Texas Instruments MSPM0L1106TDGS20R
- Part No.:
- MSPM0L1106TDGS20R
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 20-TFSOP (0.118", 3.00mm Width)
- Datasheet:
-
MSPM0L1106TDGS20R.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 20TFSOP
- Quantity:
- Payment:

- Shipping:

Inventory:5,000
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Product details
Overview
MSPM0L1106TDGS20R from Texas Instruments is an ultra-low-power 32-bit Arm® Cortex®-M0+ microcontroller operating up to 32 MHz, featuring 64 KB flash, 4 KB SRAM, a 12-bit 1.68-Msps ADC with 8 external channels, and integrated GPAMP and temperature sensor. It targets battery-powered industrial sensing and power management systems requiring extended temperature operation (–40°C to 105°C) and sub-µA standby current.
For engineers reviewing the MSPM0L1106TDGS20R datasheet, MSPM0L1106TDGS20R pinout, MSPM0L1106TDGS20R application, or MSPM0L1106TDGS20R equivalent, key selection criteria include its 20-pin VSSOP package with 17 GPIOs (including 2 × 5-V tolerant open-drain), STANDBY mode current of 1.0 µA with 32-kHz timer active, and dual UART support with LIN/IrDA/DALI protocol capability.
Technical Context
The MSPM0L1106TDGS20R implements a single-core Arm Cortex-M0+ CPU with tightly coupled AHB/ULPCLK peripheral buses, enabling concurrent high-speed (MCLK) and ultra-low-power (ULPCLK) domain operation. Its clock system integrates a ±1.2% accurate 4–32 MHz internal SYSOSC and ±3% 32-kHz LFOSC-eliminating need for external crystals.
Digital subsystem includes a 3-channel DMA, four 16-bit timers (eight total PWM outputs), windowed watchdog, and event fabric for low-latency inter-peripheral signaling. Analog subsystem centers on a configurable ADC with selectable 1.4-V/2.5-V internal VREF, GPAMP with differential inputs, and on-die temperature sensor-all accessible in STANDBY mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M0+, 32 MHz max - enables real-time control at low power with Thumb-2 instruction set compatibility |
| Flash / SRAM | 64 KB / 4 KB - sufficient for firmware + data logging in compact embedded applications without external memory |
| ADC Resolution / Speed | 12-bit / 1.68 Msps - supports high-fidelity sensor sampling (e.g., current/voltage monitoring in power supplies) |
| Operating Voltage | 1.62 V to 3.6 V - compatible with single-cell Li-ion, 2-cell alkaline, and regulated 3.3-V rails |
| Temperature Range | –40°C to 105°C - qualified for industrial and automotive under-hood environments |
| STANDBY Current | 1.0 µA with 32-kHz timer running - enables multi-year battery life in wake-on-event sensor nodes |
| GPIO Count / Type | 17 GPIOs, including 2 × 5-V tolerant open-drain - simplifies level-shifting for legacy interfaces and I²C pull-ups |
Pinout & Package
Package: 20-pin VSSOP (DGS20), body size 5.1 mm × 3 mm, exposed pad not present. Pin functions are defined per TI SLASEX5C Rev. January 2024, Section 6.3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply input | Primary 1.62–3.6 V supply rail; requires 10-µF bulk capacitor to VSS |
| VSS | Ground reference | System ground return; connects to all analog/digital ground domains |
| VCORE | Regulated core voltage output | 1.35 V internal LDO output; requires 470-nF decoupling to VSS |
| NRST | Active-low reset input | Must be pulled high to VDD; tied to PA1 on 20-pin variant per datasheet Table 6-1 |
| PA0 / PA1 | 5-V tolerant open-drain I/O | Support I²C/SMBus directly; usable as UART TX/RX with external pull-up |
| PA2 | ROSC input | Connects external resistor to tune internal oscillator accuracy (±1.2%) |
| PA20 / PA19 | SWCLK / SWDIO | 2-pin Serial Wire Debug interface - enables full debug and programming via TI XDS110 |
| A0–A7 | ADC analog inputs | 8 dedicated external ADC channels (A0–A7); A5/A6 also serve as VREF−/VREF+ pins |
| UART0_TX / UART0_RX | Asynchronous serial interface | Hardware UART with CTS/RTS flow control; supports LIN physical layer |
| UART1_TX / UART1_RX | Secondary UART | Independent UART supporting IrDA, DALI, Smart Card, Manchester encoding |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power STANDBY mode | 1.0 µA with 32-kHz timer active and full SRAM/register retention - enables long-duration sleep between sensor reads |
