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STMicroelectronics NAND01GW3B2AN6F

Part No.:
NAND01GW3B2AN6F
Manufacturer:
STMicroelectronics
Category:
Memory
Package:
48-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixNAND01GW3B2AN6F.pdf
Description:
IC FLASH 1GBIT PARALLEL 48TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,728

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Product details

Overview

NAND01GW3B2AN6F from Numonyx is a 1-Gbit, x8-configuration NAND flash memory with 2112-byte pages (2048 + 64 spare), 128K+4K-byte blocks, and 3.0 V operation (2.7–3.6 V). It delivers 25 µs max random access, 30 ns min sequential access, and 200 µs typical page program time. Designed for embedded mass storage in portable electronics, industrial controllers, and firmware update modules where high-density non-volatile storage with hardware write protection is required.

For engineers reviewing the NAND01GW3B2AN6F datasheet, NAND01GW3B2AN6F pinout, NAND01GW3B2AN6F application, or NAND01GW3B2AN6F equivalent, key selection considerations include its TSOP48 package compatibility, open-drain Ready/Busy signaling, cache read/program acceleration, hardware block locking, and ECC-supported 100,000 P/E cycles per block.

Technical Context

This device implements a multiplexed x8 I/O bus with shared address/data lines controlled by AL (Address Latch Enable) and CL (Command Latch Enable), enabling footprint scalability across density variants. Its P/E/R controller manages internal timing, status reporting via an open-drain RB pin, and supports copy-back programming to avoid data retransmission during defective-block relocation.

The memory array is organized into 1024 blocks of 64 pages each, with dedicated spare areas for metadata and ECC. Hardware data protection includes chip-enable "don't care" during latency, WP-pin-driven lock during power transitions, and status register bits (SR0–SR7) indicating error, readiness, and write-protection states.

Key Specifications

Parameter Value and Actual Design Meaning
Density 1 Gbit (128 Mbytes usable with 2048+64 byte pages)
Bus Width x8 - uses I/O0–I/O7 for multiplexed address/data/command
Page Size 2112 bytes (2048 main + 64 spare) - enables robust ECC and metadata storage
Block Size 132 Kbytes (128 K + 4 K spare) - defines minimum erasable unit for wear leveling
Random Access Time 25 µs max - determines latency for small random reads in boot code or config tables
Sequential Access Time 30 ns min - enables high-throughput streaming for firmware images or media buffers
Page Program Time 200 µs typical - sets write bandwidth ceiling for buffered logging or OTA updates
Block Erase Time 2 ms typical - impacts background garbage collection responsiveness in file systems

Pinout & Package

Package: TSOP48 (12 × 20 mm, plastic thin small outline), RoHS-compliant ECOPACK®.

Pin/Terminal Circuit Role Design Meaning
I/O0–I/O7 Multiplexed Data/Address/Command Shared x8 bus for all operations; eliminates dedicated address pins, reducing PCB routing complexity
AL (Address Latch Enable) Address Capture Control Latches column/row addresses during command/address phases; synchronizes multiplexed bus timing
CL (Command Latch Enable) Command Capture Control Latches command codes (e.g., 00h read, 80h program); isolates command phase from address/data phases
E (Chip Enable) Device Selection Active-low enable; "don't care" during latency allows uninterrupted reads during CE toggling
R (Read Enable) Read Strobe Controls output buffer enable and data sampling timing on I/O lines
W (Write Enable) Write Strobe Validates data/command/address setup on rising edge; initiates internal write cycles
WP (Write Protect) Hardware Lock Input Active-low; disables all program/erase when asserted, including during power ramp-up/down
RB (Ready/Busy) Open-Drain Status Output Drives low during P/E/R operations; supports wired-OR connection of multiple NAND devices
VDD Supply Voltage 3.0 V nominal (2.7–3.6 V range); powers core logic and charge pump for programming/erasing
VSS Ground Reference Common return path for all signals and internal circuitry; critical for noise immunity in high-speed I/O

Key Features

Feature Design Value
Cache Read Mode Overlaps data transfer from array to I/O buffer with next-page prefetch, doubling sequential read throughput
Cache Program Mode Loads next page into cache register while current page programs, reducing effective write latency by ~40%
Copy Back Program Relocates data within NAND without host retransmission-critical for bad-block management in FTL layers
Hardware Block Locking Per-block write/erase disable via status register; prevents accidental corruption of boot sectors or calibration data
Serial Number Option Factory-programmed unique identifier (NDA-restricted); enables device traceability and secure provisioning
ECOPACK® Packaging Lead-free, halogen-free TSOP48 compliant with EU RoHS Directive 2011/65/EU and JEDEC standards

Applications

Firmware Storage Module Industrial Data Logger

Use Scenario: Stores bootloader, OS kernel, and field-upgradable firmware images in programmable logic controllers (PLCs).

IC Role / Device Role / Timing Role: Non-volatile code storage with fast sequential read (30 ns) and hardware write protection to prevent corruption during brown-out events.

Use Value: Enables safe over-the-air (OTA) updates via cache read acceleration and copy-back relocation around factory-marked bad blocks.

Use Scenario: Captures sensor readings (temperature, pressure, vibration) at 10 kHz in predictive maintenance gateways.

IC Role / Device Role / Timing Role: High-endurance logging medium supporting 100,000 P/E cycles with ECC-managed reliability over 10-year deployment.

Use Value: Sustains continuous write streams using cache program mode, while hardware block locking preserves configuration partitions from overwrite.

