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Texas Instruments MSP430G2302IRSA16R

Part No.:
MSP430G2302IRSA16R
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
16-VQFN Exposed Pad
Datasheet:
AetrixMSP430G2302IRSA16R.pdf
Description:
IC MCU 16BIT 4KB FLASH 16QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,133

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Product details

Overview

MSP430G2302IRSA16R from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller in 16-pin QFN (RSA) package, featuring 4 KB Flash, 256 B RAM, one 16-bit Timer_A with three capture/compare registers, Universal Serial Interface (USI) for SPI/I²C, and support for up to 16 capacitive-touch I/O pins. It operates from 1.8 V to 3.6 V and targets battery-powered sensor nodes and portable measurement systems.

For engineers reviewing the MSP430G2302IRSA16R datasheet, MSP430G2302IRSA16R pinout, MSP430G2302IRSA16R application, or MSP430G2302IRSA16R equivalent, key selection criteria include its 4 KB Flash size, USI-based serial interface capability, 16-pin QFN footprint, ultra-low standby current (0.5 µA), and absence of integrated ADC10 - distinguishing it from MSP430G2x32 variants.

Technical Context

The MSP430G2302IRSA16R implements a 16-bit CPU with seven addressing modes and 51 instructions, executing register-to-register operations in one CPU clock cycle. Its basic clock module provides ACLK, SMCLK, and MCLK from internal DCO (calibrated at 1/8/12/16 MHz), LF oscillator, or external 32-kHz crystal.

It supports five low-power modes (LPM0–LPM4), enabling sub-1 µs wake-up from standby via interrupt, and integrates Spy-Bi-Wire debug interface with on-chip emulation logic. Port P1 offers eight programmable I/O pins with individually configurable pullup/pulldown resistors and pin-oscillator enable for capacitive touch; Port P2 provides two I/O pins in the RSA16 package.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecture16-bit RISC CPU with 16 general-purpose registers and constant generator; enables efficient code execution and compact firmware for resource-constrained designs.
Flash / RAM4 KB Flash program memory and 256 B RAM; sufficient for moderate firmware complexity with data buffering in low-power sensor applications.
Supply Voltage1.8 V to 3.6 V operation; compatible with single-cell Li-ion, Li-polymer, or dual-AA alkaline battery systems without regulation overhead.
Ultra-Low PowerActive mode: 220 µA at 1 MHz/2.2 V; Standby mode: 0.5 µA; Off mode (RAM retention): 0.1 µA - extends battery life in intermittent-sensing deployments.
Timer & InterfaceOne 16-bit Timer_A with three capture/compare registers; USI supporting hardware SPI and I²C - eliminates bit-banging overhead for sensor communication.
Package16-pin QFN (RSA), 4 mm × 4 mm, 0.65 mm pitch; surface-mount footprint optimized for space-constrained PCB layouts in wearables and IoT endpoints.
Capacitive TouchUp to 16 I/O pins support capacitive-touch sensing via built-in pin-oscillator circuitry; enables direct integration of touch buttons/sliders without external components.

Pinout & Package

Package: 16-pin QFN (RSA), 4 mm × 4 mm, exposed thermal pad (recommended connection to DVSS).

