Texas Instruments MSP430G2332IPW14R
- Part No.:
- MSP430G2332IPW14R
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 14-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
MSP430G2332IPW14R.pdf
- Description:
- IC MCU 16BIT 4KB FLASH 14TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430G2332IPW14R from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller featuring a 10-bit 200-ksps ADC, 16-Bit Timer_A with three capture/compare registers, Universal Serial Interface (USI) supporting SPI and I²C, and up to 8 capacitive-touch enabled I/O pins in a 14-pin TSSOP package. It operates from 1.8 V to 3.6 V and targets battery-powered sensor nodes requiring analog signal acquisition, local processing, and serial communication.
For engineers reviewing the MSP430G2332IPW14R datasheet, MSP430G2332IPW14R pinout, MSP430G2332IPW14R application, or MSP430G2332IPW14R equivalent, key selection criteria include ADC channel count (8-channel), USI interface flexibility, low-power mode timing (sub-1 µs wake-up), and TSSOP-14 footprint compatibility for space-constrained PCB layouts.
Technical Context
The MSP430G2332IPW14R implements a digitally controlled oscillator (DCO) calibrated at 1 MHz, 8 MHz, 12 MHz, and 16 MHz, enabling fast active-mode entry from LPM4 in under 1 µs. Its clock system supports ACLK (LF crystal or internal VLO), SMCLK (DCO-derived), and MCLK (CPU clock), all configurable via BCSCTL registers.
It integrates a 10-bit SAR ADC with internal reference, sample-and-hold, autoscan, and DMA-capable data transfer control (ADC10DTC). The USI module provides hardware-level SPI master/slave and I²C master functionality without CPU intervention during transfers, using dedicated SDO/SDI/SCL/SDA pins mapped to Port 1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 62.5-ns instruction cycle; enables efficient C code execution and deterministic real-time response. |
| Flash / RAM | 4 KB flash / 256 B RAM; sufficient for firmware with ADC data buffering, USI protocol stacks, and low-level driver logic. |
| ADC Resolution & Speed | 10-bit SAR, 200 ksps max; supports high-fidelity sensor sampling (e.g., thermistors, potentiometers) with internal 1.5 V/2.5 V reference options. |
| Low-Power Modes | 5 software-selectable modes including LPM4 (0.1 µA RAM retention); extends coin-cell battery life to multi-year operation in sleep-dominated applications. |
| USI Interfaces | Hardware SPI and I²C via shared SDO/SDI/SCL/SDA pins; eliminates bit-banging overhead and ensures precise timing compliance. |
| Timer Resources | 16-bit Timer_A with 3 capture/compare registers; supports PWM generation, input capture for pulse-width measurement, and interval timing with interrupt or DMA trigger capability. |
| Supply Voltage Range | 1.8 V to 3.6 V; compatible with single-cell Li-ion, LiFePO₄, or dual-AA alkaline power sources without external regulation. |
Pinout & Package
Package: 14-pin TSSOP (PW14), 5.0 mm × 4.4 mm body, 0.65 mm pitch, exposed thermal pad not present.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (DVCC) | Digital supply voltage | Primary 1.8–3.6 V power input for core logic and digital I/O; requires local 100 nF decoupling. |
| 2 (P1.0/TA0CLK/ACLK/A0) | Multi-function I/O | Configurable as ADC input A0, Timer_A clock source, or ACLK output; enables flexible clock routing and analog sensing on same pin. |
| 3 (P1.1/TA0.0/A1) | Multi-function I/O | Supports ADC input A1, Timer_A capture/compare channel 0, or general-purpose I/O with interrupt capability. |
| 4 (P1.2/TA0.1/A2) | Multi-function I/O | Provides ADC input A2, Timer_A capture/compare channel 1, or capacitive-touch enabled digital I/O. |
| 5 (P1.3/ADC10CLK/VREF-/VEREF-/A3) | ADC reference & input | Dedicated ADC negative reference (VREF-/VEREF-) and analog input A3; critical for ratiometric measurements and precision referencing. |
| 6 (P1.4/TA0.2/SMCLK/A4/VREF+/VEREF+/TCK) | Multi-function I/O | Combines ADC positive reference, Timer_A channel 2, SMCLK output, and JTAG test clock - requires careful pin assignment during debug vs. runtime use. |
| 7 (P1.5/TA0.0/SCLK/A5/TMS) | Multi-function I/O | Serves as Timer_A compare output, USI SPI clock, ADC input A5, and JTAG test mode select - pin function must be statically assigned per operational mode. |
| 8 (P1.6/TA0.1/SDO/SCL/A6/TDI/TCLK) | USI & ADC I/O | Primary USI data output (SPI) or I²C clock (SCL), plus ADC input A6 and JTAG test data input - defines primary serial interface path. |
| 9 (P1.7/SDI/SDA/A7/TDO/TDI) | USI & ADC I/O | USI data input (SPI) or I²C data (SDA), ADC input A7, and JTAG test data I/O - completes full-duplex USI and 8-channel ADC mapping. |
