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Texas Instruments MSP430G2533IRHB32R
- Part No.:
- MSP430G2533IRHB32R
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
MSP430G2533IRHB32R.pdf
- Description:
- IC MCU 16BIT 16KB FLASH 32VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,987
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Product details
Overview
MSP430G2533IRHB32R from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller featuring 16 KB flash, 512 B RAM, a 10-bit 200-ksps ADC with 8 channels, two 16-bit Timer_A modules, USCI with UART/LIN/IrDA/SPI/I²C, and capacitive-touch-enabled I/O. It operates from 1.8 V to 3.6 V and targets battery-powered sensor nodes and portable measurement systems.
For engineers reviewing the MSP430G2533IRHB32R datasheet, MSP430G2533IRHB32R pinout, MSP430G2533IRHB32R application, or MSP430G2533IRHB32R equivalent, key selection criteria include its 32-pin QFN (RHB) package, integrated ADC reference, Spy-Bi-Wire debug interface, and ultra-low active/standby current (230 µA @ 1 MHz / 0.5 µA standby).
Technical Context
The MSP430G2533IRHB32R implements a 16-bit RISC CPU with constant generators and a digitally controlled oscillator (DCO), enabling sub-1-µs wake-up from LPM3/LPM4. Its clock system supports internal calibrated frequencies up to 16 MHz, 32-kHz crystal input, and external digital sources - all configurable via the Basic Clock Module (BCS).
Peripherals include dual 16-bit Timer_A units (each with three capture/compare registers), USCI_A0 (UART/LIN/IrDA/SPI) and USCI_B0 (SPI/I²C), and an ADC10 with autoscan, internal reference, and temperature sensor support. Port P3 (8 pins) is available only on 28- and 32-pin packages like the RHB32.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 62.5-ns instruction cycle; enables efficient C code execution in resource-constrained embedded firmware. |
| Flash / RAM | 16 KB flash memory and 512 B RAM - sufficient for standalone sensor firmware with communication stack and calibration data storage. |
| ADC Resolution & Speed | 10-bit, 200-ksps sampling rate with 8-channel autoscan - supports simultaneous multi-sensor analog acquisition in compact systems. |
| Supply Voltage Range | 1.8 V to 3.6 V - compatible with single-cell Li-ion, Li-polymer, or dual-AA alkaline power rails without external regulation. |
| Active Current @ 1 MHz | 230 µA at 2.2 V - enables >1-year operation on a 200-mAh coin cell in duty-cycled sensor applications. |
| Standby Current | 0.5 µA - preserves RAM state while minimizing quiescent drain during extended sleep intervals between measurements. |
| Package | 32-pin VQFN (RHB), 5 mm × 5 mm - provides high I/O density (24 capacitive-touch-capable pins) in space-constrained PCB layouts. |
Pinout & Package
Package: 32-pin VQFN (RHB), 5 mm × 5 mm body size, exposed thermal pad recommended to be connected to DVSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–7, 9–22, 25–31 | General-purpose I/O (P1.x, P2.x, P3.x) | 24 pins support capacitive touch sensing; all feature programmable pullup/pulldown resistors and interrupt capability. |
| 3, 5, 31, 4, 5, 21, 22, 31 | ADC10 analog inputs (A0–A7) | Dedicated analog input channels mapped to P1.0/A0 through P1.7/A7 - enable direct connection of sensors without external muxing. |
| 23, 24 | Spy-Bi-Wire debug interface (SBWTDIO, SBWTCK) | Two-wire JTAG-compatible interface for programming and real-time debugging using TI's MSP-FET or LaunchPad tools. |
| 25, 26 | Crystal oscillator terminals (XOUT, XIN) | Supports 32.768-kHz watch crystal for precise RTC or low-power timing; internal load capacitance eliminates need for external caps in many designs. |
| 27, 28 | Analog/digital ground (AVSS, DVSS) | Separate analog and digital ground pins reduce noise coupling into ADC measurements and improve signal integrity. |
| 29, 30 | Analog/digital supply (AVCC, DVCC) | Independent AVCC rail allows clean analog reference even when DVCC experiences switching noise from digital peripherals. |