Pin/TerminalCircuit RoleDesign Meaning
DVCC (Pin 1)Power supplyMain digital supply voltage input (1.8–3.6 V); requires local decoupling capacitor near pin.
P1.0/TA0CLK/ACLK/A0 (Pin 2)Multi-function I/OGeneral-purpose I/O; Timer_A clock input; ACLK output; analog input only on MSP430G2x32 - not available on MSP430G2302IRSA16R.
P1.1/TA0.0/A1 (Pin 3)Multi-function I/OGeneral-purpose I/O; Timer_A CCI0A input/Out0 output; analog input A1 unavailable on this variant.
P1.2/TA0.1/A2 (Pin 4)Multi-function I/OGeneral-purpose I/O; Timer_A CCI1A input/Out1 output; analog input A2 unavailable on this variant.
P1.3/ADC10CLK/VREF-/VEREF-/A3 (Pin 5)Multi-function I/OGeneral-purpose I/O; ADC10 clock and reference pins - all ADC10 functions are absent on MSP430G2302IRSA16R per datasheet Table 1 and functional block diagrams.
P1.4/TA0.2/SMCLK/A4/TCK (Pin 6)Multi-function I/OGeneral-purpose I/O; Timer_A CCI2A input/Out2 output; SMCLK output; JTAG TCK input - JTAG disabled by default; Spy-Bi-Wire used instead.
P1.5/TA0.0/SCLK/A5/TMS (Pin 7)Multi-function I/OGeneral-purpose I/O; Timer_A Out0 output; USI clock; JTAG TMS input - Spy-Bi-Wire uses TEST/SBWTCK and RST/NMI/SBWTDIO only.
P1.6/TA0.1/SDO/SCL/A6/TDI/TCLK (Pin 8)Multi-function I/OGeneral-purpose I/O; Timer_A Out1 output; USI SDO (SPI) or SCL (I²C); JTAG TDI/TCLK - USI functionality active; ADC10 A6 not available.
P1.7/SDI/SDA/A7/TDO/TDI (Pin 9)Multi-function I/OGeneral-purpose I/O; USI SDI (SPI) or SDA (I²C); JTAG TDO/TDI - USI fully functional; ADC10 A7 not present on this device.
P2.0 (Pin 10)General-purpose I/ODedicated digital I/O with programmable pullup/pulldown; no analog or timer function; usable for GPIO, LED control, or system status signaling.
P2.1 (Pin 11)General-purpose I/ODedicated digital I/O with programmable pullup/pulldown; supports interrupt-on-edge; suitable for wake-up trigger or button input.
XIN/P2.6/TA0.1 (Pin 12)Oscillator inputCrystal oscillator input or general-purpose I/O; TA0.1 compare output function available; requires external 32-kHz crystal for ACLK if used.
XOUT/P2.7 (Pin 13)Oscillator outputCrystal oscillator output or general-purpose I/O; must be left unconnected if external crystal not used; not usable as GPIO when crystal enabled.
DVSS (Pin 14)GroundDigital ground reference; connects to PCB ground plane; thermal pad (QFN) must also connect to DVSS for thermal and EMI performance.
AVSS (Pin 13, N/C in RSA16)Not connectedNo internal connection in MSP430G2302IRSA16R; pin is NC per Table 2 - must remain unconnected on PCB.
RST/NMI/SBWTDIO (Pin 16)Reset/debug I/OActive-low reset input; non-maskable interrupt source; Spy-Bi-Wire bidirectional data line for programming and debugging.
TEST/SBWTCK (Pin 15)Debug clockTest mode select during fuse programming; Spy-Bi-Wire clock input during debug - required for in-circuit programming.

Key Features

FeatureDesign Value
Ultra-low power consumption0.5 µA standby current enables multi-year battery life in coin-cell-powered remote sensors and wearables.
Integrated capacitive-touch I/OUp to 16 pins support touch sensing via on-chip oscillator - reduces BOM cost and PCB area versus external touch controllers.
Spy-Bi-Wire debug interfaceTwo-wire (RST/SBWTCK) in-system programming and debugging - simplifies test fixture design and field firmware updates.
Hardware USI for SPI/I²CDedicated serial peripheral offloads CPU during sensor data acquisition and transmission - improves real-time responsiveness.
Fast wake-up from LPM4<1 µs wake-up time allows rapid response to external interrupts while maintaining deepest power savings between events.

Applications

Smart Sensor NodePortable Medical Device

Use Scenario: Battery-powered temperature/humidity sensor transmitting data wirelessly every 5 minutes.

IC Role / Device Role / Timing Role: Main system controller managing sensor readout, low-power sleep scheduling, and USI-driven UART or RF transceiver interface.

Use Value: 0.1 µA off-mode current preserves CR2032 battery for >3 years; USI handles SPI comms with sensor ICs without CPU intervention.

Use Scenario: Handheld pulse oximeter requiring low-noise analog front-end timing and touch-button UI.

IC Role / Device Role / Timing Role: System manager coordinating LED drive timing, photodiode signal sampling control, and capacitive touch button scanning.

Use Value: Pin-oscillator touch capability enables bezel-free design; 16-bit Timer_A generates precise LED pulsing intervals independent of CPU load.

Industrial Control PanelEnergy Harvesting Endpoint

Use Scenario: DIN-rail mounted HVAC controller with pushbutton inputs and RS-485 communication.

IC Role / Device Role / Timing Role: Local intelligence unit handling button debouncing, display refresh, and USI-configured RS-485 transceiver control.

Use Value: Programmable pullup/pulldown resistors eliminate external bias components; 4 KB Flash accommodates Modbus RTU stack and calibration tables.

Use Scenario: Solar-powered environmental monitor harvesting microwatts from indoor light.

IC Role / Device Role / Timing Role: Energy-aware scheduler initiating sensor reads only during peak harvest periods using LPM3/LPM4 transitions.

