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Texas Instruments MSP430G2533IRHB32T

Part No.:
MSP430G2533IRHB32T
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
32-VFQFN Exposed Pad
Datasheet:
AetrixMSP430G2533IRHB32T.pdf
Description:
IC MCU 16BIT 16KB FLASH 32VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:373

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Product details

Overview

MSP430G2533IRHB32T from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 16 KB flash, 512 B RAM, 10-bit 200-ksps ADC, two 16-bit Timer_A modules (each with three capture/compare registers), USCI supporting UART/LIN/IrDA/SPI/I²C, and up to 24 capacitive-touch I/O pins in a 32-pin VQFN package. It operates from 1.8 V to 3.6 V and targets battery-powered sensor nodes and touch interfaces.

For engineers reviewing the MSP430G2533IRHB32T datasheet, MSP430G2533IRHB32T pinout, MSP430G2533IRHB32T application, or MSP430G2533IRHB32T equivalent, key selection criteria include its 16 KB flash capacity, integrated 10-bit ADC with internal reference, Spy-Bi-Wire debug interface, 32-pin QFN thermal performance, and support for LIN-compliant UART auto-baud detection in low-power systems.

Technical Context

The MSP430G2533IRHB32T implements a 16-bit CPU with constant generators and six operating modes-including five power-saving states-enabling sub-1 µs wake-up from standby (0.5 µA) and ultra-low active current (230 µA at 1 MHz, 2.2 V). Its clock system integrates a digitally controlled oscillator (DCO) with four factory-calibrated frequencies up to 16 MHz, plus support for 32-kHz crystal, internal VLO, and external digital sources.

Peripherals are tightly coupled to low-power operation: the 10-bit ADC supports autoscan across eight channels with sample-and-hold and internal voltage reference; USCI_A0 delivers LIN-capable UART with automatic baud-rate detection; and Timer_A modules provide precise PWM, capture, and interval timing with independent clocking (ACLK, SMCLK, MCLK).

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture 16-bit RISC CPU with 16 registers and constant generators; enables high code efficiency for compact firmware in resource-constrained designs.
Flash / RAM 16 KB flash memory and 512 B RAM; sufficient for standalone sensor fusion, touch controller logic, and LIN protocol stack implementation.
ADC Resolution & Speed 10-bit, 200-ksps SAR ADC with 8-channel autoscan and internal reference; supports simultaneous analog sensing of multiple sensors without external reference components.
Power Consumption 230 µA active @ 1 MHz/2.2 V; 0.5 µA standby; 0.1 µA off-mode with RAM retention; extends coin-cell battery life to multi-year operation in wireless sensor endpoints.
Timer Resources Two 16-bit Timer_A modules, each with three capture/compare registers; enables concurrent PWM generation, input capture for pulse-width measurement, and real-time event scheduling.
Communication Interfaces USCI_A0 (UART/LIN/IrDA/SPI) + USCI_B0 (SPI/I²C); allows dual-protocol connectivity-for example, LIN bus communication to host ECU and I²C sensor data acquisition on same device.
Operating Voltage 1.8 V to 3.6 V supply range; compatible with single-cell Li-ion, LiFePO₄, or dual-AA alkaline battery configurations without LDO overhead.

Pinout & Package

Package: 32-pin VQFN (RHB), 5 mm × 5 mm body, exposed thermal pad (recommended connection to DVSS), 0.5 mm pitch. Designed for high-density PCB layouts and improved thermal dissipation in compact industrial and portable applications.

Pin/Terminal Circuit Role Design Meaning
1–7, 9–19, 21–22, 29–31 General-purpose I/O (P1.x, P2.x, P3.x) 24 total capacitive-touch enabled pins; configurable with pullup/pulldown resistors and interrupt capability for direct button/slider sensing without external RC networks.
3, 5, 11, 14–15, 18–19, 21–22, 31 ADC10 analog inputs (A0–A7) Eight dedicated analog input channels mapped to Port 1 and Port 2 pins; supports differential or single-ended acquisition with internal 1.5-V reference.
23–24 Spy-Bi-Wire debug interface (SBWTDIO, SBWTCK) 2-wire JTAG-compatible programming and emulation; enables in-system debugging using TI MSP-FET or LaunchPad with minimal PCB footprint.
25–26 Crystal oscillator terminals (XOUT, XIN) Supports 32.768-kHz watch crystal for precise real-time clock or low-frequency timing; internal load capacitance eliminates need for external caps in basic configurations.
27, 28, 30 Power rails (AVSS, DVSS, DVCC) Dual ground (analog/digital) and separate analog supply (AVCC) reduce noise coupling into ADC measurements; critical for <1 LSB INL in sensor signal chains.

