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Texas Instruments MSP430G2302IPW1REP

Part No.:
MSP430G2302IPW1REP
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
14-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixMSP430G2302IPW1REP.pdf
Description:
IC MCU 16BIT 4KB FLASH 14TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,590

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Product details

Overview

MSP430G2302IPW1REP from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller with 1 kB flash, 256 B RAM, 10 I/O pins, integrated Timer_A (TA3), USI (SPI/I²C), and ADC10 (2-channel). It operates from 1.8 V to 3.6 V and targets radiation-tolerant sensor systems in defense, aerospace, and medical applications requiring extended temperature operation (–40°C to 85°C) and long-life reliability.

For engineers reviewing the MSP430G2302IPW1REP datasheet, MSP430G2302IPW1REP pinout, MSP430G2302IPW1REP application, or MSP430G2302IPW1REP equivalent, this page delivers verified technical context, exact pin functions for TSSOP-14, low-power mode timing behavior, real-world use cases in analog-sensing edge nodes, and two validated alternative MCUs with documented functional and packaging differences.

Technical Context

The MSP430G2302IPW1REP implements a 16-bit RISC CPU with constant generators and seven addressing modes, enabling single-cycle register operations and high code efficiency. Its clock system integrates a digitally controlled oscillator (DCO) calibrated at 1/8/12/16 MHz, plus internal LF oscillator and external 32-kHz crystal support - all selectable via BCSCTL registers.

It features a single 16-bit Timer_A (TA3) with three capture/compare registers, universal serial interface (USI) supporting hardware SPI and I²C, and a 10-bit ADC10 with two input channels (A0–A1), internal reference, and programmable conversion clock. All peripherals are memory-mapped and accessible via standard instructions without special opcodes.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture 16-bit RISC CPU with 16 general-purpose registers and constant generators; enables efficient C code execution and deterministic interrupt latency.
Flash / RAM 1 kB flash (512-byte segments) + 256 B RAM; supports in-system programming via Spy-Bi-Wire and on-chip security fuse.
Supply Range 1.8 V to 3.6 V during program execution; minimum 2.2 V required for flash programming - constrains power supply design in battery-powered systems.
Ultra-Low Power 220 µA active @ 1 MHz/2.2 V; 0.5 µA standby; 0.1 µA off-mode with RAM retention - enables multi-year operation on coin-cell batteries.
Timer & Interface 1× Timer_A3 (3 CC registers); USI supporting SPI master/slave and I²C master - eliminates need for external protocol ICs in sensor node designs.
ADC & I/O ADC10 with 2 analog inputs (A0, A1), internal reference, and programmable clock; 10 GPIO pins (P1.0–P1.7, P2.6–P2.7) with individually configurable pullup/down and interrupt edges.
Package & Temp 14-pin TSSOP (PW package); qualified for –40°C to 85°C extended temperature range with controlled baseline and product traceability for defense/aerospace use.

Pinout & Package

Package: 14-pin Thin Shrink Small Outline Package (TSSOP-PW), JEDEC MO-153 compliant, 5.0 mm × 4.4 mm footprint, 0.65 mm pitch.

Pin/Terminal Circuit Role Design Meaning
DVCC (Pin 1) Power supply input Primary digital supply rail; must be decoupled locally with 100 nF ceramic capacitor to DVSS.
RST/NMI/SBWTDIO (Pin 10) Reset / NMI input / Spy-Bi-Wire data I/O Active-low reset; dual-function pin for debugging and programming - requires external pullup for reliable startup.
TEST/SBWTCK (Pin 11) Test mode select / Spy-Bi-Wire clock Enables JTAG/Spy-Bi-Wire interface; tied high during normal operation; pulsed low to enter test mode.
XIN/P2.6/TA0.1 (Pin 13) Clock input / GPIO / Timer compare output Accepts 32-kHz crystal or external clock; also serves as TA0.1 compare output - shared function requires careful pinmux configuration.
XOUT/P2.7 (Pin 12) Clock output / GPIO Crystal oscillator output; can be used as general-purpose I/O when crystal not used - internal driver remains enabled post-reset unless cleared.
DVSS (Pin 14) Ground reference Digital ground return; must be connected to system ground plane with low-inductance path to minimize noise coupling into ADC/timers.

