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Texas Instruments MSP430G2333IRHB32T

Part No.:
MSP430G2333IRHB32T
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
32-VFQFN Exposed Pad
Datasheet:
AetrixMSP430G2333IRHB32T.pdf
Description:
IC MCU 16BIT 4KB FLASH 32VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:500

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Product details

Overview

MSP430G2333IRHB32T from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller featuring 4 KB flash, 256 B RAM, a 10-bit 200-ksps ADC with 8 channels and internal reference, two 16-bit Timer_A modules with three capture/compare registers each, USCI supporting UART/LIN/IrDA/SPI/I²C, and up to 24 capacitive-touch-enabled I/O pins in a 32-pin QFN package. It targets battery-powered sensor nodes and portable measurement systems requiring sub-1-µs wake-up and <0.1 µA off-mode current.

For engineers reviewing the MSP430G2333IRHB32T datasheet, MSP430G2333IRHB32T pinout, MSP430G2333IRHB32T application, or MSP430G2333IRHB32T equivalent, key selection criteria include verified 16-MHz DCO operation at 3.3 V, calibrated internal oscillator frequencies (1/8/12/16 MHz), ADC linearity (±1 LSB INL), Spy-Bi-Wire debug interface, and QFN-32 package thermal performance (θJA = 42.7°C/W).

Technical Context

The MSP430G2333IRHB32T implements a 16-bit CPU with constant generators and 16 registers for optimized code density. Its clock system integrates a digitally controlled oscillator (DCO) with four factory-calibrated frequencies, a low-frequency VLO, and support for 32-kHz crystal or external digital clock sources - enabling precise timing control across five power-saving modes.

Peripherals include dual Timer_A modules (each with three CC registers), USCI_A0 (UART/LIN/IrDA/SPI) and USCI_B0 (SPI/I²C), and a 10-bit ADC with sample-and-hold, autoscan, and built-in temperature sensor. Port P3 is available only on 28- and 32-pin packages, confirming full I/O access in the RHB32 variant.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture 16-bit RISC CPU with 62.5-ns instruction cycle; enables deterministic real-time response in resource-constrained embedded firmware.
Flash / RAM 4 KB flash memory and 256 B RAM; sufficient for compact sensor firmware with bootloader and calibration data storage.
ADC Resolution & Speed 10-bit, 200-ksps SAR ADC with 8 input channels and ±1 LSB INL; supports high-fidelity analog signal acquisition from multiple sensors.
Power Consumption 230 µA active @ 1 MHz/2.2 V; 0.5 µA standby; 0.1 µA off-mode with RAM retention; extends coin-cell battery life to multi-year operation.
Wake-up Time <1 µs from LPM3/LPM4 to active mode; critical for event-driven sensing where latency must be minimized.
Operating Voltage 1.8 V to 3.6 V supply range; compatible with single-cell Li-ion, LiFePO₄, and alkaline battery systems without regulation.
Package 32-pin VQFN (RHB), 5 mm × 5 mm body; provides thermal efficiency (θJA = 42.7°C/W) and board-space savings for compact PCB layouts.

Pinout & Package

Package: 32-pin VQFN (RHB), 5 mm × 5 mm, exposed thermal pad recommended to connect to DVSS.

Pin/Terminal Circuit Role Design Meaning
1–7, 9–19, 21–22, 31 Port P1/P2/P3 I/O 24 total GPIO pins with interrupt capability, pullup/pulldown resistors, and capacitive-touch support; enables direct sensor interfacing and human-interface design.
3, 5, 31, 4, 30, 29, 27–28 Power & Ground DVCC (digital VDD), AVCC (analog VDD), DVSS/AVSS (digital/analog ground); separate analog/digital supplies reduce noise coupling in mixed-signal operation.
23–24, 25–26 Spy-Bi-Wire Debug RST/NMI/SBWTDIO and TEST/SBWTCK pins provide 2-wire JTAG-compatible programming and debugging without dedicated header footprint.
26, 25 Crystal Oscillator XIN/XOUT support 32-kHz crystal for accurate real-time clocking; internal load capacitance eliminates need for external caps in basic configurations.
31, 1–2, 4–5, 30 ADC & Reference P1.0–P1.7 (A0–A7), VREF+/VREF−, ADC10CLK; enable 8-channel analog front-end with programmable internal reference (1.5 V/2.5 V).