Key Features

Feature Design Value
Ultra-fast wake-up Sub-1 µs transition from LPM3 standby to active mode; enables duty-cycled sensing with minimal latency and energy penalty per measurement cycle.
Integrated LIN-compliant UART USCI_A0 supports automatic baud-rate detection per ISO 14230; eliminates external LIN transceiver for simple node-level diagnostics and parameter updates over automotive bus.
Capacitive-touch I/O 24 GPIO pins with built-in CSIO (capacitive sense I/O) hardware acceleration; reduces firmware overhead and enables robust touch-button or slider implementation with no external IC.
Digital-controlled oscillator (DCO) Four factory-trimmed frequencies (1/2/4/8/12/16 MHz); provides stable clock source without external crystal for cost-sensitive applications where ±2% accuracy suffices.
Brownout reset (BOR) Detects VCC drop below programmable threshold (1.7–2.7 V); prevents erratic execution during battery depletion or power-supply sag in unregulated systems.
On-chip bootloader (BSL) Serial programming via UART or SPI without external programmer; enables field firmware updates through existing communication interfaces, reducing service costs.

Applications

Smart Sensor Node Capacitive Touch Interface

Use Scenario: Battery-powered temperature/humidity sensor transmitting data via UART to gateway MCU.

IC Role / Device Role / Timing Role: Primary controller executing sensor readout, ADC conversion, data formatting, and LIN-compliant UART transmission; uses DCO for system clock and LPM3 between samples.

Use Value: 0.5 µA standby current and 230 µA active current at 1 MHz enable >5-year operation on CR2032; integrated ADC and UART eliminate discrete signal-conditioning and level-shifting ICs.

Use Scenario: Touch-enabled control panel for HVAC or lighting with 12 buttons and 2 sliders.

IC Role / Device Role / Timing Role: Dedicated capacitive-touch processor scanning electrodes, debouncing inputs, and reporting coordinates via I²C to host MCU; leverages CSIO hardware and timer-driven scan sequencing.

Use Value: 24 touch-capable I/O pins and built-in charge-transfer measurement engine reduce BOM count by 3+ external touch ICs; low-power sleep modes extend panel runtime on backup battery.

Industrial LIN Subnode Portable Data Logger

Use Scenario: Actuator feedback module on automotive or industrial LIN bus reporting position and fault status.

IC Role / Device Role / Timing Role: LIN physical layer interface and application processor handling protocol stack, sensor polling, and error reporting; uses USCI_A0's LIN mode with auto-baud sync.

Use Value: Integrated LIN UART eliminates need for external transceiver (e.g., TJA1020); 16 KB flash stores full LIN 2.2A stack and custom diagnostics; Spy-Bi-Wire enables in-vehicle firmware updates.

Use Scenario: Handheld environmental logger recording temperature, light, and motion every 10 seconds onto internal flash.

IC Role / Device Role / Timing Role: Standalone data acquisition unit managing sensor drivers, timestamping via Timer_A, nonvolatile storage, and USB/UART upload; uses ADC autoscan and DMA-like burst transfers.

Use Value: 10-bit ADC with internal reference ensures consistent measurement accuracy across battery voltage range; 16 KB flash stores >10,000 timestamped samples without external memory.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MSP430G2433IRHB32T 8 KB flash, 512 B RAM, identical peripherals and pinout; lacks 16 KB program space. Suitable for simpler sensor firmware without complex algorithms or large lookup tables. Select when firmware size remains under 8 KB and cost optimization is prioritized over future scalability.
MSP430FR2433IRHBR Ferroelectric RAM (FRAM) instead of flash; 15 KB FRAM, 2 KB RAM; faster write endurance, lower active current (112 µA @ 1 MHz). Enables frequent data logging or configuration updates without flash wear-out concerns; requires different toolchain support. Choose for high-write-cycle applications like black-box logging or parameter tuning where flash endurance is limiting.