| 10 (RST/NMI/SBWTDIO) | Reset & debug I/O | Active-low reset input, non-maskable interrupt, and Spy-Bi-Wire debug data I/O; enables in-system programming and low-pin-count debugging. |
| 11 (TEST/SBWTCK) | Debug clock | Test mode select and Spy-Bi-Wire clock input; required only during programming/debug; must be pulled low in normal operation. |
| 12 (XOUT/P2.7) | Oscillator output | Crystal oscillator output or general-purpose I/O P2.7; used with external 32.768 kHz crystal for precise real-time clock operation. |
| 13 (XIN/P2.6/TA0.1) | Oscillator input | Crystal oscillator input or Timer_A compare output P2.6; forms low-power RTC clock source when paired with XOUT. |
| 14 (DVSS) | Digital ground | Reference ground for digital circuitry and I/O; must be connected to system ground plane with low-inductance path. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power standby | 0.5 µA in LPM3 mode with ACLK active - enables years of operation on CR2032 batteries in periodic-sense applications. |
| Capacitive-touch I/O | Up to 8 pins support pin-oscillator-based touch detection without external components - reduces BOM cost and board area for user-interface integration. |
| Integrated ADC reference | Internal 1.5 V and 2.5 V references with calibration data stored in info memory - eliminates need for external reference ICs in precision analog front-ends. |
| On-chip emulation | Spy-Bi-Wire interface with 2-breakpoint capability - allows full-speed debugging and flash programming using only two pins (RST and TEST). |
| Programmable security | Flash protection fuse prevents unauthorized read-out of firmware - meets basic IP protection requirements for commercial embedded products. |
Applications
| Smart Sensor Node | Portable Medical Monitor |
|---|---|
Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and light data every 30 seconds, then transmitting via BLE module. IC Role / Device Role / Timing Role: MSP430G2332IPW14R performs analog acquisition (ADC10), timestamping (Timer_A), low-power scheduling (LPM3/LPM4), and SPI communication with BLE SoC. Use Value: 0.5 µA LPM3 current and integrated 10-bit ADC reduce total system power by >40% versus discrete ADC + MCU solutions. | Use Scenario: Wearable pulse oximeter measuring SpO₂ and heart rate using photodiode signals and red/IR LEDs. IC Role / Device Role / Timing Role: MSP430G2332IPW14R controls LED timing (PWM via Timer_A), samples analog front-end (ADC10 with autoscan), and manages I²C communication with display driver. Use Value: Internal 2.5 V reference and calibrated ADC offset/gain ensure ±1% measurement accuracy across temperature without factory trimming. |
| Industrial Control Panel | Energy Harvesting IoT Endpoint |
Use Scenario: DIN-rail mounted HMI panel monitoring relay status, voltage levels, and ambient temperature in factory automation cabinets. IC Role / Device Role / Timing Role: MSP430G2332IPW14R reads discrete inputs (P1/P2), measures analog rail voltages (ADC10), drives local LED indicators (GPIO), and communicates via RS-485 (via USI-to-UART bridge IC). Use Value: 14-pin TSSOP footprint and 8 GPIO with programmable pull-ups simplify PCB layout and eliminate external level shifters for 24 V input interfacing. | Use Scenario: Solar-powered soil moisture sensor harvesting ~50 µW average power, waking every 10 minutes to measure capacitance and transmit via LoRa. IC Role / Device Role / Timing Role: MSP430G2332IPW14R manages energy harvesting PMIC enable, performs capacitive ADC conversion, and triggers LoRa transceiver via GPIO. Use Value: 0.1 µA off-mode current and sub-1 µs wake-up minimize energy loss during sleep, maximizing usable harvested energy per measurement cycle. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430G2432IPW14R | 8 KB flash, 8-channel ADC, identical pinout and peripherals | Supports larger firmware (e.g., OTA update stack, advanced filtering algorithms) | Select when firmware size exceeds 4 KB or future scalability is required; no hardware change needed. |
| STM32L011K4T6 | ARM Cortex-M0+, 16 KB flash, 12-bit ADC, different pinout (32-pin LQFP), no built-in USI | Requires external level translation for 1.8 V I/O; needs software SPI/I²C implementation | Choose for ARM ecosystem compatibility or higher compute throughput; redesign required for pinout and power domain. |
Compared with MSP430G2432IPW14R, the MSP430G2332IPW14R offers identical low-power performance and peripheral set at lower flash cost; versus STM32L011K4T6, it delivers superior out-of-box analog integration and lower active-mode current but lacks ARM toolchain support.