Key Features

Feature Design Value
Ultra-Low-Power Operation Five power modes with sub-1-µs wake-up and 0.1 µA off-mode current preserve battery energy in intermittent-sensing applications.
Integrated Analog Front-End 10-bit ADC with internal reference, temperature sensor, and VMID generator eliminates external components for sensor signal conditioning.
Dual 16-Bit Timer_A Modules Each with three capture/compare registers supports simultaneous PWM generation, input capture, and interval timing for motor/sensor control.
USCI Communication Peripherals USCI_A0 (UART/LIN/IrDA/SPI) + USCI_B0 (SPI/I²C) enable flexible host communication and multi-sensor bus interfacing without external transceivers.
Capacitive-Touch I/O Up to 24 pins support charge-transfer-based touch sensing; allows direct integration of buttons/sliders without dedicated touch controller IC.

Applications

Smart Sensor Node Portable Medical Monitor

Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and pressure data every 10 seconds, then transmitting via UART to a gateway.

IC Role / Device Role / Timing Role: Central MCU managing ADC sampling, data processing, low-power sleep scheduling, and serial transmission timing.

Use Value: 0.1 µA off-mode current and <1 µs wake-up minimize average power, enabling >5-year operation on CR2032.

Use Scenario: Wearable pulse oximeter acquiring analog photodiode signals, performing real-time SpO₂ calculation, and displaying results on OLED.

IC Role / Device Role / Timing Role: Mixed-signal controller executing ADC conversions, digital filtering, and display refresh timing with synchronized PWM LED drive.

Use Value: Integrated 10-bit ADC with sample-and-hold and internal reference ensures stable analog measurements without external precision references.

Industrial Touch Interface Energy-Harvesting IoT Endpoint

Use Scenario: Panel-mounted control interface using capacitive touch keys and sliders to adjust HVAC parameters in building automation systems.

IC Role / Device Role / Timing Role: Capacitive-touch processor scanning electrodes, debouncing inputs, and communicating commands over I²C to main controller.

Use Value: 24 capacitive-touch-capable I/O pins allow full UI implementation in single-chip solution, reducing BOM count and layout complexity.

Use Scenario: Wireless sensor node powered by solar harvester, sleeping between ambient light/temperature readings, and waking only to transmit via SPI to RF module.

IC Role / Device Role / Timing Role: Power-aware system manager coordinating energy harvesting state, ADC sampling, and burst-mode RF transmission timing.

Use Value: 1.8 V minimum operating voltage and ultra-low standby current (0.5 µA) match typical energy-harvester output profiles and maximize duty-cycle efficiency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MSP430G2433IRHB32T 8 KB flash, 512 B RAM, same peripherals and package; higher memory capacity but identical power/performance profile. Suitable for firmware with larger feature sets or future-proofing; no change in power budget or I/O count. Select when additional flash/RAM is needed for field-upgradable features or complex algorithms without altering hardware design.
MSP430G2533IRHB32T 16 KB flash, 512 B RAM, same peripherals and package; largest memory option in G2x33 family. Targeted at applications requiring extensive protocol stacks (e.g., BLE middleware) or large calibration tables. Choose when firmware size exceeds 4 KB and memory headroom is critical; otherwise, MSP430G2333IRHB32T offers optimal cost/power balance.

Compared with MSP430G2433IRHB32T and MSP430G2533IRHB32T, the MSP430G2333IRHB32T delivers identical peripheral functionality and ultra-low-power behavior at the lowest memory cost - making it ideal for cost-sensitive, battery-constrained designs where 4 KB flash suffices.

Availability

MSP430G2333IRHB32T is available at Aetrix Electronics and suitable for smart sensor nodes, portable medical monitors, industrial touch interfaces, and energy-harvesting IoT endpoints requiring stable component supply and long-term manufacturability.