Consumer Portable Media Player Automotive Infotainment Cache

Use Scenario: Holds compressed audio/video assets and UI assets in battery-powered MP3 players and e-readers.

IC Role / Device Role / Timing Role: Cost-optimized mass storage with 2112-byte pages optimized for FAT32 cluster alignment and wear-leveling efficiency.

Use Value: Delivers responsive media playback via 25 µs random access for index lookups and 30 ns streaming for uninterrupted decode.

Use Scenario: Caches map tiles, voice recognition models, and UI assets in head-unit systems requiring AEC-Q100 Grade 3 compliance.

IC Role / Device Role / Timing Role: Secondary storage supplementing eMMC, leveraging TSOP48 thermal profile and stable 3.0 V operation across automotive temperature range.

Use Value: Supports rapid cold-boot asset loading using cache read, while WP pin ensures safety-critical partitions remain immutable during ignition transients.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT29F1G08ABAEAH4 1 Gbit x8, 3.3 V, 48-pin TSOP, 25 µs/25 ns, no cache read, no copy-back Lacks cache acceleration and copy-back; requires host-side bad-block remapping Select when cost sensitivity outweighs throughput and FTL simplicity requirements
TC58NVG1S3ETA00 1 Gbit x8, 3.3 V, 48-pin TSOP, 25 µs/25 ns, supports ONFI 1.0 but no cache modes ONFI interface adds command overhead; no hardware copy-back or cache optimization Prefer for ONFI-standardized systems where interoperability trumps raw performance

Compared with MT29F1G08ABAEAH4 and TC58NVG1S3ETA00, NAND01GW3B2AN6F provides measurable throughput gains via cache read/program and simplifies firmware design with integrated copy-back-reducing host CPU load and improving field reliability in constrained embedded systems.

Availability

NAND01GW3B2AN6F is available at Aetrix Electronics and suitable for firmware storage modules, industrial data loggers, consumer portable media players, and automotive infotainment caches requiring stable component supply, long-lifecycle support, and RoHS-compliant TSOP packaging.

Supply support for NAND01GW3B2AN6F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Numonyx was a fabless semiconductor company formed in 2008 through the merger of Intel's NOR flash division and STMicroelectronics' NOR/NAND business, later acquired by Micron in 2010. It specialized in non-volatile memory solutions for embedded and mobile markets.

NAND01GW3B2AN6F belongs to the NAND01G-B2B family, engineered for cost-effective, high-reliability mass storage in resource-constrained embedded systems-emphasizing hardware-assisted data integrity, power-resilient protection, and scalable density migration.

FAQ

What voltage range does NAND01GW3B2AN6F support, and how does it affect system design?

NAND01GW3B2AN6F operates from 2.7 V to 3.6 V, with typical 3.0 V supply. This wide range accommodates Li-ion battery discharge curves and regulator tolerances without requiring tight voltage regulation. The device maintains full AC/DC specifications across the range, eliminating need for voltage scaling logic or dual-supply interfaces in portable designs.

How does the "chip enable don't care" feature improve system responsiveness?

The chip enable "don't care" feature allows CE transitions during internal latency periods (e.g., after command latch) without aborting ongoing operations. This enables microcontrollers to issue back-to-back commands without waiting for CE deassertion, reducing software overhead and improving real-time predictability in interrupt-driven firmware.

Is ECC mandatory, and what level is required for reliable operation?

Yes-ECC is mandatory for reliable operation. The datasheet specifies 100,000 P/E cycles "with ECC", implying use of at least 4-bit correction per 512-byte sector (e.g., BCH-4). Without ECC, bit errors accumulate rapidly after ~1,000 cycles. Aetrix recommends integrating hardware BCH engines or proven software ECC libraries aligned with the device's spare-area layout (64 bytes/page).

Can NAND01GW3B2AN6F be used in automotive applications, and what qualifications apply?

NAND01GW3B2AN6F itself is not AEC-Q100 qualified, but its TSOP48 package, 3.0 V operation, and hardware write protection make it suitable for under-hood-adjacent infotainment subsystems when paired with external thermal derating and voltage monitoring. For full automotive qualification, refer to Micron's post-acquisition equivalents (e.g., MT29F1G08ABBDAH4) with Grade 3 certification.

NAND01GW3B2AN6F Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
48-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
30ns
Access Time:
30 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TSOP

NAND01GW3B2AN6F FAQ

1.How can I place an order for NAND01GW3B2AN6F through Aetrix?

Please submit a Request for Quotation (RFQ) for NAND01GW3B2AN6F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NAND01GW3B2AN6F reliable?

The price and inventory of NAND01GW3B2AN6F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NAND01GW3B2AN6F is usually 5 days.

3.What payment methods are accepted for NAND01GW3B2AN6F?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NAND01GW3B2AN6F transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for NAND01GW3B2AN6F?

NAND01GW3B2AN6F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NAND01GW3B2AN6F order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NAND01GW3B2AN6F?

For technical support, including NAND01GW3B2AN6F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NAND01GW3B2AN6F requirements.

6.How does Aetrix verify that NAND01GW3B2AN6F is sourced from the original manufacturer or authorized distributors?

All NAND01GW3B2AN6F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NAND01GW3B2AN6F meets industry standards.

7.What is the process for return or replacement of NAND01GW3B2AN6F?

All NAND01GW3B2AN6F units undergo pre-shipment inspection (PSI). If there is an issue with NAND01GW3B2AN6F, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NAND01GW3B2AN6F part is unused and in its original packaging.

Return procedure for NAND01GW3B2AN6F:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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