Texas Instruments MSP430G2112IRSA16T
- Part No.:
- MSP430G2112IRSA16T
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 16-VQFN Exposed Pad
- Datasheet:
-
MSP430G2112IRSA16T.pdf
- Description:
- IC MCU 16BIT 1KB FLASH 16QFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430G2112IRSA16T from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller featuring 1 kB flash, 128 B RAM, one 16-bit Timer_A with three capture/compare registers, Universal Serial Interface (USI) for SPI/I²C, on-chip comparator, and eight programmable I/O pins - designed for battery-powered sensor nodes and portable instrumentation.
For engineers reviewing the MSP430G2112IRSA16T datasheet, MSP430G2112IRSA16T pinout, MSP430G2112IRSA16T application, or MSP430G2112IRSA16T equivalent, key selection criteria include supply voltage range (1.8–3.6 V), standby current (0.5 µA), Spy-Bi-Wire debug interface, QFN-16 package footprint, and absence of integrated ADC10 - distinguishing it from G2x52-series variants.
Technical Context
The MSP430G2112IRSA16T implements a 16-bit CPU with seven addressing modes and 51-instruction set, paired with a basic clock system supporting DCO (calibrated up to 16 MHz), LF oscillator, and external crystal input. Its five low-power modes (LPM0–LPM4) enable sub-µA standby operation with wake-up in under 1 µs.
Peripheral integration includes USI supporting master/slave SPI and I²C protocols, Comparator_A+ with eight selectable inputs, and port-level capacitive-touch capability via PinOsc. No ADC10 module is present - confirmed by device family documentation and Table 1 pin function notes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16 general-purpose registers and constant generators for optimized code efficiency |
| Flash / RAM | 1 kB flash memory (512-byte segments) and 128 B RAM - sufficient for compact firmware with interrupt-driven sensor polling |
| Supply Voltage | 1.8 V to 3.6 V - compatible with single-cell Li-ion, alkaline, or coin-cell power sources |
| Standby Current | 0.5 µA in LPM3 mode - enables multi-year operation in energy-constrained wireless sensor endpoints |
| Timer Resource | One 16-bit Timer_A with three capture/compare registers - supports PWM generation, input capture, and interval timing without CPU load |
| Communication | USI module supporting hardware SPI and I²C - eliminates bit-banging overhead and ensures reliable peripheral interfacing |
| Debug Interface | Spy-Bi-Wire (2-wire JTAG) - enables in-system programming and real-time debugging using minimal PCB routing |
Pinout & Package
Package: 16-pin QFN (RSA), 3 mm × 3 mm, 0.5 mm pitch, exposed thermal pad (recommended connection to DVSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 16 | DVCC | Digital supply voltage input - must be decoupled locally with 100 nF ceramic capacitor |
| 14 | DVSS | Digital ground reference - connect directly to PCB ground plane and thermal pad |
| 15 | AVCC | Analog supply - tied internally to DVCC; no separate analog rail required |
| 13 | AVSS | Analog ground - internally connected to DVSS; no isolation needed |
| 10 | TEST/SBWTCK | Spy-Bi-Wire clock input - used for programming and debug; requires pull-down during normal operation |
| 9 | RST/NMI/SBWTDIO | Reset and debug data I/O - dual-function pin enabling both reset assertion and bidirectional SWD communication |
| 11–12, 18–19 | XIN/XOUT/P2.6/P2.7 | Crystal oscillator interface and general I/O - XIN/XOUT support 32.768 kHz crystal; P2.6/P2.7 retain GPIO functionality when crystal unused |
| P1.0–P1.7 | Port 1 I/O | Eight configurable digital I/O pins with individually enabled pullup/pulldown resistors and edge-selectable interrupts |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power operation | Active mode at 220 µA/MHz enables continuous sensing with minimal battery drain |
| Integrated comparator | Comparator_A+ with eight input channels supports battery monitoring and threshold-triggered wake-up |
| Capacitive-touch I/O | PinOsc-enabled I/O allows low-cost touch-button implementation without external components |
| Calibrated DCO | Four factory-trimmed DCO frequencies (1/8/12/16 MHz) eliminate need for external crystal in timing-critical applications |
| No ADC10 module | Reduces die size and cost - targets applications requiring only digital sensing, control, or communication |
Applications
| Smart Sensor Node | Portable Medical Device |
|---|---|
Use Scenario: Battery-powered temperature/humidity sensor transmitting data via I²C to BLE module. IC Role / Device Role / Timing Role: Main controller managing sensor readout, USI-based I²C communication, and low-power sleep scheduling. Use Value: 0.5 µA standby current extends coin-cell life beyond 5 years; Spy-Bi-Wire enables field firmware updates. | Use Scenario: Handheld pulse oximeter with LED driver control and analog front-end supervision. IC Role / Device Role / Timing Role: System supervisor monitoring battery voltage via Comparator_A+, driving LED timing with Timer_A PWM, and coordinating I²C display updates. Use Value: Integrated comparator replaces discrete voltage monitor; 16-bit timer ensures precise LED pulse width control. |
| Industrial Control Panel | Energy-Harvesting IoT Endpoint |
Use Scenario: DIN-rail mounted status indicator with pushbutton inputs and LED feedback. IC Role / Device Role / Timing Role: Input scanner detecting button presses via P1 interrupt, driving LEDs via GPIO, and communicating status over SPI to host PLC. Use Value: Eight programmable I/O pins support direct button/LED interfacing; USI SPI handles high-speed host communication without CPU overhead. | Use Scenario: Solar-powered environmental monitor harvesting microwatts and waking periodically to sample sensors. IC Role / Device Role / Timing Role: Power-aware scheduler triggering wake-up via LPM4 + RTC alarm, executing sensor reads, and returning to 0.1 µA off-mode with RAM retention. Use Value: LPM4 current of 0.1 µA minimizes quiescent loss; calibrated DCO ensures accurate wake-up timing without crystal load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430G2212IRSA16 | 2 kB flash, 256 B RAM, same peripherals - no ADC10, identical pinout and package | Supports larger firmware images and more complex state machines without memory constraints | Select when firmware growth exceeds 1 kB or additional RAM buffers are needed for communication stacks |
| MSP430G2132IRSA16 | Adds 10-bit ADC10 with 8-channel autoscan - otherwise identical memory, clock, and I/O resources | Enables direct analog sensor interfacing (e.g., thermistor, potentiometer) without external ADC | Select when analog signal acquisition is required and board space permits minor firmware adaptation |
Compared with MSP430G2212IRSA16, the MSP430G2112IRSA16T offers lower cost and smaller memory footprint for fixed-function applications; compared with MSP430G2132IRSA16, it trades ADC capability for reduced complexity and marginally lower power in purely digital control roles.