| 8, 32 | No-connect (NC) | Unbonded pins; must remain unconnected on PCB to avoid unintended electrical interaction. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power operation | Five power modes including LPM4 (0.1 µA RAM retention); enables multi-year battery life in wireless sensor endpoints. |
| Integrated analog front-end | 10-bit ADC with internal reference, sample-and-hold, and temperature sensor - eliminates need for external precision references or signal conditioning ICs. |
| Capacitive-touch I/O | Up to 24 GPIO pins support capacitive touch sensing without additional hardware - reduces BOM cost and board area for HMI interfaces. |
| Flexible clocking | Calibrated DCO with four factory-trimmed frequencies (1/8/12/16 MHz) plus LF crystal and VLO options - simplifies clock tree design across operating conditions. |
| On-chip emulation | Spy-Bi-Wire interface with 2-pin debug access - enables full firmware development and field updates without dedicated JTAG header space. |
Applications
| Smart Sensor Node | Capacitive Touch Interface |
|---|---|
|
Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and light levels every 30 seconds, transmitting data via UART to a gateway. IC Role / Device Role: Central controller managing sensor polling, ADC conversion, data formatting, and low-power UART transmission. Use Value: 230 µA active current and 0.5 µA standby extend 200-mAh coin cell life beyond 2 years; integrated ADC and USCI eliminate external signal chain components. |
Use Scenario: Touch-sensitive control panel for industrial equipment with 12-button overlay and proximity wake-up. IC Role / Device Role: Capacitive touch controller and system supervisor handling button detection, debounce, and host communication. Use Value: 24 capacitive-touch I/O pins allow direct electrode connection; built-in charge-transfer measurement engine reduces firmware overhead and improves noise immunity. |
| Portable Medical Device | Low-Cost Energy Monitor |
|
Use Scenario: Handheld pulse oximeter acquiring analog photodiode signals, performing LED drive timing, and displaying results on segmented LCD. IC Role / Device Role: Mixed-signal processor executing analog acquisition, digital filtering, and display driver logic. Use Value: Dual Timer_A modules provide precise LED pulse timing and ADC trigger synchronization; 10-bit ADC resolution meets clinical-grade signal fidelity requirements. |
Use Scenario: DIN-rail mounted electricity meter measuring voltage/current via shunt/resistive dividers and logging kWh consumption over time. IC Role / Device Role: Data acquisition unit performing analog-to-digital conversion, RMS calculation, and nonvolatile energy register storage. Use Value: Internal 1.5-V reference ensures stable ADC accuracy across supply voltage drift; 16 KB flash stores firmware and long-term usage history without external EEPROM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430G2433IRHB32R | 8 KB flash, 512 B RAM, same peripherals and package - lacks 16 KB program memory headroom. | Suitable for simpler sensor firmware without complex communication stacks or large lookup tables. | Select when firmware size remains under 8 KB and cost optimization is prioritized over future scalability. |
| MSP430FR2433IRHBR | Ferroelectric RAM (FRAM) instead of flash; 15 KB FRAM, 2 KB RAM; no write endurance limit; higher active current (330 µA @ 1 MHz). | Better suited for frequent data logging or over-the-air updates due to FRAM's instant-write capability and infinite endurance. | Choose for applications requiring high-cycle data writes or where flash erase latency is unacceptable - accept trade-off in power efficiency. |
Compared with MSP430G2433IRHB32R and MSP430FR2433IRHBR, the MSP430G2533IRHB32R delivers optimal balance of memory capacity, ultra-low power, and analog integration for cost-sensitive, battery-operated sensor systems requiring long-term firmware stability and minimal external components.
