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Texas Instruments MSP430G2132IN20
- Part No.:
- MSP430G2132IN20
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 20-DIP (0.300", 7.62mm)
- Datasheet:
-
MSP430G2132IN20.pdf
- Description:
- IC MCU 16BIT 1KB FLASH 20DIP
- Quantity:
- Payment:
- Shipping:
Inventory:503
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Product details
Overview
MSP430G2132IN20 from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller in 20-pin PDIP packaging, featuring 1 kB Flash, 128 B RAM, a 10-bit 200-ksps ADC with internal reference and autoscan, one 16-bit Timer_A with three capture/compare registers, USI supporting SPI/I²C, and capacitive-touch I/O capability. It targets battery-powered sensor nodes requiring analog acquisition, digital processing, and low-energy wireless interfacing.
For engineers reviewing the MSP430G2132IN20 datasheet, MSP430G2132IN20 pinout, MSP430G2132IN20 application, or MSP430G2132IN20 equivalent, key selection criteria include its 1 kB Flash/128 B RAM memory footprint, single-channel 10-bit ADC (MSP430G2x32-series specific), 20-pin PDIP package with full P1/P2 port access, and Spy-Bi-Wire debug interface compatibility.
Technical Context
The MSP430G2132IN20 implements a 16-bit CPU with seven addressing modes and constant generators for high code efficiency, paired with a digitally controlled oscillator (DCO) enabling sub-1 µs wake-up from LPM4. Its clock system integrates ACLK (LF oscillator or 32-kHz crystal), SMCLK, and MCLK, all configurable via BCSCTL registers.
Peripherals are memory-mapped and accessible via standard instructions: ADC10 uses dedicated control registers (ADC10CTL0/1), Timer_A3 supports capture/compare/PWM with TAIV interrupt vectoring, and USI provides hardware-level SPI/I²C framing without CPU overhead. Brownout detection and programmable pullup/pulldown resistors on all I/O pins support robust embedded sensing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 62.5-ns instruction cycle; enables deterministic real-time control in resource-constrained designs. |
| Flash / RAM | 1 kB Flash / 128 B RAM; sufficient for compact firmware with ADC data buffering and basic communication stacks. |
| ADC Resolution & Speed | 10-bit SAR ADC, 200 ksps max; supports fast sampling of analog sensors (e.g., thermistors, light sensors) with internal VREF. |
| Power Modes | Five low-power modes including LPM4 (0.1 µA RAM retention); extends battery life in intermittent-sensing applications. |
| USI Interface | Universal Serial Interface supporting SPI and I²C protocols; eliminates need for external level-shifting or protocol translation ICs. |
| Operating Voltage | 1.8 V to 3.6 V supply range; compatible with coin-cell (e.g., CR2032) and single Li-ion battery systems. |
| Capacitive Touch I/O | Up to 16 pins support capacitive-touch sensing via integrated PinOsc; enables direct integration of touch buttons without external controllers. |
Pinout & Package
Package: 20-pin Plastic Dual In-line Package (PDIP), 0.3-inch width, through-hole mounting. Compatible with standard DIP sockets and wave-soldering processes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DVCC (Pin 1) | Digital supply voltage | Primary power rail for CPU and digital peripherals; requires local 0.1 µF decoupling to DVSS. |
| P1.0/TA0CLK/ACLK/A0 (Pin 2) | Multi-function I/O | Configurable as timer clock input, ACLK output, or ADC channel 0; enables flexible clock tree routing and analog input sharing. |
| P1.3/ADC10CLK/VREF-/VEREF-/A3 (Pin 5) | ADC control & analog input | Supplies ADC conversion clock and negative reference; also serves as analog input A3 - critical for differential measurement setups. |
| P1.4/TA0.2/SMCLK/A4/VREF+/VEREF+/TCK (Pin 6) | Multi-function I/O | Combines timer compare, system clock output, ADC positive reference, and JTAG test clock - simplifies PCB layout in debug-enabled prototypes. |
| RST/NMI/SBWTDIO (Pin 16) | Reset & debug I/O | Active-low reset input, non-maskable interrupt, and bidirectional Spy-Bi-Wire data line; enables single-wire in-system programming and debugging. |
