Texas Instruments MSP430G2302IN20
- Part No.:
- MSP430G2302IN20
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 20-DIP (0.300", 7.62mm)
- Datasheet:
-
MSP430G2302IN20.pdf
- Description:
- IC MCU 16BIT 4KB FLASH 20DIP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430G2302IN20 from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller in 20-pin PDIP package, featuring 4 KB Flash, 256 B RAM, one 16-bit Timer_A with three capture/compare registers, Universal Serial Interface (USI) for SPI/I²C, and support for up to 16 capacitive-touch I/O pins. It operates from 1.8 V to 3.6 V and targets battery-powered sensor nodes and portable measurement systems.
For engineers reviewing the MSP430G2302IN20 datasheet, MSP430G2302IN20 pinout, MSP430G2302IN20 application, or MSP430G2302IN20 equivalent, key selection criteria include its 4 KB Flash/256 B RAM configuration, USI-based serial interface, 5 low-power modes, Spy-Bi-Wire debug capability, and absence of integrated ADC10 - distinguishing it from MSP430G2x32 variants.
Technical Context
The MSP430G2302IN20 implements a 16-bit CPU with seven addressing modes and 51 instructions, executing register-to-register operations in one CPU clock cycle. Its basic clock module integrates DCO (calibrated at 1/8/12/16 MHz), internal LF oscillator, and external crystal support (32 kHz), enabling sub-1 µs wake-up from LPM4.
It features two 8-bit digital I/O ports (P1 and P2), each with individually configurable pullup/pulldown resistors, edge-selectable interrupts, and pin-oscillator enable for capacitive touch. The USI module supports synchronous SPI and I²C protocols using shared SDO/SDI/SCL/SDA pins on Port 1, while Timer_A3 provides PWM, capture, and interval timing with three CC registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16 general-purpose registers and constant generator; enables high code efficiency and deterministic 62.5-ns instruction cycle at 16 MHz. |
| Memory | 4 KB Flash (main memory) + 256 B RAM; supports in-system programming via Spy-Bi-Wire; no ADC10 module or information memory calibration tags for analog conversion. |
| Power Modes | 1 active mode + 5 software-selectable low-power modes (LPM0–LPM4); standby current 0.5 µA, off-mode (RAM retention) 0.1 µA at 2.2 V. |
| Serial Interface | Universal Serial Interface (USI) supporting hardware SPI and I²C; uses P1.6/P1.7 for SDO/SCL and SDI/SDA respectively; no UART or dedicated I²C controller. |
| Timer Resource | One 16-bit Timer_A (Timer0_A3) with three capture/compare registers (TA0.0/TA0.1/TA0.2); supports PWM generation, input capture, and interval timing with interrupt capability. |
| Supply Range | 1.8 V to 3.6 V operation; supports flash programming within same voltage range; absolute max VCC = 4.1 V. |
| I/O Capability | Up to 16 capacitive-touch enabled I/O pins across P1 and P2; all pins individually configurable for direction, pullup/down, interrupt edge, and pin-oscillator enable. |
Pinout & Package
Package: 20-pin Plastic Dual In-line Package (PDIP), 0.3 inch body width, through-hole mounting. Pin pitch: 0.1 inch (2.54 mm). Compatible with standard DIP sockets and wave-soldering processes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (DVCC) | Power supply | Digital supply voltage input (1.8–3.6 V); must be decoupled near pin with 100 nF ceramic capacitor. |
| 2 (P1.0/TA0CLK/ACLK/A0) | Multi-function I/O | General-purpose I/O; Timer_A clock input (TA0CLK); auxiliary clock output (ACLK); no ADC function (A0 not available on G2x02). |
| 3 (P1.1/TA0.0/A1) | Multi-function I/O | General-purpose I/O; Timer_A capture/compare channel 0 (TA0.0); no ADC input (A1 not available on G2x02). |
| 4 (P1.2/TA0.1/A2) | Multi-function I/O | General-purpose I/O; Timer_A capture/compare channel 1 (TA0.1); no ADC input (A2 not available on G2x02). |
| 5 (P1.3/ADC10CLK/A3/VREF-/VEREF-) | Multi-function I/O | General-purpose I/O; ADC10 clock output (not functional - MSP430G2302 lacks ADC10); no analog reference or input capability. |
| 6 (P1.4/TA0.2/SMCLK/A4/VREF+/VEREF+/TCK) | Multi-function I/O | General-purpose I/O; Timer_A capture/compare channel 2 (TA0.2); SMCLK output; JTAG test clock (TCK); no analog reference or input. |
| 7 (P1.5/TA0.0/SCLK/A5/TMS) | Multi-function I/O | General-purpose I/O; Timer_A compare output (TA0.0); USI clock (SCLK); JTAG test mode select (TMS); no ADC input. |