Availability
MSP430G2332IPW14R is available at Aetrix Electronics and suitable for smart sensor nodes, portable medical monitors, industrial control panels, and energy harvesting IoT endpoints requiring stable component supply and long-term manufacturability.
Supply support for MSP430G2332IPW14R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity technologies for industrial, automotive, and consumer applications.
The MSP430G2xx family is designed for ultra-low-power mixed-signal applications where extended battery life, integrated analog peripherals, and minimal external components are critical - exemplified by the MSP430G2332IPW14R's focus on sensor acquisition and serial communication in compact footprints.
FAQ
What is the maximum ADC sampling rate supported by the MSP430G2332IPW14R?
The MSP430G2332IPW14R supports a maximum ADC10 sampling rate of 200 ksps under optimal conditions: VCC ≥ 2.2 V, ADC10CLK sourced from SMCLK at ≥ 5 MHz, and internal reference enabled. At lower supply voltages or with slower clock sources, the effective rate decreases due to conversion time scaling - for example, at 1.8 V and 1 MHz ADC10CLK, the practical limit drops to ~50 ksps. The MSP430G2332IPW14R datasheet specifies this performance in the ADC Electrical Characteristics table.
Does the MSP430G2332IPW14R support hardware I²C master mode?
Yes, the MSP430G2332IPW14R supports hardware I²C master mode via its Universal Serial Interface (USI) module. When configured in I²C mode, pins P1.6 (SCL) and P1.7 (SDA) operate as open-drain outputs with internal pull-up capability, and the USI generates START/STOP conditions, ACK/NACK responses, and clock stretching automatically. The MSP430G2332IPW14R does not support I²C slave mode in hardware - that requires software bit-banging or a different device variant.
How many I/O pins on the MSP430G2332IPW14R support capacitive-touch sensing?
The MSP430G2332IPW14R supports capacitive-touch sensing on up to 8 I/O pins: P1.0 through P1.7. Each pin includes a dedicated pin-oscillator circuit that can be enabled individually via the PxIES register, allowing self-capacitance measurement without external components. This capability is confirmed in the MSP430G2x32 functional description and pin-function table, and applies specifically to the MSP430G2332IPW14R within the G2x32 series.
What are the brownout detector thresholds for the MSP430G2332IPW14R?
The MSP430G2332IPW14R features a programmable brownout detector (BOR) with two selectable thresholds: 1.6 V and 1.9 V, set via the BORON bit in the SYSCTL register. When VCC falls below the selected threshold, the BOR asserts a reset signal to prevent unreliable operation. The detector remains active in all power modes except LPM4, and its behavior is independent of the supply voltage range (1.8–3.6 V) specified for normal operation. This functionality is documented in the MSP430G2332IPW14R's System Control chapter.
Can the MSP430G2332IPW14R operate with an external 32.768 kHz crystal?
Yes, the MSP430G2332IPW14R supports external 32.768 kHz crystal operation using pins XIN (P2.6) and XOUT (P2.7), which are dedicated to the low-frequency crystal oscillator. When enabled, this crystal drives the ACLK signal used for real-time clock functions, watchdog timer intervals, and low-power timing. The MSP430G2332IPW14R's basic clock module automatically handles load capacitance configuration and startup stabilization - no external capacitors are required for standard 12.5 pF crystals, as specified in the device's oscillator electrical characteristics.
MSP430G2332IPW14R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 14-TSSOP (0.173", 4.40mm Width)
- Series:
- MSP430G2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, SPI, USI
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 10
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430G2332IPW14R FAQ
1.How can I place an order for MSP430G2332IPW14R through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430G2332IPW14R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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6.How does Aetrix verify that MSP430G2332IPW14R is sourced from the original manufacturer or authorized distributors?
All MSP430G2332IPW14R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2332IPW14R meets industry standards.
7.What is the process for return or replacement of MSP430G2332IPW14R?
All MSP430G2332IPW14R units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2332IPW14R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430G2332IPW14R part is unused and in its original packaging.
Return procedure for MSP430G2332IPW14R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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