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Texas Instruments MSP430G2303IRHB32R
- Part No.:
- MSP430G2303IRHB32R
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
MSP430G2303IRHB32R.pdf
- Description:
- IC MCU 16BIT 4KB FLASH 32VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,791
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Product details
Overview
MSP430G2303IRHB32R from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller featuring 4 KB flash, 256 B RAM, two 16-bit Timer_A modules with three capture/compare registers each, USCI_A0 (UART/LIN/IrDA/SPI) and USCI_B0 (SPI/I²C), and 24 capacitive-touch-enabled I/O pins in a 32-pin QFN package. It operates from 1.8 V to 3.6 V and targets battery-powered sensor nodes and touch interfaces.
For engineers reviewing the MSP430G2303IRHB32R datasheet, MSP430G2303IRHB32R pinout, MSP430G2303IRHB32R application, or MSP430G2303IRHB32R equivalent, key selection criteria include its 4 KB flash capacity, absence of integrated ADC (distinguishing it from G2x33 variants), Spy-Bi-Wire debug interface, and QFN-32 thermal performance for compact industrial sensing designs.
Technical Context
The MSP430G2303IRHB32R implements a 16-bit RISC CPU with constant generators and a digitally controlled oscillator (DCO) enabling sub-1 µs wake-up from standby mode. Its clock system supports internal calibrated frequencies up to 16 MHz, 32-kHz crystal input, and external digital clock sources - all managed via the Basic Clock Module.
Peripherals include dual 16-bit Timer_A units (each with three CC registers), USCI_A0 supporting UART with automatic baud-rate detection (LIN), IrDA, and synchronous SPI, plus USCI_B0 supporting SPI and I²C. Port P3 (available only on 28-/32-pin packages) provides eight additional I/O pins with pullup/pulldown resistors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16 registers and constant generators; enables high code efficiency for embedded control tasks. |
| Flash / RAM | 4 KB flash memory and 256 B RAM; sufficient for compact firmware with real-time sensor processing and communication stacks. |
| Supply Voltage | 1.8 V to 3.6 V operation; supports direct connection to single-cell Li-ion or alkaline batteries without regulation. |
| Active Current | 230 µA at 1 MHz, 2.2 V; enables multi-year battery life in intermittent-sampling applications like environmental monitors. |
| Low-Power Modes | Five power-saving modes including LPM4 (0.1 µA RAM retention); critical for energy harvesting and wake-on-event systems. |
| Timer Resources | Two 16-bit Timer_A modules, each with three capture/compare registers; supports PWM generation, input capture, and interval timing. |
| Communication | USCI_A0 (UART/LIN/IrDA/SPI) + USCI_B0 (SPI/I²C); allows concurrent serial protocols for sensor fusion and host interfacing. |
Pinout & Package
VQFN-32 (RHB) package with 5 mm × 5 mm body size and exposed thermal pad; designed for high-density PCB layouts and improved thermal dissipation in sealed enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–7, 9–17, 19–22, 30–31 | General-purpose I/O (P1.x–P3.x) | 24 total capacitive-touch-capable pins; configurable with interrupt, pullup/pulldown, and peripheral function multiplexing. |
| 23 | RST/NMI/SBWTDIO | Spy-Bi-Wire debug data I/O and reset/non-maskable interrupt input; enables in-system programming without JTAG header. |
| 24 | TEST/SBWTCK | Spy-Bi-Wire test clock input; required for low-pin-count debugging and flash programming. |
| 25–26 | XOUT/P2.7, XIN/P2.6 | Crystal oscillator terminals for 32-kHz watch crystal; supports precise real-time clock and low-power timing. |
| 27–28 | DVSS, AVSS | Digital and analog ground planes; separate grounding reduces noise coupling in mixed-signal operation. |
| 29–30 | AVCC, DVCC | Separate analog and digital supply pins; improves ADC accuracy (though not present in G2303) and noise immunity. |
| 8, 32 | NC | No-connect pins; must remain unconnected per TI design guidance to avoid parasitic coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-fast wake-up | Sub-1 µs transition from LPM3/LPM4 to active mode enables responsive event-driven firmware with minimal latency. |
| Digital-controlled oscillator | Calibrated DCO frequencies (1/2/4/8/12/16 MHz) eliminate need for external crystals in many timing-critical applications. |
| Capacitive-touch I/O | 24 pins support charge-transfer-based touch sensing without dedicated hardware, reducing BOM cost for HMI designs. |
| Serial communication flexibility | USCI_A0 and USCI_B0 support simultaneous UART (LIN-compliant) and I²C master/slave, simplifying multi-sensor bus topologies. |
| Brownout detection | Integrated POR/BOR circuit ensures reliable reset during battery voltage sag, preventing corrupted flash writes or erratic execution. |
Applications
| Smart Sensor Node | Capacitive Touch Interface |
|---|---|
|
Use Scenario: Battery-powered temperature/humidity sensor transmitting data via UART to a gateway every 5 minutes. IC Role / Device Role / Timing Role: Main controller executing sensor read, data formatting, and low-power UART transmission; uses LPM3 between samples. Use Value: 0.5 µA standby current and 230 µA active current at 1 MHz enable >5-year operation on CR2032 coin cell. |
Use Scenario: Touch slider on industrial control panel with 8-button overlay and LED feedback. IC Role / Device Role / Timing Role: Capacitive-touch acquisition engine using built-in I/O charge-transfer method; drives LEDs via GPIO. Use Value: 24 touch-capable pins eliminate external touch controller IC, reducing component count and board area by 30%. |
| Energy Harvesting System | Industrial Serial Gateway |
|
Use Scenario: Solar-charged node collecting vibration data from MEMS accelerometer and storing bursts in RAM. IC Role / Device Role / Timing Role: Power-aware coordinator managing energy budget, sensor sampling, and burst-mode RF transmission. Use Value: Five low-power modes and 0.1 µA off-mode (RAM retention) preserve state across intermittent energy availability. |
Use Scenario: Protocol translator converting Modbus RTU (RS-485) to I²C for legacy sensor integration. IC Role / Device Role / Timing Role: Dual-USCI bridge: USCI_A0 as RS-485 UART, USCI_B0 as I²C master; handles framing and address mapping. Use Value: Independent UART and I²C peripherals enable concurrent full-duplex communication without software overhead or timing conflicts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430G2403IRHB32R | 8 KB flash, 512 B RAM; identical peripherals and pinout; no ADC. | Supports larger firmware images (e.g., BLE stack + sensor drivers) while retaining same power profile and footprint. | Select when firmware growth exceeds 4 KB or RAM usage exceeds 256 B, with no layout change required. |
| MSP430G2333IRHB32R | Includes 10-bit, 8-channel ADC; otherwise identical flash/RAM/peripherals/package. | Enables direct analog sensor interfacing (e.g., thermistor, potentiometer) without external ADC or signal conditioning. | Choose when analog measurement capability is required; note ADC adds ~100 µA active current during conversion. |
Compared with MSP430G2403IRHB32R and MSP430G2333IRHB32R, the MSP430G2303IRHB32R offers optimal cost/power balance for digital-only sensor and control applications where flash headroom and analog conversion are not needed.