| 8 (P1.6/TA0.1/SDO/SCL/A6/TDI/TCLK) | Multi-function I/O | General-purpose I/O; Timer_A compare output (TA0.1); USI data output (SDO) or I²C clock (SCL); JTAG test data input (TDI); no ADC input. |
| 9 (P1.7/SDI/SDA/A7/TDO/TDI) | Multi-function I/O | General-purpose I/O; USI data input (SDI) or I²C data (SDA); JTAG test data output (TDO) or TDI (selected by instruction); no ADC input. |
| 10 (RST/NMI/SBWTDIO) | System control | Reset input / non-maskable interrupt / Spy-Bi-Wire test data I/O; active-low reset; requires external pullup resistor for reliable operation. |
| 11 (TEST/SBWTCK) | Debug interface | Test mode select / Spy-Bi-Wire test clock; used during programming and debugging; must be pulled low for normal operation. |
| 12 (XOUT/P2.7) | Oscillator / I/O | Crystal oscillator output or general-purpose I/O (P2.7); if used as input, P2SEL.7 must be cleared to avoid excess current. |
| 13 (XIN/P2.6/TA0.1) | Oscillator / I/O | Crystal oscillator input or general-purpose I/O (P2.6) or Timer_A compare output (TA0.1); supports 32 kHz crystal connection. |
| 14 (DVSS) | Ground | Digital ground reference; must be connected to system ground plane with low-inductance path. |
| 15 (AVCC) | Not connected | No internal analog supply; pin is NC on MSP430G2302IN20 (no ADC10 or analog peripherals). |
| 16 (AVSS) | Not connected | No internal analog ground; pin is NC on MSP430G2302IN20. |
| 17–20 | P2.0–P2.5 | General-purpose digital I/O only; no analog or timer functions; pulldown resistors require explicit enable via P2REN.x = 1. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power operation | 0.1 µA in LPM4 (RAM retention), 0.5 µA in LPM3, enabling multi-year battery life in coin-cell-powered sensor endpoints. |
| Spy-Bi-Wire debug interface | 2-wire JTAG-compatible interface using RST/NMI and TEST pins; eliminates need for external programming voltage or full 4-pin JTAG header. |
| Capacitive-touch I/O | All 16 I/O pins support pin-oscillator enable for self-capacitance measurement; no external components required for basic touch button implementation. |
| Calibrated DCO clock | Four factory-trimmed DCO frequencies (1/8/12/16 MHz) stored in info memory; enables precise timing without external crystal in cost-sensitive applications. |
| Programmable code protection | Security fuse prevents unauthorized readout of Flash contents; once blown, Flash cannot be read or erased without full chip erase. |
| Integrated brownout detector | Monitors DVCC and asserts reset if supply drops below threshold; ensures reliable startup and prevents erratic behavior during power ramp. |
Applications
| Smart Sensor Node | Industrial Control Panel |
|---|---|
|
Use Scenario: Battery-powered temperature/humidity sensor transmitting data via I²C to MCU gateway every 30 seconds. IC Role / Device Role / Timing Role: Primary controller managing sensor polling, USI-based I²C communication, and ultra-low-power sleep scheduling between measurements. Use Value: 0.1 µA LPM4 current extends CR2032 battery life beyond 5 years; calibrated DCO eliminates need for external crystal, reducing BOM cost. |
Use Scenario: Front-panel keypad and LED status indicator for HVAC controller with ESD-hardened pushbuttons. IC Role / Device Role / Timing Role: Dedicated UI processor handling capacitive-touch scan, LED PWM dimming via Timer_A, and local status reporting over SPI. Use Value: All 16 I/O pins support touch sensing; built-in pullup/pulldown resistors eliminate external bias components; 5 µs wake-up ensures responsive button feedback. |
| Portable Medical Monitor | Energy Harvesting Endpoint |
|
Use Scenario: Wearable pulse oximeter using photodiode signal conditioning (external ADC) and Bluetooth LE transmission via host MCU. IC Role / Device Role / Timing Role: Signal preprocessing unit performing real-time filtering, peak detection, and low-power state management before data handoff. Use Value: Sub-1 µs wake-up from LPM4 synchronizes precisely with external ADC sampling triggers; USI supports flexible SPI slave interface to host. |
Use Scenario: Solar-charged soil moisture sensor waking every 15 minutes to measure and transmit via LoRaWAN gateway. IC Role / Device Role / Timing Role: Power-aware coordinator managing energy harvesting charge monitoring, sleep/wake timing, and radio enable sequencing. Use Value: Brownout detector prevents corruption during intermittent solar charging; programmable code protection secures firmware against tampering in unattended field deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430G2402IN20 | 8 KB Flash, 256 B RAM, identical peripheral set (no ADC10), same 20-pin PDIP package. | Supports larger firmware images (e.g., OTA update stack, enhanced security libraries) without changing PCB layout. | Select when future firmware growth or cryptographic acceleration routines require >4 KB code space. |