| Configurable ADC voltage reference | Selectable 1.4-V or 2.5-V internal VREF - eliminates external reference ICs for precision measurement |
| Integrated general-purpose amplifier | GPAMP with IN+/IN−/OUT pins - supports signal conditioning (e.g., current-sense amplification) before ADC |
| Protocol-flexible UARTs | Two UARTs supporting LIN, IrDA, DALI, Manchester, Smart Card - reduces need for external protocol translators |
| On-chip temperature sensor | Factory-calibrated sensor with ±2.5°C accuracy - enables thermal monitoring without external components |
Applications
| Battery Charging Systems | Smart Power Supplies |
|---|---|
Use Scenario: Real-time monitoring of cell voltage, charge current, and temperature during fast charging cycles in portable electronics. IC Role / Device Role / Timing Role: Primary system controller executing state-machine logic, ADC sampling, GPAMP-based current sensing, and safety-critical fault response. Use Value: 1.0 µA STANDBY current extends host device shelf life; 12-bit ADC resolution ensures <10-mV voltage accuracy over full temperature range. | Use Scenario: Digital control of isolated DC-DC converters and AC-DC adapters with adaptive load regulation and thermal derating. IC Role / Device Role / Timing Role: Closed-loop feedback controller interfacing with optocouplers, PWM generators, and digital communication (LIN/DALI) for remote status reporting. Use Value: Dual UARTs enable simultaneous host command interface (LIN) and telemetry channel (DALI); 32-MHz CPU handles PID loop updates at ≤100-µs intervals. |
| Industrial Sensor Nodes | Building Fire Safety Devices |
Use Scenario: Wireless smoke/CO sensor with local processing, self-test, and battery-level monitoring deployed in HVAC ducts or ceiling cavities. IC Role / Device Role / Timing Role: Low-power sensor hub aggregating analog inputs (smoke chamber, thermistor), running wake-on-interrupt logic, and managing RF transceiver timing. Use Value: 64 KB flash stores firmware + calibration tables; 1.0 µA STANDBY with 32-kHz wakeup timer achieves >5-year battery life on two AA cells. | Use Scenario: Addressable fire alarm control panel module performing zone supervision, fault detection, and audible/visual alert triggering. IC Role / Device Role / Timing Role: System monitor coordinating multiple sensor inputs (heat, smoke, CO), driving LED indicators, and communicating over RS-485 via UART-to-485 bridge. Use Value: 2 × 5-V tolerant open-drain GPIOs simplify direct connection to legacy 5-V alarm bus; extended –40°C to 105°C rating ensures reliability in attic-mounted enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSPM0L1106TRHB | 32-pin VQFN package; 28 GPIOs; 10 ADC channels; larger footprint (5 mm × 5 mm) | Higher I/O count and ADC channel count suit complex sensor fusion or motor control designs | Select when board space allows and >17 GPIOs or >8 ADC inputs are required |
| MSPM0L1306TDSR | Same 20-pin VSSOP package; adds 12-bit DAC, enhanced analog mux, and higher ADC throughput (2.5 Msps) | Required for closed-loop analog output control (e.g., programmable voltage/current sources) | Select when DAC output or faster ADC sampling is mandatory; otherwise MSPM0L1106TDGS20R offers lower cost and identical package fit |
Compared with MSPM0L1106TRHB and MSPM0L1306TDSR, the MSPM0L1106TDGS20R delivers optimal balance of ultra-low-power operation (1.0 µA STANDBY), compact 20-pin VSSOP footprint, and essential analog integration-making it ideal for cost-sensitive, space-constrained battery-powered systems where DAC or extra GPIOs are unnecessary.
Availability
MSPM0L1106TDGS20R is available at Aetrix Electronics and suitable for battery charging systems, smart power supplies, and industrial sensor nodes requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for MSPM0L1106TDGS20R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.
The MSPM0L1106TDGS20R belongs to the MSPM0 L-Series ultra-low-power MCU family, designed specifically for cost-optimized, battery-operated applications demanding high analog integration, extended temperature resilience, and minimal active/standby power consumption.
