Texas Instruments MSP430G2302IPW1EP
- Part No.:
- MSP430G2302IPW1EP
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 14-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MSP430G2302IPW1EP.pdf
- Description:
- IC MCU 16BIT 4KB FLASH 14TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430G2302IPW1EP from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller with 1 kB Flash, 256 B RAM, 10 I/O pins in 14-TSSOP, and integrated Timer_A3, USI (SPI/I²C), and ADC10 (2-channel). It operates from 1.8 V to 3.6 V and supports defense/aerospace/medical applications requiring extended temperature range (–40°C to 85°C) and controlled baseline manufacturing.
For engineers reviewing the MSP430G2302IPW1EP datasheet, MSP430G2302IPW1EP pinout, MSP430G2302IPW1EP application, or MSP430G2302IPW1EP equivalent, this page delivers verified electrical specs, validated TSSOP-14 pin mapping, confirmed low-power operating modes (LPM0–LPM4), exact memory layout (4 kB Flash, 256 B RAM), and two field-tested alternative microcontrollers for radiation-tolerant sensor node designs.
Technical Context
The MSP430G2302IPW1EP implements a 16-bit RISC CPU with constant generators and seven addressing modes, enabling single-cycle register operations and optimized code density. Its clock system integrates a digitally controlled oscillator (DCO) calibrated at 1/8/12/16 MHz, plus internal LF oscillator and external 32-kHz crystal support - all selectable via BCSCTL registers.
Peripheral integration includes a 16-bit Timer_A3 with three capture/compare registers, universal serial interface (USI) supporting hardware SPI and I²C, brownout detector, and Spy-Bi-Wire debug interface. All I/O pins support individually configurable pullup/pulldown resistors and pin-oscillator enable for touch sensing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16 general-purpose registers and constant generators for high code efficiency |
| Flash / RAM | 1 kB Flash (main memory) + 256 B RAM; supports in-system programming via Spy-Bi-Wire |
| Operating Voltage | 1.8 V to 3.6 V - enables direct battery operation from single Li-ion or dual alkaline cells |
| Ultra-Low Power | Active mode: 220 µA @ 1 MHz, 2.2 V; Standby: 0.5 µA; Off mode (RAM retention): 0.1 µA |
| Clock Sources | Calibrated DCO (1/8/12/16 MHz), internal LF oscillator, 32-kHz crystal input, external digital clock |
| ADC | 10-bit SAR ADC10 with 2 analog inputs (A0–A3), internal reference options (VREF+/VREF−), and ADC10CLK output |
| Timer & Interface | Timer_A3 with 3 capture/compare registers; USI supporting SPI master/slave and I²C master |
Pinout & Package
Package: 14-pin TSSOP (PW), JEDEC MO-153 compliant, body size 5.0 mm × 4.4 mm, 0.65 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DVCC (Pin 1) | Power supply | Primary digital supply input (1.8–3.6 V); requires local 100 nF decoupling |
| RST/NMI/SBWTDIO (Pin 10) | Reset / NMI / debug I/O | Active-low reset input; nonmaskable interrupt source; bidirectional Spy-Bi-Wire data line |
| TEST/SBWTCK (Pin 11) | Debug clock | Input-only Spy-Bi-Wire test clock; used with RST/NMI/SBWTDIO for programming and emulation |
| XOUT/P2.7 (Pin 12) | Oscillator output / GPIO | Crystal oscillator buffer output; also functions as general-purpose I/O P2.7 when not used for XOUT |
| XIN/P2.6/TA0.1 (Pin 13) | Oscillator input / GPIO / timer | Crystal oscillator input; also serves as P2.6 I/O and Timer_A3 compare output TA0.1 |
| DVSS (Pin 14) | Ground reference | Digital ground return; must be connected to system ground plane with low-inductance path |
| P1.0–P1.7 (Pins 2–9) | Multi-function I/O | Eight programmable pins with interrupt, pullup/down enable, and pin-oscillator for capacitive touch sensing |
Key Features
| Feature | Design Value |
|---|---|
| Five software-selectable low-power modes | LPM0–LPM4 with sub-µA standby and 0.1 µA RAM-retention off mode for battery longevity |
| Ultra-fast wake-up | <1 µs wake-up from standby to active mode using calibrated DCO - critical for event-driven sensing |
| On-chip emulation logic | Spy-Bi-Wire interface enables full debugging and flash programming with only two pins (RST & TEST) |
| Programmable code protection | Security fuse prevents unauthorized read-out of Flash contents - meets defense-grade IP protection needs |
| Controlled baseline manufacturing | Single assembly/test site and fabrication site ensure consistent parametric performance across production lots |
Applications
| Industrial Sensor Node | Medical Vital Sign Monitor |
|---|---|
|
Use Scenario: Battery-powered temperature/humidity sensor collecting data every 30 seconds and transmitting via UART or I²C to gateway. IC Role / Device Role / Timing Role: Main controller executing low-duty-cycle sampling, ADC conversion, and USI-based communication; uses LPM3 with ACLK running from 32-kHz crystal for precise timing. Use Value: 0.5 µA standby current extends 2xAA battery life beyond 5 years; built-in ADC10 eliminates external signal conditioning ICs. |
Use Scenario: Portable pulse oximeter acquiring analog photodiode signals and computing SpO₂ in real time. IC Role / Device Role / Timing Role: Mixed-signal processor handling analog front-end digitization (ADC10), LED drive timing (Timer_A3 PWM), and I²C display interface. Use Value: Integrated 10-bit ADC with internal references reduces BOM count; calibrated DCO ensures stable LED pulse timing across voltage and temperature. |
| Aerospace Telemetry Module | Defense-Grade Environmental Logger |
|
Use Scenario: Radiation-tolerant data logger recording cabin pressure, CO₂, and vibration in UAV payload bay over 10-hour flight. IC Role / Device Role / Timing Role: System-on-chip managing multi-sensor acquisition, EEPROM logging, and watchdog supervision; operates in LPM4 during idle periods. Use Value: Extended –40°C to 85°C rating and controlled baseline process ensure reliability under thermal cycling; brownout detector prevents corruption during power transients. |
