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Texas Instruments MSP430G2332IRSA16R
- Part No.:
- MSP430G2332IRSA16R
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 16-VQFN Exposed Pad
- Datasheet:
-
MSP430G2332IRSA16R.pdf
- Description:
- IC MCU 16BIT 4KB FLASH 16QFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,628
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Product details
Overview
MSP430G2332IRSA16R from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller featuring a 10-bit 200-ksps ADC, 16-QFN package, 4 KB Flash/256 B RAM, and integrated USI supporting SPI/I²C. It operates from 1.8 V to 3.6 V and delivers 220 µA active current at 1 MHz/2.2 V, enabling battery-powered sensor nodes and capacitive-touch interfaces.
For engineers reviewing the MSP430G2332IRSA16R datasheet, MSP430G2332IRSA16R pinout, MSP430G2332IRSA16R application, or MSP430G2332IRSA16R equivalent, key selection criteria include ADC channel count (8-channel), low-power mode latency (<1 µs wake-up), Spy-Bi-Wire debug interface, and QFN-16 footprint compatibility with space-constrained designs.
Technical Context
The MSP430G2332IRSA16R implements a 16-bit RISC CPU with 62.5-ns instruction cycle time and constant generators for optimized code efficiency. Its clock system integrates a digitally controlled oscillator (DCO) calibrated to 1–16 MHz, plus LF oscillator and 32-kHz crystal support - all configurable via BCSCTL registers.
Peripheral integration includes Timer_A with three capture/compare registers, universal serial interface (USI) for hardware SPI/I²C, brownout detection, and on-chip emulation logic. The ADC10 module supports internal reference, sample-and-hold, autoscan, and DMA-triggered conversions - exclusively available in the G2x32 series.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16 general-purpose registers and 62.5-ns instruction cycle - enables deterministic real-time control in resource-constrained firmware. |
| Flash / RAM | 4 KB Flash / 256 B RAM - sufficient for standalone sensor firmware with ADC data processing and USI communication stacks. |
| ADC Resolution & Speed | 10-bit SAR ADC, 200 ksps max - supports high-fidelity analog sensing (e.g., temperature, light, proximity) without external oversampling. |
| Power Consumption | Active: 220 µA @ 1 MHz/2.2 V; Standby: 0.5 µA; Off (RAM retention): 0.1 µA - extends coin-cell battery life to multi-year operation. |
| Low-Power Modes | Five software-selectable modes (LPM0–LPM4) - allows dynamic power scaling based on sensor sampling interval and communication duty cycle. |
| Communication Interface | USI supporting hardware SPI and I²C - eliminates bit-banging overhead and ensures reliable peripheral interfacing (e.g., EEPROM, sensors, displays). |
| Debug Interface | Spy-Bi-Wire (2-wire JTAG) - enables in-system programming and real-time debugging with minimal PCB footprint and no external voltage required. |
Pinout & Package
Package: 16-pin QFN (RSA), 3 mm × 3 mm, 0.4 mm pitch, exposed thermal pad connected to DVSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DVCC (Pin 1) | Supply voltage input | Primary digital core supply (1.8–3.6 V); requires local 100 nF decoupling to DVSS. |
| P1.0/TA0CLK/ACLK/A0 (Pin 2) | Multi-function I/O | Configurable as timer clock input, ACLK output, or ADC channel 0 - enables flexible clock tree and analog signal routing. |
| P1.3/ADC10CLK/VREF-/VEREF-/A3 (Pin 5) | ADC reference & input | Provides negative ADC reference (VREF-/VEREF-) and analog input A3 - supports ratiometric measurements with external sensor bridges. |
| P1.4/TA0.2/SMCLK/A4/VREF+/VEREF+ (Pin 6) | Multi-function I/O | Supplies positive ADC reference (VREF+/VEREF+) and SMCLK output - simplifies reference generation and peripheral clock distribution. |
| RST/NMI/SBWTDIO (Pin 16) | Reset & debug I/O | Active-low reset, non-maskable interrupt, and Spy-Bi-Wire data I/O - consolidates reset and debug into single pin for compact layout. |