Availability
MSP430G2533IRHB32R is available at Aetrix Electronics and suitable for smart sensor nodes, capacitive touch interfaces, portable medical devices, and low-cost energy monitors requiring stable component supply and long-term production continuity.
Supply support for MSP430G2533IRHB32R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The MSP430G2xx family targets ultra-low-power, cost-optimized embedded applications - designed specifically for battery-powered sensor systems, portable instrumentation, and human-interface devices where energy efficiency and integration are critical.
FAQ
What is the maximum system clock frequency supported by the MSP430G2533IRHB32R?
The MSP430G2533IRHB32R supports a maximum system clock (MCLK) frequency of 16 MHz at VCC = 3.3 V, 12 MHz at 2.7 V, and 6 MHz at 1.8 V. This is achieved using the factory-calibrated DCO oscillator; external crystals up to 32 kHz are also supported for low-frequency timing. The MSP430G2533IRHB32R maintains full peripheral functionality across this range.
Does the MSP430G2533IRHB32R include an integrated temperature sensor?
Yes, the MSP430G2533IRHB32R integrates a factory-calibrated temperature sensor connected to ADC channel A10. It operates across the full –40°C to +85°C range and requires no external components. Measurement accuracy is ±2.5°C typical, and readings are accessible via the ADC10 module in the MSP430G2533IRHB32R firmware.
Can the MSP430G2533IRHB32R operate from a single 1.8-V supply?
Yes, the MSP430G2533IRHB32R is fully specified for operation from 1.8 V to 3.6 V. At 1.8 V, it supports up to 6 MHz system clock and retains all core functionality including ADC, timers, and USCI. Flash programming requires ≥2.2 V, but normal execution, sleep modes, and peripheral operation are guaranteed down to 1.8 V per the MSP430G2533IRHB32R datasheet.
How many capacitive-touch I/O pins does the MSP430G2533IRHB32R support?
The MSP430G2533IRHB32R supports up to 24 capacitive-touch-enabled I/O pins across Ports P1, P2, and P3. All GPIO pins in the 32-pin RHB package (including P1.0–P1.7, P2.0–P2.7, and P3.0–P3.7) are hardware-capable of capacitive sensing using the built-in RC oscillation method - no external components required for basic touch detection.
What debug interface does the MSP430G2533IRHB32R use, and what tools are compatible?
The MSP430G2533IRHB32R uses the two-wire Spy-Bi-Wire (SBW) interface on pins 23 (SBWTDIO) and 24 (SBWTCK). It is fully compatible with TI's MSP-FET programmer/debugger, MSP430 LaunchPad development kits (e.g., MSP-EXP430G2ET), and IAR Embedded Workbench and Code Composer Studio IDEs - enabling full flash programming, breakpoint debugging, and real-time variable inspection.
MSP430G2533IRHB32R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 32-VFQFN Exposed Pad
- Series:
- MSP430G2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, PWM, WDT
- Number of I/O:
- 24
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430G2533IRHB32R FAQ
1.How can I place an order for MSP430G2533IRHB32R through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430G2533IRHB32R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430G2533IRHB32R reliable?
The price and inventory of MSP430G2533IRHB32R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2533IRHB32R is usually 5 days.
3.What payment methods are accepted for MSP430G2533IRHB32R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430G2533IRHB32R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430G2533IRHB32R?
MSP430G2533IRHB32R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430G2533IRHB32R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430G2533IRHB32R?
For technical support, including MSP430G2533IRHB32R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2533IRHB32R requirements.
6.How does Aetrix verify that MSP430G2533IRHB32R is sourced from the original manufacturer or authorized distributors?
All MSP430G2533IRHB32R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2533IRHB32R meets industry standards.
7.What is the process for return or replacement of MSP430G2533IRHB32R?
All MSP430G2533IRHB32R units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2533IRHB32R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430G2533IRHB32R part is unused and in its original packaging.
Return procedure for MSP430G2533IRHB32R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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