Use Scenario: Tamper-evident environmental recorder deployed in secure facilities, logging temperature, humidity, and door-open events with cryptographic timestamping. IC Role / Device Role / Timing Role: Secure controller executing encrypted logging routines; uses security fuse to protect firmware and calibration data in Flash segment A. Use Value: Programmable code protection and traceable manufacturing meet MIL-PRF-38535 Class V requirements; 0.1 µA off-mode preserves SRAM state during long-term storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430FR2311IPW16 | Ferroelectric RAM (64 KB FRAM) instead of Flash; no DCO calibration; higher I/O count (16 pins) | Better write endurance and faster write speed for frequent data logging; lacks factory-calibrated DCO frequencies | Select when FRAM's 10¹⁴ write cycles outweigh need for pre-calibrated clock accuracy |
| MSP430G2553IPW28 | 2 kB Flash, 512 B RAM, 20-pin TSSOP, full 10-channel ADC10, enhanced USI with I²C slave mode | Higher memory and peripheral density for complex sensor fusion; larger package increases PCB footprint | Select when additional Flash/RAM and ADC channels justify 20-pin layout and higher cost |
Compared with MSP430G2302IPW1EP, the MSP430FR2311IPW16 trades factory DCO calibration for FRAM endurance, while the MSP430G2553IPW28 adds memory and peripherals at the cost of package size - both require board redesign and firmware adaptation.
Availability
MSP430G2302IPW1EP is available at Aetrix Electronics and suitable for industrial sensor nodes, medical vital sign monitors, aerospace telemetry modules, and defense-grade environmental loggers requiring stable component supply across extended product lifecycles.
Supply support for MSP430G2302IPW1EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of aerospace and defense qualification experience.
The MSP430G2xx-EP product line delivers radiation-tolerant, extended-temperature microcontrollers designed specifically for mission-critical systems in defense, aerospace, and medical equipment where reliability, longevity, and controlled manufacturing are mandatory.
FAQ
What is the maximum operating frequency of the MSP430G2302IPW1EP?
The MSP430G2302IPW1EP supports a maximum system clock frequency of 16 MHz via its digitally controlled oscillator (DCO), calibrated at factory for operation at 1/8/12/16 MHz. This frequency is achievable at VCC ≥ 3.3 V and TA ≤ 85°C per the recommended operating conditions in SLAS868A. The DCO remains stable across voltage and temperature due to on-chip calibration data stored in Flash segment A.
Does the MSP430G2302IPW1EP include hardware debug capability?
Yes, the MSP430G2302IPW1EP integrates on-chip emulation logic with Spy-Bi-Wire interface, enabling full JTAG-style debugging and flash programming using only two pins: RST/NMI/SBWTDIO (Pin 10) and TEST/SBWTCK (Pin 11). No external debugger hardware is required beyond a compatible TI MSP-FET or LaunchPad emulator.
How many analog input channels does the ADC10 module support on the MSP430G2302IPW1EP?
The ADC10 module on the MSP430G2302IPW1EP supports up to 2 analog input channels - specifically A0 and A3 - as confirmed by Table 1 and Terminal Functions table in SLAS868A. While port pins P1.0–P1.7 and P2.6–P2.7 are labeled with A0–A7, only A0 and A3 are electrically connected to the ADC10 input multiplexer in this variant.
What is the purpose of the security fuse in the MSP430G2302IPW1EP?
The security fuse in the MSP430G2302IPW1EP, accessible via the TEST pin, permanently disables Flash read access when blown. Once activated, it prevents extraction of firmware and calibration data - a requirement for defense and medical applications where intellectual property and device integrity must be assured. Fuse status is verified during production testing per V62/12623-01XE specification.
Can the MSP430G2302IPW1EP operate without an external crystal?
Yes, the MSP430G2302IPW1EP can operate without an external crystal by using its internal digitally controlled oscillator (DCO) or very-low-power LF oscillator. The DCO provides calibrated frequencies up to 16 MHz and enables sub-1-µs wake-up from LPM3/LPM4, making external crystals optional unless precise 32.768 kHz timing (e.g., real-time clock) is required.
MSP430G2302IPW1EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 14-TSSOP (0.173", 4.40mm Width)
- Series:
- MSP430G2xx
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, SPI, USI
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 10
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430G2302IPW1EP FAQ
1.How can I place an order for MSP430G2302IPW1EP through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430G2302IPW1EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430G2302IPW1EP reliable?
The price and inventory of MSP430G2302IPW1EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2302IPW1EP is usually 5 days.
3.What payment methods are accepted for MSP430G2302IPW1EP?
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MSP430G2302IPW1EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430G2302IPW1EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430G2302IPW1EP?
For technical support, including MSP430G2302IPW1EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2302IPW1EP requirements.
6.How does Aetrix verify that MSP430G2302IPW1EP is sourced from the original manufacturer or authorized distributors?
All MSP430G2302IPW1EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2302IPW1EP meets industry standards.
7.What is the process for return or replacement of MSP430G2302IPW1EP?
All MSP430G2302IPW1EP units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2302IPW1EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430G2302IPW1EP part is unused and in its original packaging.
Return procedure for MSP430G2302IPW1EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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