Texas Instruments MSPM0L1105TDGS20R
- Part No.:
- MSPM0L1105TDGS20R
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 20-TFSOP (0.118", 3.00mm Width)
- Datasheet:
-
MSPM0L1105TDGS20R.pdf
- Description:
- IC MCU 32BIT 32KB FLASH 20TFSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSPM0L1105TDGS20R from Texas Instruments is an ultra-low-power 32-bit Arm® Cortex®-M0+ microcontroller operating up to 32 MHz, featuring 32 KB flash, 4 KB SRAM, a 12-bit 1.68-Msps ADC with 10 external channels, and integrated GPAMP and temperature sensor. It targets battery-powered industrial sensing and power management systems requiring extended temperature operation (–40°C to 105°C) and wide supply range (1.62 V to 3.6 V).
For engineers reviewing the MSPM0L1105TDGS20R datasheet, MSPM0L1105TDGS20R pinout, MSPM0L1105TDGS20R application, or MSPM0L1105TDGS20R equivalent, key selection criteria include its 20-pin VSSOP (DGS) package, 17 GPIOs, dual UART support with LIN/Smart Card, I²C FM+, SPI at 16 Mbit/s, and sub-µA STANDBY/SHUTDOWN modes for energy-constrained designs.
Technical Context
The MSPM0L1105TDGS20R implements a single-core Arm Cortex-M0+ CPU with on-chip SYSOSC (±1.2% accuracy) and LFOSC (±3%), eliminating need for external crystals. Its peripheral bus architecture separates high-speed (MCLK) and ultra-low-power (ULPCLK) domains, enabling concurrent operation of timers, ADC, and communication interfaces in low-power states.
It integrates a 3-channel DMA controller, event fabric for cross-peripheral signaling, four 16-bit general-purpose timers (8 PWM channels), windowed watchdog, CRC-16/32 accelerator, and intelligent I/O with wake-from-SHUTDOWN capability on select pins - all optimized for deterministic real-time control in portable measurement and power delivery applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M0+, 32 MHz max - enables real-time firmware execution with deterministic interrupt latency for closed-loop control. |
| Flash / SRAM | 32 KB / 4 KB - sufficient for bootloader + application code with data buffers in battery-operated edge nodes. |
| ADC | 12-bit, 1.68 Msps, 10 external channels - supports high-resolution voltage/current monitoring in power supplies and battery chargers. |
| Operating Temp | –40°C to 105°C - qualified for industrial environments including building security and grid infrastructure deployments. |
| Supply Range | 1.62 V to 3.6 V - compatible with single-cell Li-ion, 2-cell alkaline, and regulated 3.3 V rails without external LDO. |
| Low-Power Modes | STANDBY: 1.0 µA (32-kHz timer active); SHUTDOWN: 61 nA (IO wakeup) - extends battery life in always-on sensor nodes. |
| Communication | 2× UART (LIN/IrDA/Smart Card), 1× I²C (FM+, 1 Mbit/s), 1× SPI (16 Mbit/s) - enables multi-protocol connectivity in smart peripherals and metering. |
Pinout & Package
Package: 20-pin VSSOP (DGS), body size 5.1 mm × 3 mm, exposed pad not present. Pin count and layout match TI's standardized DGS footprint for drop-in compatibility across MSPM0L110x variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply input | Primary 1.62–3.6 V rail; requires 10 µF bulk capacitor per datasheet Section 7.3. |
| VSS | Ground reference | Common return path for analog/digital domains; must be low-impedance for ADC stability. |
| VCORE | Regulated core output | 1.35 V internal LDO output; requires 470 nF decoupling to VSS for clock integrity. |
| NRST | Active-low reset | Pulled high externally; assertion resets CPU, peripherals, and memory subsystems. |
| PA0 / PA1 | 5-V tolerant open-drain I/O | Support I²C/SMBus level-shifting and LIN bus pull-up without external components. |
| PA20 / PA19 | SWCLK / SWDIO | 2-pin Serial Wire Debug interface - enables full debug visibility with minimal PCB routing. |
| PA27–PA22 | ADC inputs A0–A4 | Dedicated analog inputs with internal routing to ADC0; require external RC filtering per design guidelines. |
| PA23 / PA21 | VREF+ / VREF− | External reference input pair; accepts precision 1.4 V or 2.5 V references for ADC accuracy calibration. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated GPAMP | Single rail-to-rail op-amp with configurable gain; used for sensor signal conditioning before ADC sampling. |