| TEST/SBWTCK (Pin 11) | Debug clock input | Spy-Bi-Wire test clock - enables programming and debugging using TI MSP-FET or LaunchPad without full JTAG header. |
Key Features
| Feature | Design Value |
|---|---|
| Capacitive-touch I/O | Up to 16 pins support pin-oscillator-based touch sensing - enables button/slider implementation without external ICs or RC networks. |
| Ultra-fast wake-up | <1 µs transition from LPM4 to active mode - minimizes latency in event-driven sensing (e.g., motion-triggered data capture). |
| Programmable security fuse | On-chip code protection via blown security fuse - prevents unauthorized firmware extraction in deployed devices. |
| Built-in calibration data | Factory-trimmed DCO and ADC10 calibration constants stored in Info Memory Segment A - eliminates need for external trim components or runtime calibration. |
| Integrated brownout detector | Monitors DVCC and asserts reset below threshold - ensures reliable operation during battery voltage sag or power ramp-up. |
Applications
| Industrial Sensor Node | Capacitive-Touch Remote Control |
|---|---|
Use Scenario: Battery-powered temperature/humidity monitor transmitting data via I²C to MCU gateway. IC Role / Device Role / Timing Role: Primary sensor acquisition MCU handling ADC sampling, digital filtering, and USI-based I²C slave communication. Use Value: 0.1 µA off-mode current and 220 µA active draw enable >5-year CR2032 battery life; built-in ADC reference eliminates external precision voltage source. | Use Scenario: Low-cost IR remote with touch-sensitive buttons replacing mechanical switches. IC Role / Device Role / Timing Role: Capacitive-touch controller and IR carrier generator using Timer_A PWM output. Use Value: Pin-oscillator touch detection reduces BOM cost by eliminating dedicated touch IC; 16-QFN footprint fits slim remote form factor. |
| Portable Medical Patch | Smart Home Occupancy Sensor |
Use Scenario: Wearable ECG front-end digitizing analog biopotentials and streaming via SPI to BLE SoC. IC Role / Device Role / Timing Role: Analog signal conditioner and ADC interface with autoscan across multiple electrode inputs. Use Value: 8-channel ADC autoscan and DTC enable continuous multi-lead sampling without CPU intervention; 1.8 V minimum supply supports single-cell Li-ion operation. | Use Scenario: PIR-based occupancy detector with ambient light compensation and local decision logic. IC Role / Device Role / Timing Role: Dual-sensor fusion processor reading PIR output and photodiode ADC value, then triggering wake-up events. Use Value: Five low-power modes allow deep sleep between motion events; internal LF oscillator provides accurate timing for light-sampling intervals without external crystal. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430G2432IRSA16 | 8 KB Flash / 256 B RAM; identical peripherals and pinout - higher program memory capacity. | Supports larger firmware (e.g., embedded USB stack, advanced filtering algorithms) without changing PCB layout. | Select when firmware size exceeds 4 KB or future scalability is required; same debug and power characteristics. |
| MSP430FR2355TRHBR | Ferroelectric RAM (64 KB FRAM / 2 KB RAM); no Flash write endurance limit; 12-bit ADC; different pinout (32-QFN). | Enables frequent data logging to nonvolatile memory without wear-out concerns; higher-resolution ADC for precision sensing. | Choose for high-cycle data recording or when 12-bit resolution improves measurement fidelity; requires PCB redesign. |
Compared with MSP430G2432IRSA16, the MSP430G2332IRSA16 trades Flash capacity for cost-sensitive volume production; versus MSP430FR2355TRHBR, it offers proven Flash reliability and QFN-16 compatibility but lacks FRAM endurance and 12-bit conversion.
Availability
MSP430G2332IRSA16R is available at Aetrix Electronics and suitable for industrial sensor nodes, capacitive-touch remotes, portable medical patches, and smart home occupancy sensors requiring stable component supply and long-term manufacturability.