FAQ
What is the maximum operating frequency of the MSPM0L1106TDGS20R?
The MSPM0L1106TDGS20R features an Arm Cortex-M0+ CPU with a maximum operating frequency of 32 MHz. This speed is achievable with zero flash wait states at supply voltages ≥2.7 V and one wait state at lower voltages, as specified in Section 7.3 of the SLASEX5C datasheet. The internal SYSOSC provides ±1.2% accuracy across temperature, eliminating crystal dependency while maintaining timing integrity for real-time control tasks executed by the MSPM0L1106TDGS20R.
How many analog input channels does the MSPM0L1106TDGS20R support?
The MSPM0L1106TDGS20R supports eight external analog input channels (A0–A7), as confirmed in Table 5-1 and Section 6.3 of the SLASEX5C datasheet. This count is specific to the DGS20 (20-pin VSSOP) variant; other packages offer up to 10 channels. All eight channels connect directly to the 12-bit, 1.68-Msps ADC and are accessible in STANDBY mode, enabling low-power periodic sensor sampling without full wake-up - a key capability leveraged in battery-powered designs using the MSPM0L1106TDGS20R.
Does the MSPM0L1106TDGS20R include hardware debug support?
Yes, the MSPM0L1106TDGS20R includes 2-pin Serial Wire Debug (SWD) support via dedicated PA20 (SWCLK) and PA19 (SWDIO) pins, as documented in Section 6.3 of the SLASEX5C datasheet. This interface enables full debugging, flash programming, and real-time trace using TI's XDS110 debug probe and Code Composer Studio™ IDE. No external debug header or additional pins are required - the SWD functionality is natively integrated and electrically compatible with standard ARM Cortex-M debug tools, simplifying development for the MSPM0L1106TDGS20R.
What low-power modes are available on the MSPM0L1106TDGS20R?
The MSPM0L1106TDGS20R offers four configurable low-power modes: RUN (71 µA/MHz), STOP (151 µA at 4 MHz), STANDBY (1.0 µA with 32-kHz timer active and full SRAM retention), and SHUTDOWN (61 nA with IO wakeup). STANDBY mode is particularly valuable - it retains all registers and SRAM while allowing 3.2-µs wakeup to full 32-MHz operation, making it ideal for intermittent-sampling applications like environmental monitoring where the MSPM0L1106TDGS20R must maximize battery life without sacrificing responsiveness.
Can the MSPM0L1106TDGS20R drive 5-V logic interfaces directly?
Yes, the MSPM0L1106TDGS20R includes two 5-V tolerant open-drain I/O pins (PA0 and PA1), explicitly listed in Table 5-1 and Section 6.2 of the SLASEX5C datasheet. These pins tolerate up to 5.5 V on input and can sink current when pulled high externally, enabling direct interface with 5-V I²C buses, SMBus peripherals, or legacy UART transceivers without level-shifting circuitry - a critical feature for backward compatibility in industrial upgrades using the MSPM0L1106TDGS20R.
MSPM0L1106TDGS20R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 20-TFSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit
- Speed:
- 32MHz
- Connectivity:
- DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 17
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 3.6V
- Data Converters:
- A/D 8x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSPM0L1106TDGS20R FAQ
1.How can I place an order for MSPM0L1106TDGS20R through Aetrix?
Please submit a Request for Quotation (RFQ) for MSPM0L1106TDGS20R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSPM0L1106TDGS20R reliable?
The price and inventory of MSPM0L1106TDGS20R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSPM0L1106TDGS20R is usually 5 days.
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5.How can I obtain technical support or documentation for MSPM0L1106TDGS20R?
For technical support, including MSPM0L1106TDGS20R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSPM0L1106TDGS20R requirements.
6.How does Aetrix verify that MSPM0L1106TDGS20R is sourced from the original manufacturer or authorized distributors?
All MSPM0L1106TDGS20R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSPM0L1106TDGS20R meets industry standards.
7.What is the process for return or replacement of MSPM0L1106TDGS20R?
All MSPM0L1106TDGS20R units undergo pre-shipment inspection (PSI). If there is an issue with MSPM0L1106TDGS20R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSPM0L1106TDGS20R part is unused and in its original packaging.
Return procedure for MSPM0L1106TDGS20R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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