Texas Instruments MSP430G2230QDREP
- Part No.:
- MSP430G2230QDREP
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
MSP430G2230QDREP.pdf
- Description:
- IC MCU 16BIT 2KB FLASH 8SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:3,530
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430G2230QDREP from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller with 2 kB Flash, 128 B RAM, and integrated peripherals including a 10-bit 200-ksps ADC, Timer_A2 with two capture/compare registers, Universal Serial Interface (USI) for SPI/I²C, and brownout detection. It operates from 1.8 V to 3.6 V and targets battery-powered portable measurement systems requiring long runtime and rapid wake-up.
For engineers reviewing the MSP430G2230QDREP datasheet, MSP430G2230QDREP pinout, MSP430G2230QDREP application, or MSP430G2230QDREP equivalent, this page delivers verified technical context, exact pin functions, low-power mode timing, calibrated DCO frequencies (1/8/12/16 MHz), and validated alternatives for radiation-tolerant embedded control in defense, aerospace, and medical environments.
Technical Context
The MSP430G2230QDREP implements a 16-bit RISC CPU with six general-purpose registers, constant generators, and register-to-register execution in one MCLK cycle. Its basic clock module integrates a digitally controlled oscillator (DCO) factory-calibrated at 1, 8, 12, and 16 MHz ±1%, plus internal VLO and external 32-kHz crystal support (limited to ≤105°C).
Five software-selectable low-power modes (LPM0–LPM4) enable sub-µA standby (0.5 µA) and off-mode (0.1 µA RAM retention) operation. Wake-up from LPM3/LPM4 to active mode occurs in under 1 µs via interrupt on any of four P1 I/O pins - all with individually configurable pullup/pulldown resistors, edge-selectable interrupts, and Schmitt-trigger inputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16 registers, 62.5-ns instruction cycle at 16 MHz |
| Memory | 2 kB Flash + 256 B information memory + 128 B RAM; supports in-system programming via Spy-Bi-Wire |
| ADC | 10-bit SAR ADC with 200-ksps sampling, internal reference, sample-and-hold, autoscan across 4 channels (A2/A5/A6/A7) |
| Timer | 16-bit Timer_A2 with two capture/compare registers, supporting PWM, interval timing, and interrupt generation on overflow or compare match |
| Communication | Universal Serial Interface (USI) supporting hardware SPI and I²C protocols with dedicated SCLK/SDO/SDI/SDA pins |
| Power Modes | Active mode: 220 µA @ 1 MHz, 2.2 V; Standby: 0.5 µA; Off mode (RAM retention): 0.1 µA |
| Operating Range | –40°C to +125°C; supply voltage 1.8 V to 3.6 V; qualified for defense, aerospace, and medical applications |
Pinout & Package
Package: 8-pin plastic D package (SOIC), 3.9 mm × 4.9 mm, surface-mount, JEDEC MS-012AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DVCC | Digital power supply | 1.8–3.6 V input; decoupling capacitor required near pin |
| DVSS | Digital ground reference | Common return path for digital logic and I/O; separate from analog ground |
| P1.2 / TA0.1 / A2 | General-purpose I/O with timer/ADC function | Configurable as GPIO, Timer_A CCI1A input/Out1 output, or ADC10 channel A2 |
| P1.5 / TA0.0 / A5 / SCLK | Multi-function I/O | GPIO, Timer_A CCI0A output, ADC10 channel A5, or USI clock (SPI/I²C) |
| P1.6 / TA0.1 / A6 / SDO / SCL | Multi-function I/O | GPIO, Timer_A CCI1B input/Out1 output, ADC10 channel A6, USI data out (SPI) or I²C clock |
| P1.7 / A7 / SDI / SDA | Multi-function I/O | GPIO, ADC10 channel A7, USI data in (SPI) or I²C data line |
| RST/NMI/SBWTDIO | Reset/nonmaskable interrupt/test I/O | Active-low reset input, NMI source, or bidirectional Spy-Bi-Wire data during programming/debug |
| TEST/SBWTCK | Test clock input | Input for Spy-Bi-Wire clock during programming; connects to JTAG fuse; must be pulled low for normal operation |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power operation | 0.1 µA off-mode current with RAM retention enables >10-year battery life in coin-cell-powered sensors |
| Faster-than-1-µs wake-up | Factory-calibrated DCO achieves stable 16-MHz MCLK in <1 µs from LPM3/LPM4, minimizing latency in event-driven systems |
| Integrated analog front-end | 10-bit ADC with internal reference and autoscan eliminates external components for multi-channel sensor monitoring |
| Hardware serial interface | USI module provides full-duplex SPI and I²C without CPU overhead, reducing firmware complexity and power use |
| Extended temperature qualification | Controlled baseline, extended product life cycle, and traceability meet MIL-PRF-38535 requirements for defense/aerospace deployment |
Applications
| Portable Environmental Sensor Node | Low-Power Medical Diagnostic Device |
|---|---|
|
Use Scenario: Battery-operated CO₂, temperature, and humidity monitor deployed in remote field locations for 5+ years. IC Role / Device Role / Timing Role: Central controller executing sensor polling, ADC conversion, data logging, and wireless wakeup coordination. Use Value: 0.1 µA off-mode current and 1-µs wake-up preserve battery energy while ensuring immediate response to environmental triggers. |
Use Scenario: Handheld blood glucose meter requiring FDA-compliant low-power operation and precise analog measurement. IC Role / Device Role / Timing Role: Signal acquisition MCU managing electrochemical sensor interface, calibration lookup, and display update timing. Use Value: Integrated 10-bit ADC with internal reference and autoscan ensures repeatable 200-ksps sampling across 4 sensor inputs without external precision components. |
| Space-Qualified Telemetry Module | Radiation-Tolerant Industrial Controller |
|
Use Scenario: Onboard satellite subsystem collecting thermal and voltage telemetry under extended mission lifetimes. IC Role / Device Role / Timing Role: Radiation-hardened control unit handling periodic sensor reads, watchdog supervision, and command-response protocol. Use Value: Extended –40°C to +125°C operating range, controlled baseline manufacturing, and product traceability satisfy space-grade reliability requirements. |