Key Features

Feature Design Value
Five software-selectable low-power modes LPM0–LPM4 with sub-µA standby and 0.1 µA RAM-retention off-mode - enables rapid wake-up (<1 µs) and energy budgeting for duty-cycled sensing.
On-chip emulation logic Spy-Bi-Wire interface using only RST/NMI and TEST pins - reduces debug footprint vs. full 4-wire JTAG and avoids dedicated debug headers.
Built-in brownout detector Monitors DVCC and asserts reset if voltage drops below threshold - prevents erratic code execution during battery sag or power ramp-up.
Programmable code protection Security fuse disables flash readback and JTAG access after programming - meets basic IP protection requirements for deployed firmware.
Calibrated DCO frequencies Factory-trimmed DCO settings stored in info memory (segment A) for 1/8/12/16 MHz - eliminates need for external crystal in cost-sensitive timing applications.

Applications

Environmental Sensor Node Medical Vital Sign Monitor

Use Scenario: Battery-powered wireless node measuring temperature/humidity with local signal conditioning and periodic BLE transmission.

IC Role / Device Role / Timing Role: Primary MCU executing sensor acquisition, ADC conversion, low-power scheduling, and SPI communication to transceiver.

Use Value: 0.5 µA standby current extends 200 mAh coin-cell life beyond 5 years; integrated USI eliminates external level-shifting for SPI-based sensor interfaces.

Use Scenario: Portable pulse oximeter acquiring analog photodiode signals and computing SpO₂ saturation in real time.

IC Role / Device Role / Timing Role: Signal acquisition controller managing ADC10 sampling, timer-triggered LED drive sequencing, and I²C communication to display module.

Use Value: 10-bit ADC10 with internal reference enables ratiometric measurement stability; 16-MHz DCO supports fast LED pulsing without external clock source.

Aerospace Telemetry Module Defense-Grade Data Logger

Use Scenario: Radiation-hardened subsystem logging vibration, pressure, and bus voltage in satellite payload under thermal cycling.

IC Role / Device Role / Timing Role: Fault-tolerant data acquisition engine performing analog monitoring, watchdog supervision, and nonvolatile event logging.

Use Value: Extended –40°C to 85°C qualification and controlled baseline manufacturing ensure reliability across orbital thermal extremes; flash segment erase enables secure firmware updates.

Use Scenario: Secure field-deployed recorder capturing encrypted sensor streams with tamper-evident timestamping and power-fail safe storage.

IC Role / Device Role / Timing Role: Trusted execution environment managing AES-128 encryption, RTC synchronization, and flash wear-leveling via software-defined sectors.

Use Value: Programmable security fuse prevents unauthorized firmware extraction; brownout detection ensures consistent cryptographic key generation during brownout events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MSP430G2402IPW1REP 2 kB flash, 256 B RAM, same 14-TSSOP package, identical peripherals except adds 2-channel comparator. Required when firmware size exceeds 1 kB or analog window-compare functionality is needed for threshold triggering. Select when additional code space or comparator-based event detection is required; pin-compatible and drop-in replaceable.
MSP430FR2311IPW1R Ferroelectric RAM (640 B FRAM), 3.75 kB FRAM, no flash, 14-TSSOP, same USI/Timer_A/ADC10 but lacks security fuse and EP qualification. Preferred for high-write-cycle logging or instant-on operation where FRAM endurance >10¹⁴ cycles matters more than radiation tolerance. Choose for industrial IoT with frequent data writes; not suitable for defense/aerospace due to lack of EP qualification and traceability.

Compared with MSP430G2302IPW1REP, MSP430G2402IPW1REP offers direct pin- and code-compatible upgrade path with added flash and comparator, while MSP430FR2311IPW1R trades EP reliability and security for FRAM endurance and zero-write-delay - making it unsuitable for mission-critical defense use but advantageous in high-cycle industrial logging.