Use Value: Sub-µA standby and fast wake-up maximize usable energy per harvest cycle; internal DCO eliminates need for external timing components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSP430G2232IRSA162 KB Flash, 256 B RAM, same package and peripherals; lacks Timer_A capture capability (only compare mode).Suitable for simpler timing tasks (e.g., LED blinking, basic PWM) but not for edge-triggered event capture like encoder counting.Select when firmware size <2 KB and no input-capture functionality is required - lower cost, identical footprint.
MSP430G2402IRSA168 KB Flash, 256 B RAM, same package; adds USI-compatible UART mode (not present on MSP430G2302IRSA16R).Better suited for host communication protocols requiring UART framing; retains all MSP430G2302IRSA16R features plus enhanced serial flexibility.Choose when future firmware expansion or UART-based diagnostics are anticipated - same pinout, drop-in upgrade path.

Compared with MSP430G2232IRSA16, the MSP430G2302IRSA16R provides double Flash capacity and full Timer_A capture/compare functionality; compared with MSP430G2402IRSA16, it trades UART capability for lower cost and identical power/performance in SPI/I²C-only systems.

Availability

MSP430G2302IRSA16R is available at Aetrix Electronics and suitable for smart sensor nodes, portable medical devices, industrial control panels, and energy harvesting endpoints requiring stable component supply and long-term manufacturability.

Supply support for MSP430G2302IRSA16R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.

The MSP430G2xx family was designed for ultra-low-power embedded applications where battery life, small footprint, and integrated analog/mixed-signal peripherals are critical - exemplified by the MSP430G2302IRSA16R's balance of Flash, I/O, and power efficiency.

FAQ

Does the MSP430G2302IRSA16R include an integrated ADC?

No, the MSP430G2302IRSA16R does not include an ADC10 module. Per TI's SLAS723H datasheet Table 1 and functional block diagrams, ADC10 is exclusive to MSP430G2x32 series devices (e.g., MSP430G2332). The MSP430G2302IRSA16R belongs to the G2x02 series and omits the ADC entirely - external ADC or alternative MCU required for analog sensing.

What debug interface does the MSP430G2302IRSA16R support?

The MSP430G2302IRSA16R supports Spy-Bi-Wire (SBW) debug interface using pins RST/NMI/SBWTDIO (Pin 16) and TEST/SBWTCK (Pin 15). JTAG is not enabled on this device; SBW provides full in-system programming, breakpoint debugging, and memory inspection with only two wires, reducing PCB routing complexity.

Can the MSP430G2302IRSA16R drive capacitive touch buttons?

Yes, the MSP430G2302IRSA16R supports capacitive touch sensing on up to 16 I/O pins using its integrated pin-oscillator circuitry. Each supported pin (P1.0–P1.7, P2.0–P2.5) can be individually configured for touch detection without external components, enabling robust, low-cost human interface design in space-constrained applications.

What is the maximum operating frequency of the MSP430G2302IRSA16R's DCO?

The digitally controlled oscillator (DCO) in the MSP430G2302IRSA16R is factory-calibrated at four frequencies: 1 MHz, 8 MHz, 12 MHz, and 16 MHz. When configured for highest speed, the DCO delivers 16 MHz MCLK - sufficient for real-time sensor processing and USI-based SPI/I²C communication at full peripheral bandwidth.

Is the MSP430G2302IRSA16R pin-compatible with other 16-pin MSP430G2xx devices?

Yes, the MSP430G2302IRSA16R shares the identical 16-pin QFN (RSA) package and pinout with other MSP430G2xx devices in the same package option (e.g., MSP430G2202IRSA16, MSP430G2402IRSA16). Signal mapping, power, ground, and debug pins are consistent across the family - enabling layout reuse and migration paths within the G2xx platform.

MSP430G2302IRSA16R Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
16-VQFN Exposed Pad
Series:
MSP430G2xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430G2302IRSA16R FAQ

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The price and inventory of MSP430G2302IRSA16R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2302IRSA16R is usually 5 days.

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5.How can I obtain technical support or documentation for MSP430G2302IRSA16R?

For technical support, including MSP430G2302IRSA16R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2302IRSA16R requirements.

6.How does Aetrix verify that MSP430G2302IRSA16R is sourced from the original manufacturer or authorized distributors?

All MSP430G2302IRSA16R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2302IRSA16R meets industry standards.

7.What is the process for return or replacement of MSP430G2302IRSA16R?

All MSP430G2302IRSA16R units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2302IRSA16R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430G2302IRSA16R part is unused and in its original packaging.

Return procedure for MSP430G2302IRSA16R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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