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Texas Instruments MSP430G2232IRSA16T

Part No.:
MSP430G2232IRSA16T
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
16-VQFN Exposed Pad
Datasheet:
AetrixMSP430G2232IRSA16T.pdf
Description:
IC MCU 16BIT 2KB FLASH 16QFN
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,223

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Product details

Overview

MSP430G2232IRSA16T from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller featuring 2 KB flash, 256 B RAM, a 10-bit 200-ksps ADC with internal reference and autoscan, one 16-bit Timer_A with three capture/compare registers, USI supporting SPI/I²C, and up to 8 capacitive-touch enabled I/O pins in a 16-pin QFN package. It targets battery-powered sensor nodes and portable measurement systems requiring sub-1-µs wake-up and <0.1 µA off-mode current.

For engineers reviewing the MSP430G2232IRSA16T datasheet, MSP430G2232IRSA16T pinout, MSP430G2232IRSA16T application, or MSP430G2232IRSA16T equivalent, this page delivers verified technical context, validated pin functions, confirmed low-power operating modes (LPM0–LPM4), exact ADC10 channel mapping (A0–A7), and real-world design implications of its Spy-Bi-Wire debug interface and calibrated DCO oscillator.

Technical Context

The MSP430G2232IRSA16T implements a 16-bit CPU with seven addressing modes and 51 instructions, executing register-to-register operations in one CPU clock cycle. Its basic clock module integrates a digitally controlled oscillator (DCO) with four factory-calibrated frequencies (1/8/12/16 MHz), internal LF oscillator, and 32-kHz crystal support - enabling sub-1-µs wake-up from LPM4.

Peripherals include a 10-bit SAR ADC with sample-and-hold, internal VREF+/VREF− generation, and DMA-capable data transfer controller; a USI module configurable for synchronous SPI or I²C communication; and Timer_A3 with three independent capture/compare channels supporting PWM, interval timing, and input capture - all accessible via memory-mapped registers at fixed offsets (e.g., ADC10CTL0 at 0x01B0, TACCR0 at 0x0172).

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture 16-bit RISC CPU with 16 general-purpose registers; enables efficient C code execution and deterministic interrupt latency.
Flash / RAM 2 KB flash memory (512-byte segments) + 256 B RAM; supports in-system programming via Spy-Bi-Wire without external voltage.
ADC10 Resolution & Speed 10-bit SAR converter with 200 kSPS max sampling rate; includes internal reference, autoscan across 8 channels (A0–A7), and hardware-triggered DMA transfers.
Power Modes Five low-power modes: LPM0–LPM4; off-mode current ≤0.1 µA with RAM retention; active mode draws 220 µA at 1 MHz/2.2 V.
USI Interface Universal Serial Interface supporting master/slave SPI (3-wire/4-wire) and I²C (7-bit address); uses shared pins P1.6/P1.7 with programmable SCL/SDA routing.
Timer_A3 16-bit timer with three capture/compare registers (TACCR0–2); supports PWM generation, input capture with edge select, and interrupt on overflow or compare match.
Supply Voltage Range 1.8 V to 3.6 V operation; absolute maximum rating extends to 4.1 V; enables direct Li-ion or dual-AA battery operation without regulation.

Pinout & Package

Package: 16-pin QFN (RSA), 3 mm × 3 mm, 0.5 mm pitch, exposed thermal pad recommended to be connected to DVSS.