| DVSS (Pin 20) | Digital ground | Reference return path for digital logic and I/O; must be connected to system ground plane with low-inductance trace. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low standby current | 0.5 µA in LPM3 mode - enables multi-year operation on a single CR2032 battery in periodic-sensing applications. |
| Integrated ADC reference | Internal 1.5 V or 2.5 V selectable VREF+ - eliminates external reference ICs and reduces BOM cost in space-constrained designs. |
| Hardware USI module | Dedicated SPI/I²C controller with automatic clock/data framing - offloads bit-banging from CPU, freeing cycles for sensor fusion or encryption. |
| Capacitive-touch I/O | On-chip PinOsc circuitry per I/O pin - supports self-capacitance touch detection without external RC networks or dedicated touch ICs. |
| Spy-Bi-Wire debug | Two-pin (SBWTDIO/SBWTCK) in-circuit emulation - enables full debug visibility and flash programming using TI's MSP-FET or low-cost open-source tools. |
Applications
| Smart Sensor Node | Industrial Control Panel |
|---|---|
Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and ambient light at 10-minute intervals, transmitting data via UART-to-LoRa module. IC Role / Device Role / Timing Role: Central MCU executing sensor polling, ADC conversion, data preprocessing, and serial packet formatting; uses LPM3 between samples and sub-1 µs wake-up for event-driven response. Use Value: 128 B RAM buffers raw ADC results; 10-bit resolution captures 0.1°C thermal changes; ultra-low 0.5 µA standby extends 220 mAh CR2032 life beyond 3 years. | Use Scenario: Front-panel interface for HVAC controller with tactile buttons, LED status indicators, and RS-485 Modbus communication. IC Role / Device Role / Timing Role: Local I/O manager handling button debouncing, LED PWM dimming, and Modbus RTU framing via USI in SPI mode driving isolated transceiver. Use Value: Capacitive-touch I/O detects finger press without mechanical wear; USI handles SPI clock/data timing autonomously; 20-pin PDIP simplifies hand-soldered prototype assembly. |
| Portable Medical Device | Energy Harvesting System |
Use Scenario: Wearable pulse oximeter using photodiode array, driving red/IR LEDs, and computing SpO₂ via analog front-end conditioning. IC Role / Device Role / Timing Role: Signal acquisition controller synchronizing LED drive timing, ADC sampling windows, and digital filtering; leverages ADC autoscan across multiple channels. Use Value: 200 ksps ADC captures transient photoplethysmogram waveforms; internal VREF ensures stable gain across battery discharge; 1.8 V minimum operation supports buck-boost energy harvesting outputs. | Use Scenario: Solar-powered soil moisture sensor node using supercapacitor storage, waking hourly to measure capacitance-based probe and transmit via NB-IoT. IC Role / Device Role / Timing Role: Power-aware system orchestrator managing energy harvesting state machine, ADC-triggered wake-up, and low-power transmission sequencing. Use Value: 0.1 µA LPM4 mode preserves RAM state during capacitor recharge; brownout detector prevents erratic behavior during voltage sag; 20-pin PDIP allows direct breadboard evaluation of harvester-MCU coupling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430G2232IN20 | 2 kB Flash, 256 B RAM, same ADC/peripherals; higher memory headroom for larger firmware or buffer requirements. | Preferred where firmware includes USB CDC, BLE stack stubs, or extended calibration tables. | Select when future firmware growth or dual-sensor data logging necessitates >1 kB code space. |
| MSP430G2102IN20 | No ADC10 module; identical core, memory, and I/O but lacks analog acquisition capability. | Suitable for pure digital control tasks (e.g., LED sequencer, relay driver) without analog sensing. | Choose only if ADC functionality is unnecessary - avoids paying for unused silicon features. |
Compared with MSP430G2232IN20, the MSP430G2132IN20 trades memory capacity for lower cost and smaller die size while retaining identical ADC performance and low-power behavior; versus MSP430G2102IN20, it adds essential analog signal acquisition capability at minimal power penalty.