Availability
MSP430G2303IRHB32R is available at Aetrix Electronics and suitable for smart sensor nodes, capacitive touch interfaces, energy harvesting systems, and industrial serial gateways requiring stable component supply and long-term production continuity.
Supply support for MSP430G2303IRHB32R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with over 50 years of innovation in low-power microcontrollers and precision analog ICs.
The MSP430G2xx family targets cost-sensitive, battery-operated applications demanding ultra-low power consumption, integrated peripherals, and rapid time-to-market - exemplified by the MSP430G2303IRHB32R's optimized mix of flash, timers, and communication interfaces.
FAQ
Does the MSP430G2303IRHB32R include an analog-to-digital converter (ADC)?
No, the MSP430G2303IRHB32R does not integrate an ADC. It belongs to the G2x03 subfamily, which omits the 10-bit ADC found in G2x33 variants like MSP430G2333IRHB32R. This makes the MSP430G2303IRHB32R ideal for purely digital control, communication, or capacitive-touch applications where external ADCs or analog sensors are not required.
What debug interface does the MSP430G2303IRHB32R support?
The MSP430G2303IRHB32R supports Spy-Bi-Wire (SBW) via pins 23 (RST/NMI/SBWTDIO) and 24 (TEST/SBWTCK). This two-wire interface enables full in-system programming and debugging without a full 4-wire JTAG header, reducing PCB footprint and connector cost while maintaining full flash erase/write and breakpoint functionality.
Is the MSP430G2303IRHB32R pin-compatible with other MSP430G2xx devices in the RHB32 package?
Yes, the MSP430G2303IRHB32R shares identical pinout and package dimensions with MSP430G2403IRHB32R, MSP430G2333IRHB32R, and MSP430G2433IRHB32R. All RHB32-packaged G2x03/G2x33 devices use the same 32-pin QFN layout, enabling drop-in replacement for flash/RAM or ADC feature upgrades without PCB redesign.
What is the maximum system clock frequency supported by the MSP430G2303IRHB32R?
The MSP430G2303IRHB32R supports a maximum MCLK frequency of 16 MHz at VCC = 3.3 V, 12 MHz at 2.7 V, and 6 MHz at 1.8 V. These limits are defined by the DCO calibration and operating conditions in the SLAS734G datasheet; exceeding them may cause timing violations or reduced reliability.
How does the MSP430G2303IRHB32R manage power in battery-operated applications?
The MSP430G2303IRHB32R employs five low-power modes: LPM0–LPM4. Standby (LPM3) draws just 0.5 µA, and off-mode (LPM4) retains RAM at 0.1 µA. Combined with sub-1 µs wake-up and programmable DCO calibration, this enables duty-cycled operation - e.g., 10 ms active time per hour - extending CR2032 battery life beyond five years.
MSP430G2303IRHB32R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 32-VFQFN Exposed Pad
- Series:
- MSP430G2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, PWM, WDT
- Number of I/O:
- 24
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430G2303IRHB32R FAQ
1.How can I place an order for MSP430G2303IRHB32R through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430G2303IRHB32R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430G2303IRHB32R reliable?
The price and inventory of MSP430G2303IRHB32R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2303IRHB32R is usually 5 days.
3.What payment methods are accepted for MSP430G2303IRHB32R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430G2303IRHB32R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430G2303IRHB32R?
MSP430G2303IRHB32R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430G2303IRHB32R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430G2303IRHB32R?
For technical support, including MSP430G2303IRHB32R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2303IRHB32R requirements.
6.How does Aetrix verify that MSP430G2303IRHB32R is sourced from the original manufacturer or authorized distributors?
All MSP430G2303IRHB32R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2303IRHB32R meets industry standards.
7.What is the process for return or replacement of MSP430G2303IRHB32R?
All MSP430G2303IRHB32R units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2303IRHB32R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430G2303IRHB32R part is unused and in its original packaging.
Return procedure for MSP430G2303IRHB32R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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