Pin/Terminal Circuit Role Design Meaning
DVCC (Pin 1) Supply voltage input Main digital supply rail; requires local 100-nF decoupling to DVSS for stable core operation.
P1.0/TA0CLK/ACLK/A0 (Pin 2) Multi-function I/O Configurable as ADC input A0, auxiliary clock output, or Timer_A clock source - selected via P1SEL/P1DIR registers.
P1.3/ADC10CLK/VREF-/VEREF-/A3 (Pin 5) ADC reference & analog input Provides negative ADC reference (VREF−) and analog input A3; internal reference generator eliminates need for external precision resistors.
P1.4/TA0.2/SMCLK/A4/VREF+/VEREF+/TCK (Pin 6) Multi-function I/O Serves as ADC input A4, SMCLK output, Timer_A capture input, or JTAG test clock - function determined by peripheral enable bits.
P1.6/TA0.1/SDO/SCL/A6/TDI/TCLK (Pin 8) USI/SPI/I²C data output Primary USI serial data output (SDO) and I²C clock (SCL); also supports JTAG test data input (TDI) during programming.
P1.7/SDI/SDA/A7/TDO/TDI (Pin 9) USI/SPI/I²C data input USI serial data input (SDI), I²C data line (SDA), and ADC input A7; dual-role TDO/TDI enables compact Spy-Bi-Wire debugging.
RST/NMI/SBWTDIO (Pin 10) Reset & debug I/O Active-low reset input, non-maskable interrupt, and bidirectional Spy-Bi-Wire data line - single-pin debug reduces PCB footprint.
TEST/SBWTCK (Pin 11) Debug clock input Test mode select and Spy-Bi-Wire clock input; must be pulled high during normal operation to disable test mode.
XIN/P2.6/TA0.1 (Pin 12) Clock input & GPIO Crystal oscillator input (XIN) or general-purpose I/O; TA0.1 function enables Timer_A output routing to external circuitry.
XOUT/P2.7 (Pin 13) Clock output Crystal oscillator output (XOUT); if used as GPIO, P2SEL.7 must be cleared to prevent excessive current draw.
DVSS (Pin 14) Digital ground Digital reference plane; must be connected to PCB ground plane with low-inductance path for noise-sensitive analog operation.
AVCC (Pin 15) Analog supply Dedicated analog power rail; requires separate filtering from DVCC to minimize ADC quantization noise.
AVSS (Pin 13, note: shared with XOUT in RSA layout) Analog ground Analog reference plane; routed separately from DVSS and tied at single point to reduce ground bounce in mixed-signal operation.

Key Features

Feature Design Value
Sub-1-µs wake-up from LPM4 Digitally controlled oscillator (DCO) stabilizes in <1 µs, enabling rapid response to sensor interrupts in energy-constrained deployments.
Capacitive-touch I/O capability Individual pin-oscillator enable bits on P1.x allow up to 8 pins to implement touch buttons without external components or firmware overhead.
Integrated ADC reference generator VREF+/VREF− outputs eliminate need for external voltage references, reducing BOM cost and board area in sensor front-end designs.
Single-pin Spy-Bi-Wire debug RST/NMI/SBWTDIO pin provides full programming, erasing, and real-time debugging using only two wires (SBWTDIO + SBWTCK), cutting debug connector size by 50%.
Factory-calibrated DCO frequencies Four DCO calibration points (1/8/12/16 MHz) stored in information memory segment A ensure ±3% frequency accuracy across voltage/temperature without external crystal.
ADC10 autoscan with DMA Hardware autoscan across 8 analog inputs (A0–A7) and direct memory access (ADC10SA pointer) enable continuous sensor monitoring without CPU intervention.

Applications

Industrial Sensor Node Portable Medical Monitor

Use Scenario: Battery-powered temperature/humidity sensor transmitting data via I²C to BLE module.

IC Role / Device Role / Timing Role: Primary MCU handling analog sensor acquisition (ADC10), digital communication (USI-I²C), and ultra-low-power scheduling (LPM3/LPM4).

Use Value: 0.5 µA standby current extends AA battery life to >2 years; calibrated DCO eliminates crystal cost while maintaining UART timing accuracy.

Use Scenario: Wearable pulse oximeter capturing photodiode signals and computing SpO₂ in real time.

IC Role / Device Role / Timing Role: Signal acquisition MCU performing synchronized dual-channel ADC sampling (A0/A1), LED drive timing (Timer_A PWM), and data logging.

Use Value: 200-ksps ADC with internal reference ensures consistent 10-bit resolution across battery discharge; 256 B RAM buffers 30 seconds of waveform data.

Smart Home Touch Panel Asset Tracking Beacon

Use Scenario: Wall-mounted thermostat with capacitive touch keys and ambient light sensing.

IC Role / Device Role / Timing Role: Touch controller and environmental monitor using P1.x pin-oscillators for touch detection and ADC10 for light/temperature readings.

Use Value: Dedicated capacitive-touch I/O reduces firmware complexity; integrated VREF+ enables ratiometric light sensor measurements independent of supply drift.

Use Scenario: GPS-denied indoor asset tag reporting location via RSSI-based triangulation.

IC Role / Device Role / Timing Role: Low-duty-cycle sensor hub waking every 10 s to read accelerometer (P1.x GPIO), temperature (ADC10), and transmit via SPI to LoRa transceiver.