Availability
MSP430G2132IN20 is available at Aetrix Electronics and suitable for smart sensor nodes, industrial HMI panels, and portable medical devices requiring stable component supply, long-term manufacturability, and TI's industry-standard MSP430 toolchain support.
Supply support for MSP430G2132IN20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in ultra-low-power design.
The MSP430G2xx family delivers cost-optimized, energy-efficient microcontrollers for battery-operated sensing, metering, and human-interface applications - emphasizing rapid time-to-market with integrated peripherals and mature development ecosystems.
FAQ
What is the maximum ADC sampling rate supported by the MSP430G2132IN20?
The MSP430G2132IN20 supports a maximum ADC10 sampling rate of 200 ksps under optimal conditions (VCC ≥ 2.2 V, ADC10CLK = 5 MHz). This rate is achievable using the internal DCO-calibrated clock source and enables high-fidelity capture of transient analog signals such as audio envelopes or pulse waveforms in portable diagnostic tools.
Does the MSP430G2132IN20 support hardware I²C communication?
Yes, the MSP430G2132IN20 supports hardware I²C via its Universal Serial Interface (USI) module. When configured in I²C mode, USI provides dedicated SCL and SDA signal generation and acknowledgment handling, eliminating software bit-banging overhead and ensuring reliable communication with sensors like temperature or accelerometer ICs.
What debug interface does the MSP430G2132IN20 use, and what pins are required?
The MSP430G2132IN20 uses the Spy-Bi-Wire (SBW) debug interface, requiring only two pins: RST/NMI/SBWTDIO (Pin 16) and TEST/SBWTCK (Pin 17). This two-wire interface supports full in-system programming, breakpoint debugging, and real-time register inspection using TI's MSP-FET or compatible open-source tools.
Can the MSP430G2132IN20 operate from a single 1.8 V supply?
Yes, the MSP430G2132IN20 is fully specified to operate across 1.8 V to 3.6 V, including stable execution, ADC conversion, and USI communication at 1.8 V. At this minimum voltage, the DCO remains functional up to 1 MHz, and LPM4 current stays at 0.1 µA - making it ideal for energy-harvesting or coin-cell-powered systems.
How many capacitive-touch enabled I/O pins does the MSP430G2132IN20 support?
The MSP430G2132IN20 supports up to 16 capacitive-touch enabled I/O pins using its integrated PinOsc circuitry. All P1.x and P2.x pins (except RST/NMI and TEST) can be individually configured for self-capacitance sensing, enabling robust touch-button interfaces without external components - confirmed in the MSP430G2x32 series functional description.
MSP430G2132IN20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 20-DIP (0.300", 7.62mm)
- Series:
- MSP430G2xx
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, SPI, USI
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 1KB (1K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
MSP430G2132IN20 FAQ
1.How can I place an order for MSP430G2132IN20 through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430G2132IN20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430G2132IN20 reliable?
The price and inventory of MSP430G2132IN20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2132IN20 is usually 5 days.
3.What payment methods are accepted for MSP430G2132IN20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430G2132IN20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430G2132IN20?
MSP430G2132IN20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430G2132IN20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430G2132IN20?
For technical support, including MSP430G2132IN20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2132IN20 requirements.
6.How does Aetrix verify that MSP430G2132IN20 is sourced from the original manufacturer or authorized distributors?
All MSP430G2132IN20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2132IN20 meets industry standards.
7.What is the process for return or replacement of MSP430G2132IN20?
All MSP430G2132IN20 units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2132IN20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430G2132IN20 part is unused and in its original packaging.
Return procedure for MSP430G2132IN20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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