| Configurable VREF | Selectable 1.4 V or 2.5 V internal reference - eliminates external reference IC in cost-sensitive power monitor designs. |
| Event Fabric | 3-channel hardware signaling system - enables timer-triggered ADC conversions or UART wakeup without CPU intervention. |
| Ultra-Low-Power Timers | Four 16-bit timers retain operation in STANDBY mode - supports precise timing for periodic wakeups and PWM generation. |
| UART Protocol Support | LIN, IrDA, DALI, Manchester, Smart Card - simplifies integration into automotive diagnostics, lighting controls, and secure peripherals. |
Applications
| Battery Charging Systems | Smart Power Supplies |
|---|---|
Use Scenario: Real-time monitoring of cell voltage, temperature, and charge current in portable USB-C PD adapters and wireless charging bases. IC Role / Device Role / Timing Role: Main system controller executing state-machine logic, ADC sampling, GPAMP-based current sense amplification, and UART-based host communication. Use Value: 32 KB flash accommodates safety-certified charging algorithms; 1.0 µA STANDBY mode minimizes quiescent drain during idle periods. | Use Scenario: Digital control loop in isolated DC-DC converters and programmable bench supplies with remote monitoring. IC Role / Device Role / Timing Role: Closed-loop feedback processor using ADC inputs and PWM outputs to regulate output voltage/current. Use Value: 12-bit ADC with 1.68 Msps enables fast transient response; dual UART supports both local UI and remote telemetry via LIN or Smart Card protocols. |
| Building Fire Safety Sensors | Grid Infrastructure Monitoring |
Use Scenario: Smoke/CO detector with self-test, battery backup, and wired/wireless alarm reporting in commercial HVAC systems. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating analog smoke chamber signals, thermistor readings, and battery voltage via ADC and GPAMP. Use Value: –40°C to 105°C rating ensures reliability in unconditioned ceiling spaces; 61 nA SHUTDOWN mode preserves battery for >5 years. | Use Scenario: Edge node in distribution automation collecting voltage/current harmonics, temperature, and fault indicators in substations. IC Role / Device Role / Timing Role: Data acquisition engine interfacing CT/PT sensors, performing RMS calculations, and transmitting via I²C to isolation barrier. Use Value: I²C FM+ (1 Mbit/s) enables fast sensor register reads; CRC-32 ensures integrity of telemetry packets over noisy EMI environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSPM0L1106TDGS20R | 64 KB flash (vs. 32 KB), same 4 KB SRAM, identical peripherals and package | Supports larger firmware images (e.g., OTA update stacks, cryptographic libraries) | Select when future firmware expansion or secure boot requirements demand additional program memory. |
| STM32L011K4T6 | ARM Cortex-M0+, 32 MHz, 16 KB flash, 2 KB SRAM, 12-bit ADC (1.14 Msps), 11 GPIOs in 20-pin TSSOP | Limited analog integration (no GPAMP), lower ADC speed, narrower temp range (–40°C to 85°C) | Consider for cost-sensitive, lower-complexity applications where GPAMP and extended temperature are not required. |
Compared with MSPM0L1106TDGS20R, the MSPM0L1105TDGS20R trades flash capacity for lower BOM cost while retaining identical low-power performance and analog features; versus STM32L011K4T6, it delivers higher ADC throughput, integrated amplifier, and industrial-grade thermal resilience at comparable price points.
Availability
MSPM0L1105TDGS20R is available at Aetrix Electronics and suitable for battery charging systems, smart power supplies, and building fire safety sensors requiring stable component supply across long-lifecycle industrial programs.
Supply support for MSPM0L1105TDGS20R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with deep expertise in low-power MCU architecture and industrial signal chain design.
The MSPM0L110x product line was engineered specifically for ultra-low-power, cost-optimized industrial sensing and power management applications - emphasizing analog integration, extended temperature resilience, and protocol-ready communication interfaces.