Availability
MSP430G2112IRSA16T is available at Aetrix Electronics and suitable for smart sensor nodes, portable medical devices, industrial control panels, and energy-harvesting IoT endpoints requiring stable component supply across long-lifecycle designs.
Supply support for MSP430G2112IRSA16T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of microcontroller innovation.
The MSP430G2xx family delivers ultra-low-power mixed-signal control for battery-operated and energy-constrained systems - emphasizing rapid wake-up, intelligent peripheral autonomy, and minimal active power consumption.
FAQ
Does MSP430G2112IRSA16T include an integrated analog-to-digital converter (ADC)?
No, the MSP430G2112IRSA16T does not include the ADC10 module. This is explicitly confirmed in TI's SLAS722G datasheet: ADC10 pin functions and circuitry are exclusive to MSP430G2x52 devices. The MSP430G2112IRSA16T belongs to the G2x12 series and provides only Comparator_A+, making it suitable for threshold-based analog monitoring but not for digitizing analog signals. Designers requiring ADC functionality should consider MSP430G2132IRSA16 instead.
What is the maximum operating frequency of MSP430G2112IRSA16T?
The MSP430G2112IRSA16T supports a maximum DCO frequency of 16 MHz, as factory-calibrated in information memory segment A. This frequency is achievable across the full 1.8–3.6 V supply range and ambient temperatures per the datasheet's electrical characteristics. The device does not require an external crystal to reach this speed - the internal digitally controlled oscillator (DCO) stabilizes in less than 1 µs, enabling fast wake-up from low-power modes while maintaining timing precision.
Which debug interface does MSP430G2112IRSA16T support?
The MSP430G2112IRSA16T supports Spy-Bi-Wire (SBW), a two-wire variant of JTAG implemented on pins RST/NMI/SBWTDIO (pin 9) and TEST/SBWTCK (pin 10). This interface enables full in-system programming, real-time debugging, and flash memory erasure without requiring a four-wire JTAG header. TI's MSP-FET and LaunchPad development tools natively support SBW, and the protocol is documented in the MSP430x2xx Family User's Guide (SLAU144).
Can MSP430G2112IRSA16T drive capacitive touch buttons?
Yes, the MSP430G2112IRSA16T supports capacitive touch sensing on all P1.x pins via its integrated PinOsc (pin oscillator) module. Each P1 pin can be individually configured to generate a relaxation oscillator whose frequency shifts with finger proximity. No external components are required - the built-in comparator and timer resources handle measurement autonomously. This capability is documented in the "Digital I/O" section of SLAS722G and validated across the G2x12 family, including the MSP430G2112IRSA16T.
What package type and thermal considerations apply to MSP430G2112IRSA16T?
The MSP430G2112IRSA16T uses a 16-pin QFN package (RSA suffix) measuring 3 mm × 3 mm with 0.5 mm pitch and an exposed thermal pad. TI recommends connecting the pad directly to the PCB ground plane using multiple vias to ensure mechanical stability and optimal thermal dissipation. The pad is electrically tied to DVSS, so grounding it improves both thermal performance and noise immunity - critical for reliable operation in low-power analog-intensive applications.
MSP430G2112IRSA16T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 16-VQFN Exposed Pad
- Series:
- MSP430G2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, SPI, USI
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 10
- Program Memory Size:
- 1KB (1K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430G2112IRSA16T FAQ
1.How can I place an order for MSP430G2112IRSA16T through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430G2112IRSA16T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430G2112IRSA16T reliable?
The price and inventory of MSP430G2112IRSA16T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2112IRSA16T is usually 5 days.
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MSP430G2112IRSA16T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430G2112IRSA16T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430G2112IRSA16T?
For technical support, including MSP430G2112IRSA16T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2112IRSA16T requirements.
6.How does Aetrix verify that MSP430G2112IRSA16T is sourced from the original manufacturer or authorized distributors?
All MSP430G2112IRSA16T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2112IRSA16T meets industry standards.
7.What is the process for return or replacement of MSP430G2112IRSA16T?
All MSP430G2112IRSA16T units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2112IRSA16T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430G2112IRSA16T part is unused and in its original packaging.
Return procedure for MSP430G2112IRSA16T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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