves real-time buffer handling |
| MSP430G2112IRSA16 | 1 kB Flash, 128 B RAM, adds built-in 10-bit ADC10 with 8-channel autoscan - same package and core | Enables direct analog sensor interfacing (e.g., thermistor, potentiometer) without external ADC | Select when analog signal acquisition is required and board space prohibits external ADC solution |
Compared with MSP430G2202IRSA16, the MSP430G2102IRSA16 offers identical low-power performance and peripheral set at lower memory cost; versus MSP430G2112IRSA16, it trades ADC functionality for marginally lower system BOM cost where analog inputs are handled externally.
Availability
MSP430G2102IRSA16R is available at Aetrix Electronics and suitable for smart sensor nodes, industrial HMI panels, portable medical devices, and energy monitoring modules requiring stable component supply, long-term lifecycle support, and consistent parametric performance.
Supply support for MSP430G2102IRSA16R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with decades of expertise in ultra-low-power microcontrollers and precision analog ICs.
The MSP430G2xx family was designed specifically for cost-sensitive, battery-operated applications demanding nanowatt-level power management, rapid wake-up response, and integrated mixed-signal peripherals - targeting sensor, metering, and human-interface markets.
FAQ
Does the MSP430G2102IRSA16R include an integrated analog-to-digital converter (ADC)?
No, the MSP430G2102IRSA16R does not include the ADC10 module. This distinguishes it from the MSP430G2x32 series (e.g., MSP430G2132). The MSP430G2102IRSA16R is part of the G2x02 series, which omits the 10-bit ADC but retains all other core peripherals including Timer_A, USI, and capacitive-touch I/O. External ADCs must be used if analog signal conversion is required.
What is the maximum operating frequency of the MSP430G2102IRSA16R?
The MSP430G2102IRSA16R supports a maximum system clock frequency of 16 MHz via its factory-calibrated DCO. This frequency is achievable across the full 1.8 V–3.6 V supply range and ambient temperature range, as verified in the SLAS723H datasheet. The DCO is stable enough for UART communication at 115.2 kbps and precise PWM generation without external crystal.
Can the MSP430G2102IRSA16R be programmed using standard JTAG tools?
The MSP430G2102IRSA16R uses the Spy-Bi-Wire (SBW) interface - a 2-wire subset of JTAG - for programming and debugging. It is compatible with TI's MSP-FET and compatible third-party debuggers that support SBW. Standard 4-wire JTAG tools are not directly compatible unless they explicitly support SBW mode and the correct pin mapping (SBWTDIO on RST/NMI, SBWTCK on TEST).
What are the recommended decoupling practices for the MSP430G2102IRSA16R QFN package?
TI recommends placing a 100 nF ceramic capacitor between DVCC and DVSS as close as possible to Pins 1 and 14. A second 4.7 µF tantalum or ceramic capacitor should be placed near the power entry point. AVCC and AVSS (Pins 15 and 13) must be externally shorted to DVCC and DVSS respectively, with no separate filtering - the MSP430G2102IRSA16R has no internal analog circuitry requiring isolated supplies.
Is the MSP430G2102IRSA16R pin-compatible with other devices in the MSP430G2xx family?
Yes, the MSP430G2102IRSA16R shares the same 16-pin QFN (RSA) package and pinout with other G2xx devices in that package option, including MSP430G2202IRSA16, MSP430G2112IRSA16, and MSP430G2212IRSA16. Functional differences (e.g., ADC presence, Flash/RAM size) do not affect physical compatibility, enabling drop-in replacement where firmware and system requirements align.
MSP430G2102IRSA16R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 16-VQFN Exposed Pad
- Series:
- MSP430G2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, SPI, USI
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 10
- Program Memory Size:
- 1KB (1K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430G2102IRSA16R FAQ
1.How can I place an order for MSP430G2102IRSA16R through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430G2102IRSA16R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430G2102IRSA16R reliable?
The price and inventory of MSP430G2102IRSA16R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2102IRSA16R is usually 5 days.
3.What payment methods are accepted for MSP430G2102IRSA16R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430G2102IRSA16R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430G2102IRSA16R?
MSP430G2102IRSA16R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430G2102IRSA16R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430G2102IRSA16R?
For technical support, including MSP430G2102IRSA16R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2102IRSA16R requirements.
6.How does Aetrix verify that MSP430G2102IRSA16R is sourced from the original manufacturer or authorized distributors?
All MSP430G2102IRSA16R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2102IRSA16R meets industry standards.
7.What is the process for return or replacement of MSP430G2102IRSA16R?
All MSP430G2102IRSA16R units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2102IRSA16R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430G2102IRSA16R part is unused and in its original packaging.
Return procedure for MSP430G2102IRSA16R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430G2102IRSA16R Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