FAQ
What is the maximum ADC sampling rate supported by the MSPM0L1105TDGS20R?
The MSPM0L1105TDGS20R supports a maximum ADC sampling rate of 1.68 million samples per second (Msps) in its 12-bit mode. This specification is confirmed in the device's Functional Description and Electrical Characteristics sections. The MSPM0L1105TDGS20R achieves this performance using its dedicated ADC clock domain and internal voltage reference, enabling high-fidelity acquisition for power quality monitoring and battery impedance tracking applications.
Does the MSPM0L1105TDGS20R include an integrated operational amplifier?
Yes, the MSPM0L1105TDGS20R includes one general-purpose amplifier (GPAMP) with non-inverting (GPAMP_IN+) and inverting (GPAMP_IN−) inputs and an output (GPAMP_OUT). Pins PA26, PA22, and PA18 are assigned to these functions respectively in the 20-pin VSSOP package. This GPAMP supports rail-to-rail operation and is designed for sensor signal conditioning prior to ADC conversion, reducing external component count in current-sense and thermistor circuits.
What low-power modes are available on the MSPM0L1105TDGS20R and their typical current draw?
The MSPM0L1105TDGS20R offers four defined low-power modes: RUN (71 µA/MHz), STOP (151 µA at 4 MHz), STANDBY (1.0 µA with 32-kHz timer active), and SHUTDOWN (61 nA with IO wakeup). These values are measured under specified conditions in Section 7.5 of the datasheet. The MSPM0L1105TDGS20R maintains full SRAM/register retention and sub-4 µs wakeup time from STANDBY, making it suitable for duty-cycled sensor nodes.
Can the MSPM0L1105TDGS20R operate without an external crystal oscillator?
Yes, the MSPM0L1105TDGS20R operates without an external crystal oscillator. It integrates an internal 4–32 MHz SYSOSC with ±1.2% accuracy and a 32-kHz LFOSC with ±3% accuracy - both sufficient for UART baud rate generation, ADC timing, and real-time clock functions. The MSPM0L1105TDGS20R uses these oscillators exclusively in its default configuration, eliminating BOM cost and board space for external timing components.
How many GPIO pins does the MSPM0L1105TDGS20R provide in its 20-pin VSSOP package?
The MSPM0L1105TDGS20R provides 17 GPIO pins in its 20-pin VSSOP (DGS) package. This count excludes power (VDD, VSS, VCORE), reset (NRST), debug (SWCLK, SWDIO), and dedicated analog (VREF+, VREF−, ADC inputs) pins. All 17 GPIOs support digital I/O functionality, with two (PA0 and PA1) additionally rated as 5-V tolerant open-drain for I²C and LIN bus interfacing - confirmed in Table 6-1 and Section 6.2 of the datasheet.
MSPM0L1105TDGS20R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 20-TFSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 32MHz
- Connectivity:
- DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 17
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSPM0L1105TDGS20R FAQ
1.How can I place an order for MSPM0L1105TDGS20R through Aetrix?
Please submit a Request for Quotation (RFQ) for MSPM0L1105TDGS20R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSPM0L1105TDGS20R reliable?
The price and inventory of MSPM0L1105TDGS20R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSPM0L1105TDGS20R is usually 5 days.
3.What payment methods are accepted for MSPM0L1105TDGS20R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSPM0L1105TDGS20R transactions.
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4.How is shipping managed for MSPM0L1105TDGS20R?
MSPM0L1105TDGS20R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSPM0L1105TDGS20R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSPM0L1105TDGS20R?
For technical support, including MSPM0L1105TDGS20R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSPM0L1105TDGS20R requirements.
6.How does Aetrix verify that MSPM0L1105TDGS20R is sourced from the original manufacturer or authorized distributors?
All MSPM0L1105TDGS20R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSPM0L1105TDGS20R meets industry standards.
7.What is the process for return or replacement of MSPM0L1105TDGS20R?
All MSPM0L1105TDGS20R units undergo pre-shipment inspection (PSI). If there is an issue with MSPM0L1105TDGS20R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSPM0L1105TDGS20R part is unused and in its original packaging.
Return procedure for MSPM0L1105TDGS20R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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