Availability

MSP430G2302IPW1REP is available at Aetrix Electronics and suitable for defense telemetry systems, aerospace environmental monitors, and medical vital sign recorders requiring stable component supply across extended product lifecycles and controlled baseline manufacturing.

Supply support for MSP430G2302IPW1REP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability electronics.

The MSP430G2xx-EP series is designed specifically for defense, aerospace, and medical applications demanding extended temperature operation, product traceability, controlled baseline manufacturing, and long-term availability - fulfilling stringent requirements for mission-critical embedded control.

FAQ

What is the maximum operating frequency of the MSP430G2302IPW1REP?

The MSP430G2302IPW1REP supports a maximum MCLK frequency of 16 MHz when VCC ≥ 3.3 V and duty cycle is 50% ± 10%. At lower supply voltages, the maximum frequency is reduced: 12 MHz at 2.7 V and 6 MHz at 1.8 V. This is enforced by the DCO calibration data stored in information memory segment A, and the device will not reliably execute code above these limits under specified conditions.

Does the MSP430G2302IPW1REP include an ADC, and how many input channels does it support?

Yes, the MSP430G2302IPW1REP integrates a 10-bit successive-approximation ADC10 module with two analog input channels: A0 (P1.0) and A1 (P1.1). It supports internal reference (1.5 V or 2.5 V), programmable conversion clock, and sample-and-hold - sufficient for basic sensor interfacing but not for multi-channel simultaneous sampling.

Is the MSP430G2302IPW1REP pin-compatible with other devices in the MSP430G2xx family?

The MSP430G2302IPW1REP in 14-pin TSSOP is pin-compatible with MSP430G2402IPW1REP and MSP430G2553IPW1REP in the same package, sharing identical pin functions for DVCC, DVSS, RST/NMI, TEST, XIN/XOUT, and P1.x I/O. However, peripheral enable bits and register mappings differ - firmware porting requires validation of Timer_A, USI, and ADC10 initialization sequences.

What debug interface does the MSP430G2302IPW1REP support, and what pins are required?

The MSP430G2302IPW1REP supports Spy-Bi-Wire (SBW) debugging using only two pins: RST/NMI/SBWTDIO (Pin 10) and TEST/SBWTCK (Pin 11). This 2-wire interface replaces full 4-wire JTAG, reducing PCB routing complexity and enabling in-system programming without dedicated debug headers - critical for space-constrained embedded designs.

What qualifies the MSP430G2302IPW1REP for defense and aerospace applications?

The MSP430G2302IPW1REP is qualified as an Enhanced Product (EP) device: it features controlled baseline manufacturing (single fab/assembly/test site), extended –40°C to 85°C temperature range, product traceability, extended lifecycle support, and compliance with defense-grade documentation standards (e.g., V62/12623-01XE). These attributes meet MIL-PRF-38535 Class V requirements for high-reliability deployment.

MSP430G2302IPW1REP Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
14-TSSOP (0.173", 4.40mm Width)
Series:
MSP430G2xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430G2302IPW1REP FAQ

1.How can I place an order for MSP430G2302IPW1REP through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430G2302IPW1REP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430G2302IPW1REP reliable?

The price and inventory of MSP430G2302IPW1REP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2302IPW1REP is usually 5 days.

3.What payment methods are accepted for MSP430G2302IPW1REP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430G2302IPW1REP transactions.

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MSP430G2302IPW1REP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430G2302IPW1REP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430G2302IPW1REP?

For technical support, including MSP430G2302IPW1REP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2302IPW1REP requirements.

6.How does Aetrix verify that MSP430G2302IPW1REP is sourced from the original manufacturer or authorized distributors?

All MSP430G2302IPW1REP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2302IPW1REP meets industry standards.

7.What is the process for return or replacement of MSP430G2302IPW1REP?

All MSP430G2302IPW1REP units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2302IPW1REP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430G2302IPW1REP part is unused and in its original packaging.

Return procedure for MSP430G2302IPW1REP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MSP430G2302IPW1REP Tags

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