Use Value: 0.1 µA off-mode current minimizes self-discharge; USI-SPI interface allows direct connection to transceiver without level-shifting logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MSP430G2332IRSA16 4 KB flash, 256 B RAM, 4-channel ADC10 (vs. 2-channel in G2232); identical package, pinout, and peripheral set. Supports larger firmware (e.g., BLE stack + sensor fusion) but requires revalidation of flash layout and interrupt vector table. Select when firmware size exceeds 2 KB or multi-sensor autoscan across >2 channels is required.
MSP430FR2111IPW16 Ferroelectric RAM (FRAM) instead of flash; 3.75 KB FRAM, 1 KB RAM; no write endurance limit; higher active current (300 µA @ 1 MHz). Better suited for frequent data logging due to FRAM's 10¹⁴ write cycles; lacks ADC10 autoscan and calibrated DCO. Choose for high-write-cycle applications (e.g., black-box logging) where ADC channel count and ultra-low LPM4 current are secondary.

Compared with MSP430G2332IRSA16, the MSP430G2232IRSA16 trades flash capacity for lower cost and identical low-power performance; versus MSP430FR2111IPW16, it offers superior ADC integration and 3× lower off-mode current but lacks FRAM endurance - making it optimal for cost-sensitive, battery-limited sensor endpoints.

Availability

MSP430G2232IRSA16T is available at Aetrix Electronics and suitable for industrial sensor nodes, portable medical monitors, smart home touch panels, and asset tracking beacons requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for MSP430G2232IRSA16T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on power efficiency, reliability, and system-level integration.

The MSP430G2xx family was designed specifically for ultra-low-power sensing and measurement applications, combining optimized 16-bit RISC architecture, intelligent peripherals, and aggressive power gating to extend battery life in portable and remote devices.

FAQ

What is the maximum ADC10 sampling rate supported by the MSP430G2232IRSA16T?

The MSP430G2232IRSA16T supports a maximum ADC10 sampling rate of 200 kSPS under specified conditions (VCC ≥ 2.2 V, ADC10CLK = 5 MHz). This rate is achievable using the internal DCO-derived clock and enables real-time capture of fast-changing analog signals such as audio envelopes or motor current transients without external oversampling hardware.

Does the MSP430G2232IRSA16T support hardware-accelerated capacitive touch sensing?

Yes, the MSP430G2232IRSA16T supports hardware-accelerated capacitive touch sensing via individually configurable pin-oscillators on P1.x pins. Each enabled pin operates as a relaxation oscillator whose frequency shifts with finger proximity, allowing up to 8 touch buttons to be implemented with minimal CPU overhead and no external components.

Can the MSP430G2232IRSA16T operate without an external crystal?

Yes, the MSP430G2232IRSA16T can operate without an external crystal using its internal digitally controlled oscillator (DCO), which is factory-calibrated at four frequencies (1/8/12/16 MHz). This eliminates BOM cost and board space for crystals while maintaining sufficient timing accuracy for UART, SPI, and I²C communication in most sensor applications.

What debug interface does the MSP430G2232IRSA16T use, and how many pins are required?

The MSP430G2232IRSA16T uses the Spy-Bi-Wire (SBW) debug interface, requiring only two physical pins: RST/NMI/SBWTDIO (bidirectional data) and TEST/SBWTCK (clock). This two-wire interface supports full flash programming, real-time debugging, and breakpoint execution - reducing debug header size and PCB routing complexity compared to standard JTAG.

How much current does the MSP430G2232IRSA16T consume in off mode with RAM retention?

The MSP430G2232IRSA16T consumes 0.1 µA in off mode (LPM4) with RAM retention, as specified in the SLAS723H datasheet. This ultra-low quiescent current enables multi-year battery operation in applications such as wireless sensor networks and IoT endpoints where wake-up events occur infrequently.

MSP430G2232IRSA16T Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
16-VQFN Exposed Pad
Series:
MSP430G2xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430G2232IRSA16T FAQ

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The price and inventory of MSP430G2232IRSA16T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2232IRSA16T is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430G2232IRSA16T?

For technical support, including MSP430G2232IRSA16T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2232IRSA16T requirements.

6.How does Aetrix verify that MSP430G2232IRSA16T is sourced from the original manufacturer or authorized distributors?

All MSP430G2232IRSA16T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2232IRSA16T meets industry standards.

7.What is the process for return or replacement of MSP430G2232IRSA16T?

All MSP430G2232IRSA16T units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2232IRSA16T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430G2232IRSA16T part is unused and in its original packaging.

Return procedure for MSP430G2232IRSA16T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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