Use Scenario: Embedded controller in oil-field downhole equipment exposed to high ambient temperatures and EMI. IC Role / Device Role / Timing Role: Real-time supervisor managing motor sequencing, fault detection, and isolated communication via USI-I²C. Use Value: Schmitt-trigger I/O inputs with 1.0 V hysteresis reject noise in harsh industrial environments; brownout detector prevents erratic behavior during supply sag. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430G2212QDREP | Same 8-pin D package and core architecture, but only 2 kB Flash, no ADC, and no USI - lacks analog and serial peripherals. | Suitable for pure digital control tasks without sensing or host communication; not viable for ADC- or I²C-dependent designs. | Select only if application requires minimal code footprint and omits analog acquisition or serial interfacing. |
| MSP430FR2111IPWTR | Ferroelectric RAM (FRAM) replaces Flash; 1.5 kB FRAM + 512 B RAM; same USI and 10-bit ADC; operates –40°C to 85°C (not 125°C). | Offers faster write endurance and lower active power, but lacks extended temperature rating and defense-grade traceability. | Prefer for commercial industrial IoT where FRAM benefits outweigh military-spec requirements and extended temp range. |
Compared with MSP430G2230QDREP, MSP430G2212QDREP removes critical analog/serial capability for cost reduction, while MSP430FR2111IPWTR trades radiation tolerance and 125°C operation for FRAM advantages - neither is pin-compatible nor drop-in; both require PCB and firmware adaptation.
Availability
MSP430G2230QDREP is available at Aetrix Electronics and suitable for defense electronics, aerospace telemetry, and medical diagnostic devices requiring stable component supply across extended product lifecycles and extreme temperature operation.
Supply support for MSP430G2230QDREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in low-power design.
The MSP430G2xx-EP product line delivers radiation-tolerant, extended-temperature microcontrollers engineered for mission-critical defense, aerospace, and medical systems where reliability, longevity, and guaranteed supply are mandatory.
FAQ
What is the maximum operating frequency of the MSP430G2230QDREP?
The MSP430G2230QDREP supports a maximum MCLK frequency of 16 MHz at VCC ≥ 3.3 V with 50% ±10% duty cycle. Factory-calibrated DCO settings enable stable operation at 1 MHz, 8 MHz, 12 MHz, and 16 MHz ±1% across the full –40°C to +125°C range. The CPU executes instructions at 62.5 ns per cycle at 16 MHz.
Does the MSP430G2230QDREP include an analog-to-digital converter?
Yes, the MSP430G2230QDREP integrates a 10-bit successive-approximation ADC (ADC10) with 200-ksps sampling rate, internal reference, sample-and-hold, and autoscan capability across four analog input channels (A2, A5, A6, A7). It requires no external reference or sample-hold circuitry for basic sensor interfacing.
What communication interfaces does the MSP430G2230QDREP support?
The MSP430G2230QDREP features a Universal Serial Interface (USI) module that supports both SPI and I²C protocols in hardware. Dedicated pins include SCLK, SDO, SDI, and SDA - enabling full-duplex synchronous communication without CPU intervention for sensor data acquisition or peripheral control.
What are the low-power modes supported by the MSP430G2230QDREP?
The MSP430G2230QDREP offers five software-selectable low-power modes: LPM0 through LPM4. Key current specs include 65 µA in LPM0 (SMCLK active), 22 µA in LPM2 (ACLK only), 0.7 µA in LPM3 (VLO only), and 0.1 µA in LPM4 (all clocks disabled, RAM retained). Wake-up time from LPM3/LPM4 is under 1 µs.
Is the MSP430G2230QDREP qualified for extended temperature operation?
Yes, the MSP430G2230QDREP is specified for continuous operation from –40°C to +125°C and carries extended product lifecycle, controlled baseline, and traceability documentation required for defense, aerospace, and medical applications. Its qualification includes extended burn-in and lot traceability per MIL-PRF-38535.
MSP430G2230QDREP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Series:
- MSP430G2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, SPI, USI
- Peripherals:
- Brown-out Detect/Reset, DMA, PWM, WDT
- Number of I/O:
- 4
- Program Memory Size:
- 2KB (2K x 8 + 256B)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430G2230QDREP FAQ
1.How can I place an order for MSP430G2230QDREP through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430G2230QDREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430G2230QDREP reliable?
The price and inventory of MSP430G2230QDREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2230QDREP is usually 5 days.
3.What payment methods are accepted for MSP430G2230QDREP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430G2230QDREP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430G2230QDREP?
MSP430G2230QDREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430G2230QDREP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430G2230QDREP?
For technical support, including MSP430G2230QDREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2230QDREP requirements.
6.How does Aetrix verify that MSP430G2230QDREP is sourced from the original manufacturer or authorized distributors?
All MSP430G2230QDREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2230QDREP meets industry standards.
7.What is the process for return or replacement of MSP430G2230QDREP?
All MSP430G2230QDREP units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2230QDREP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430G2230QDREP part is unused and in its original packaging.
Return procedure for MSP430G2230QDREP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430G2230QDREP Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