| MSP430G2302IPW20 | Identical electrical specs and functionality; 20-pin TSSOP package (4.4 mm × 6.5 mm, surface-mount). | Enables higher-density PCB layouts and automated assembly; thermal performance differs due to package construction. | Select for volume production requiring reflow soldering and smaller footprint; verify thermal derating in enclosed enclosures. |
Compared with MSP430G2402IN20, the MSP430G2302IN20 trades Flash capacity for lower cost in stable firmware deployments; compared with MSP430G2302IPW20, it offers through-hole assembly compatibility and simplified prototyping but occupies more board area.
Availability
MSP430G2302IN20 is available at Aetrix Electronics and suitable for smart sensor nodes, industrial HMI panels, portable medical monitors, and energy-harvesting endpoints requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for MSP430G2302IN20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on power efficiency, reliability, and broad design support infrastructure.
The MSP430G2xx family was designed specifically for ultra-low-power applications where extended battery life, rapid wake-up response, and minimal external components are critical - especially in sensor, metering, and portable instrumentation markets.
FAQ
Does MSP430G2302IN20 include an integrated ADC?
No, MSP430G2302IN20 does not include an ADC10 module. It belongs to the MSP430G2x02 series, which omits the 10-bit analog-to-digital converter present in the MSP430G2x32 series (e.g., MSP430G2332). Analog signal acquisition requires external ADC interfacing via USI (SPI/I²C) or GPIO-driven sampling.
What debug interface does MSP430G2302IN20 support?
MSP430G2302IN20 supports Spy-Bi-Wire (SBW), a 2-wire variant of JTAG using pins RST/NMI/SBWTDIO (Pin 10) and TEST/SBWTCK (Pin 11). It enables full flash programming, breakpoint debugging, and real-time register inspection without requiring a 4-pin JTAG header or external VPP voltage.
Can MSP430G2302IN20 drive capacitive touch buttons?
Yes, MSP430G2302IN20 supports capacitive touch sensing on all 16 I/O pins (P1.0–P1.7 and P2.0–P2.7) using its integrated pin-oscillator circuitry. No external RC network is needed - touch detection is implemented in firmware using timing differences between charged/discharged states.
What is the maximum operating frequency of MSP430G2302IN20?
The MSP430G2302IN20 supports up to 16 MHz system clock via its digitally controlled oscillator (DCO), calibrated at four frequencies (1/8/12/16 MHz) and stored in information memory. External crystals up to 32 kHz may also be used for ACLK, but high-frequency operation relies solely on the internal DCO.
Is MSP430G2302IN20 pin-compatible with other 20-pin MSP430G2xx devices?
Yes, MSP430G2302IN20 shares identical pinout and electrical characteristics with other 20-pin PDIP MSP430G2xx devices (e.g., MSP430G2402IN20, MSP430G2332IN20), including power, ground, I/O, and debug pins. However, functional differences (e.g., ADC presence, Flash size) require firmware validation when substituting.
MSP430G2302IN20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 20-DIP (0.300", 7.62mm)
- Series:
- MSP430G2xx
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, SPI, USI
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
MSP430G2302IN20 FAQ
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For technical support, including MSP430G2302IN20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2302IN20 requirements.
6.How does Aetrix verify that MSP430G2302IN20 is sourced from the original manufacturer or authorized distributors?
All MSP430G2302IN20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2302IN20 meets industry standards.
7.What is the process for return or replacement of MSP430G2302IN20?
All MSP430G2302IN20 units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2302IN20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430G2302IN20 part is unused and in its original packaging.
Return procedure for MSP430G2302IN20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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