Supply support for MSP430G2333IRHB32T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on power efficiency and system integration.

The MSP430G2x33 product line is designed for ultra-low-power mixed-signal applications including sensor interfacing, capacitive touch, and portable instrumentation - prioritizing battery life, integrated analog capability, and minimal external component count.

FAQ

What is the maximum system clock frequency supported by the MSP430G2333IRHB32T?

The MSP430G2333IRHB32T supports a maximum system clock (MCLK) frequency of 16 MHz at VCC = 3.3 V with 50% ±10% duty cycle, enabled by its factory-calibrated DCO. This frequency is confirmed in the Recommended Operating Conditions table (Section 5.3) and applies directly to the MSP430G2333IRHB32T in its 32-pin QFN package under specified voltage and temperature conditions.

Does the MSP430G2333IRHB32T include an integrated ADC, and what are its key specifications?

Yes, the MSP430G2333IRHB32T includes a 10-bit successive-approximation ADC (ADC10) with 8 input channels, 200-ksps sampling rate, internal reference (1.5 V or 2.5 V), sample-and-hold, autoscan mode, and ±1 LSB integral nonlinearity. These specifications are explicitly documented in Sections 1.1, 5.29–5.34 of the SLAS734G datasheet and apply to the MSP430G2333IRHB32T as a member of the G2x33 family.

How many I/O pins on the MSP430G2333IRHB32T support capacitive touch sensing?

The MSP430G2333IRHB32T supports capacitive touch sensing on up to 24 I/O pins - all P1.x, P2.x, and P3.x pins - as stated in the Features section (1.1) and confirmed in the Device Comparison table (Table 3-1). This capability is inherent to the G2x33 family and fully available in the 32-pin RHB package used by the MSP430G2333IRHB32T.

What debug interface does the MSP430G2333IRHB32T use, and how is it implemented physically?

The MSP430G2333IRHB32T uses the Spy-Bi-Wire (SBW) interface, implemented via two dedicated pins: RST/NMI/SBWTDIO (Pin 23) and TEST/SBWTCK (Pin 24). This 2-wire JTAG-compatible interface enables full programming and debugging without requiring a 4-pin JTAG header, reducing PCB footprint and connector cost while maintaining compatibility with TI's MSP-FET and LaunchPad tools.

Is the MSP430G2333IRHB32T pin-compatible with other devices in the MSP430G2x33 family?

Yes, the MSP430G2333IRHB32T is pin-compatible with other 32-pin QFN variants in the MSP430G2x33 family, including MSP430G2433IRHB32T and MSP430G2533IRHB32T. All share identical RHB32 pinout, power/ground assignments, peripheral mappings, and I/O functions - allowing drop-in replacement within the same package footprint when memory requirements change.

MSP430G2333IRHB32T Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
32-VFQFN Exposed Pad
Series:
MSP430G2xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, PWM, WDT
Number of I/O:
24
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430G2333IRHB32T FAQ

1.How can I place an order for MSP430G2333IRHB32T through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430G2333IRHB32T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430G2333IRHB32T reliable?

The price and inventory of MSP430G2333IRHB32T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2333IRHB32T is usually 5 days.

3.What payment methods are accepted for MSP430G2333IRHB32T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430G2333IRHB32T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MSP430G2333IRHB32T?

MSP430G2333IRHB32T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430G2333IRHB32T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430G2333IRHB32T?

For technical support, including MSP430G2333IRHB32T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2333IRHB32T requirements.

6.How does Aetrix verify that MSP430G2333IRHB32T is sourced from the original manufacturer or authorized distributors?

All MSP430G2333IRHB32T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2333IRHB32T meets industry standards.

7.What is the process for return or replacement of MSP430G2333IRHB32T?

All MSP430G2333IRHB32T units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2333IRHB32T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430G2333IRHB32T part is unused and in its original packaging.

Return procedure for MSP430G2333IRHB32T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MSP430G2333IRHB32T Tags

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