NXP Semiconductors MVF30NN152CKU26

Overview

MVF30NN152CKU26 from NXP Semiconductors is a dual-core ARM-based crossover processor featuring an ARM Cortex-A5 core operating at 266 MHz and no integrated Cortex-M4 core, housed in a 176-pin LQFP-EP package. It delivers 332.5 DMIPS (1.25 DMIPS/MHz × 266 MHz), supports 1.5 MB on-chip memory (512 KB SRAM + 1 MB graphics SRAM), operates from 3.0–3.6 V, and is rated for –40 °C to +85 °C ambient temperature - designed for industrial HMI and secure embedded control applications.

For engineers reviewing the MVF30NN152CKU26 datasheet, MVF30NN152CKU26 pinout, MVF30NN152CKU26 application, or MVF30NN152CKU26 equivalent, key selection considerations include its A5-only architecture (no M4 co-processor), absence of security features (N = No Security), LQFP-EP 176 package with exposed thermal pad, 266 MHz A5 clock speed, and support for LPDDR2/DDR3, QuadSPI XIP, dual Ethernet, and dual CAN interfaces.

Technical Context

The MVF30NN152CKU26 implements a single ARM Cortex-A5 core without a companion Cortex-M4, distinguishing it from VF6xx series parts. It integrates a 512 KB ECC-protected SRAM block, 1 MB graphics SRAM (non-ECC), and boot ROM, with memory subsystems including 8/16-bit DRAM controller (LPDDR2/DDR3 up to 400 MHz), NAND Flash controller with ECC, FlexBus, and dual QuadSPI supporting execute-in-place.

Its peripheral set includes dual 10/100 Ethernet MACs with IEEE 1588 timer and L2 switch, dual FlexCAN3 controllers, six UART/SCI with LIN/ISO7816/IrDA, four DSPI, four I²C with SMBus, dual USB OTG + PHY, dual SDHC, four SAI, ESAI, SPDIF, dual 12-bit SAR ADC (1 MS/s), and dual 12-bit DAC - all managed under a unified power management system with multiple low-power modes and hardware watchdogs.

Key Specifications

Pinout & Package

LQFP-EP 176 package with 0.5 mm pitch, 24 mm × 24 mm body, and exposed thermal pad on underside for enhanced heat dissipation. Pin 1 marked by dot; pins arranged in four 44-pin sides (A–D). Thermal pad must be soldered to PCB ground plane per NXP AN4807 guidelines.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar crossover processor applications.

Compared with MVF30NN152CKU26, MVF30NN152CMK40 offers identical functionality in a space-efficient BGA package at the cost of assembly complexity, while MVF50NN152CMK40 delivers higher A5 performance for compute-bound tasks - neither provides M4 offload or security extensions present in VF6xx variants.

Availability

MVF30NN152CKU26 is available at Aetrix Electronics and suitable for industrial HMI panels, programmable logic controllers, edge gateways, and medical diagnostic interfaces requiring stable component supply, long-term manufacturability, and industrial temperature qualification.

Supply support for MVF30NN152CKU26 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The Vybrid VF3xx series - including MVF30NN152CKU26 - was engineered as a cost-optimized, industrial-grade crossover processor family bridging application processor performance with microcontroller-like real-time responsiveness and peripheral integration.

FAQ

What is the maximum operating frequency of the MVF30NN152CKU26?

The MVF30NN152CKU26 features a single ARM Cortex-A5 core rated for a maximum operating frequency of 266 MHz. This speed is fixed per the part number suffix '26' and is guaranteed across the full –40 °C to +85 °C ambient temperature range and 3.0–3.6 V supply. The core delivers 332.5 DMIPS (1.25 DMIPS/MHz × 266 MHz) and does not support dynamic frequency scaling beyond this specification.

Does the MVF30NN152CKU26 include a Cortex-M4 core?

No, the MVF30NN152CKU26 does not include a Cortex-M4 core. Its part number prefix 'VF3' denotes the Standard series with Cortex-A5 only; the '0' in position 5 of the part number format confirms absence of M4. In contrast, VF6xx parts (e.g., MVF60NN152CMK40) integrate both A5 and M4 cores. MVF30NN152CKU26 relies solely on the A5 for all processing tasks.

Is security functionality enabled on the MVF30NN152CKU26?

No, the MVF30NN152CKU26 has security disabled, as indicated by the 'N' in the seventh character of its part number (MVF30NN152CKU26). It omits the Cryptographic Acceleration and Assurance Module (CAAM), Secure Non-Volatile Storage (SNVS), TrustZone, High Assurance Boot (HAB), and tamper detection circuitry. For secure boot or encrypted storage, consider MVF30NS152CKU26 or VF6xx-series alternatives.

What package type and thermal requirements apply to the MVF30NN152CKU26?

The MVF30NN152CKU26 uses a thermally enhanced LQFP-EP 176 package (24 mm × 24 mm × 1.6 mm, 0.5 mm pitch) with an exposed copper thermal pad on the underside. This pad must be soldered to a dedicated PCB copper pour connected to ground for effective heat dissipation. Junction temperature must remain ≤105 °C; thermal design should target ≤85 °C under worst-case ambient conditions.

Which memory interfaces are supported by the MVF30NN152CKU26?

The MVF30NN152CKU26 supports LPDDR2/DDR3 (up to 400 MHz, ECC on 8-bit only), 8/16-bit NAND Flash with ECC, 8/16/32-bit FlexBus for legacy parallel devices, and dual QuadSPI with execute-in-place (XIP) capability. It does not support DDR4, LPDDR3, or eMMC. The 512 KB on-chip SRAM includes ECC, and the 1 MB graphics SRAM is non-ECC and configurable as 512 KB graphics + 512 KB L2 cache on select variants.