Supply support for MSP430G2332IRSA16R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in low-power design.
The MSP430G2xx family targets ultra-low-power embedded applications where extended battery life, small footprint, and integrated analog peripherals are critical - especially in sensor, metering, and human-interface systems.
FAQ
What is the maximum ADC sampling rate supported by the MSP430G2332IRSA16R?
The MSP430G2332IRSA16R supports a maximum ADC10 sampling rate of 200 ksps under optimal conditions (internal reference, 10-bit resolution, autoscan disabled). This rate assumes ADC10CLK derived from MCLK or SMCLK and accounts for sample-and-hold acquisition time. Real-world throughput may be lower when using external references or enabling features like DTC or burst conversion.
Does the MSP430G2332IRSA16R support capacitive-touch sensing on all I/O pins?
The MSP430G2332IRSA16R supports capacitive-touch sensing on up to 16 I/O pins via its integrated pin-oscillator circuitry, but only on Port 1 pins (P1.0–P1.7) and Port 2 pins (P2.0–P2.5) as enabled by the P1SEL/P2SEL and P1DIR/P2DIR registers. Pins P2.6 and P2.7 are excluded from touch functionality due to their dedicated XIN/XOUT roles in crystal oscillator configuration.
Can the MSP430G2332IRSA16R operate without an external crystal?
Yes, the MSP430G2332IRSA16R can operate without an external crystal using its internal digitally controlled oscillator (DCO), which is factory-calibrated to frequencies from 1 MHz to 16 MHz across four ranges. The DCO supports fast wake-up (<1 µs) and is sufficient for most USI, Timer_A, and ADC timing requirements - eliminating BOM cost and board space for crystal components.
What debug interface does the MSP430G2332IRSA16R use, and what hardware is required?
The MSP430G2332IRSA16R uses the 2-wire Spy-Bi-Wire (SBW) interface for debugging and programming, accessible via pins RST/NMI/SBWTDIO (Pin 16) and TEST/SBWTCK (Pin 11). No external programming voltage is needed. Compatible tools include TI's MSP-FET programmer or MSP430 LaunchPad development kits - both connect directly to the QFN-16 pads using spring-loaded pogo pins or fine-pitch headers.
How many I/O pins are available on the MSP430G2332IRSA16R in the 16-pin QFN package?
The MSP430G2332IRSA16R provides 14 usable digital I/O pins in its 16-pin QFN (RSA) package: P1.0–P1.7 (8 pins), P2.0–P2.5 (6 pins). Pins 1 (DVCC) and 14 (DVSS) are power/ground, while Pin 16 (RST/NMI/SBWTDIO) and Pin 11 (TEST/SBWTCK) serve dual debug functions but retain I/O capability when not in debug mode.
MSP430G2332IRSA16R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 16-VQFN Exposed Pad
- Series:
- MSP430G2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, SPI, USI
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 10
- Program Memory Size:
- 4KB (4K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430G2332IRSA16R FAQ
1.How can I place an order for MSP430G2332IRSA16R through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430G2332IRSA16R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430G2332IRSA16R reliable?
The price and inventory of MSP430G2332IRSA16R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2332IRSA16R is usually 5 days.
3.What payment methods are accepted for MSP430G2332IRSA16R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430G2332IRSA16R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430G2332IRSA16R?
MSP430G2332IRSA16R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430G2332IRSA16R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430G2332IRSA16R?
For technical support, including MSP430G2332IRSA16R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2332IRSA16R requirements.
6.How does Aetrix verify that MSP430G2332IRSA16R is sourced from the original manufacturer or authorized distributors?
All MSP430G2332IRSA16R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2332IRSA16R meets industry standards.
7.What is the process for return or replacement of MSP430G2332IRSA16R?
All MSP430G2332IRSA16R units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2332IRSA16R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430G2332IRSA16R part is unused and in its original packaging.
Return procedure for MSP430G2332IRSA16R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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