Compared with MSP430G2433IRHB32T and MSP430FR2433IRHBR, the MSP430G2533IRHB32T offers the largest flash capacity in the G2x33 QFN family and maintains full peripheral compatibility-making it optimal for feature-rich firmware deployments where code growth headroom and legacy toolchain continuity are critical.

Availability

MSP430G2533IRHB32T is available at Aetrix Electronics and suitable for smart sensor nodes, capacitive touch interfaces, industrial LIN subnodes, portable data loggers, and battery-powered metering systems requiring stable component supply and long-term manufacturability.

Supply support for MSP430G2533IRHB32T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in ultra-low-power microcontrollers for industrial and consumer applications.

The MSP430G2xx family was designed specifically for cost-sensitive, battery-operated applications demanding extended runtime, integrated analog peripherals, and minimal external components-targeting sensor systems, human-interface devices, and simple control nodes.

FAQ

What is the maximum system clock frequency supported by the MSP430G2533IRHB32T?

The MSP430G2533IRHB32T supports a maximum system clock (MCLK) frequency of 16 MHz when VCC ≥ 3.3 V and duty cycle is 50% ±10%. At 2.7 V, max frequency is 12 MHz; at 1.8 V, it is limited to 6 MHz. These limits are defined in the Recommended Operating Conditions table and enforced by the DCO calibration settings stored in flash.

Does the MSP430G2533IRHB32T include hardware support for capacitive touch sensing?

Yes, the MSP430G2533IRHB32T supports capacitive touch sensing on up to 24 I/O pins (P1.x, P2.x, P3.x) using its integrated CSIO (Capacitive Sense I/O) hardware. This includes built-in charge-transfer measurement, software-configurable thresholds, and low-power scan modes-eliminating the need for external touch controller ICs in most button/slider implementations.

Can the MSP430G2533IRHB32T operate without an external crystal?

Yes, the MSP430G2533IRHB32T can operate entirely from its internal digitally controlled oscillator (DCO), which is factory-calibrated at four frequencies (1/2/4/8 MHz) and supports up to 16 MHz. External crystals (e.g., 32.768 kHz) are optional and used only when precise timing-such as RTC or LIN synchronization-is required.

What debug interface does the MSP430G2533IRHB32T use, and what tools are compatible?

The MSP430G2533IRHB32T uses the Spy-Bi-Wire (SBW) interface on pins 23 (SBWTDIO) and 24 (SBWTCK) for programming and debugging. It is fully compatible with TI's MSP-FET debugger, MSP430 LaunchPad development kits (e.g., MSP-EXP430G2ET), and third-party tools supporting SBW, including IAR Embedded Workbench and Code Composer Studio.

How many ADC channels does the MSP430G2533IRHB32T support, and what reference options are available?

The MSP430G2533IRHB32T includes a 10-bit ADC10 module with eight input channels (A0–A7). Reference options include internal 1.5-V or 2.5-V references, external reference applied to VREF+/VREF− pins, or AVCC as reference. Internal references are trimmed and stable across temperature, enabling accurate measurements without external precision voltage sources.

MSP430G2533IRHB32T Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
32-VFQFN Exposed Pad
Series:
MSP430G2xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, PWM, WDT
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430G2533IRHB32T FAQ

1.How can I place an order for MSP430G2533IRHB32T through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430G2533IRHB32T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430G2533IRHB32T reliable?

The price and inventory of MSP430G2533IRHB32T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430G2533IRHB32T is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430G2533IRHB32T?

For technical support, including MSP430G2533IRHB32T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430G2533IRHB32T requirements.

6.How does Aetrix verify that MSP430G2533IRHB32T is sourced from the original manufacturer or authorized distributors?

All MSP430G2533IRHB32T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430G2533IRHB32T meets industry standards.

7.What is the process for return or replacement of MSP430G2533IRHB32T?

All MSP430G2533IRHB32T units undergo pre-shipment inspection (PSI). If there is an issue with MSP430G2533IRHB32T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430G2533IRHB32T part is unused and in its original packaging.

Return procedure for MSP430G2533IRHB32T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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