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STMicroelectronics NAND128W3A0AN6F
- Part No.:
- NAND128W3A0AN6F
- Manufacturer:
- STMicroelectronics
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
NAND128W3A0AN6F.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,431
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Product details
Overview
NAND128W3A0AN6F from STMicroelectronics is a 128 Mbit (16 MB) x8 NAND Flash memory with 1.8V supply, 528-byte page size (512 data + 16 spare), 16 KB block size (16 K + 512 spare), and TSOP48 package. It supports automatic Page 0 read at power-up for boot code loading and features hardware write protection via WP pin. Used in embedded storage modules requiring reliable, low-voltage non-volatile memory.
For engineers reviewing the NAND128W3A0AN6F datasheet, NAND128W3A0AN6F pinout, NAND128W3A0AN6F application, or NAND128W3A0AN6F equivalent, key selection criteria include 1.8V operation, TSOP48 footprint compatibility, Page 0 auto-read boot capability, and support for Copy Back programming to manage bad blocks without host buffering.
Technical Context
This device implements a standard NAND interface with multiplexed I/O[7:0] for address/data/command transfer, using AL, CL, WE, RE, CE, and RB signals to control internal state machines. Its architecture includes a 128 Mbit array organized as 1,024 blocks × 64 pages × 528 bytes per page.
The on-chip P/E/R controller handles page program (200 µs typ), block erase (2 ms typ), and status register polling (SR0 = error flag, SR6 = P/E/R busy, SR7 = write-protect lock). Ready/Busy (RB) is open-drain, enabling wired-OR connection across multiple devices for system-level operation coordination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mbit (16 MB) total capacity, sufficient for firmware storage in resource-constrained embedded systems |
| Interface Bus Width | x8 parallel interface with multiplexed I/O[7:0], reducing pin count while maintaining compatibility across density variants |
| Supply Voltage | 1.8V nominal (1.7–1.95V range), enabling direct integration with low-power microcontrollers and SoCs |
| Page Size | 528 bytes (512 data + 16 spare), supporting ECC metadata storage and wear-leveling metadata per page |
| Block Size | 16,384 bytes (16 KB + 512 spare), defining minimum erasable unit and aligning with typical filesystem block sizes |
| Page Program Time | 200 µs typical, enabling high-throughput firmware updates without excessive host wait states |
| Block Erase Time | 2 ms typical, allowing rapid reconfiguration of storage space during garbage collection or field upgrades |
| Data Retention | 10 years at 25°C, ensuring long-term reliability in industrial and automotive applications without refresh |
Pinout & Package
Package: TSOP48 (12 × 20 mm, 0.5 mm pitch), JEDEC-standard thin small-outline package suitable for automated SMT assembly and board-level stacking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| I/O[7:0] | Multiplexed Data/Address/Command bus | Shared lines reduce footprint; requires AL/CL strobes to latch address/command before data transfer |
| CE# | Chip Enable (active-low) | Enables device; "Don't Care" option allows simplified microcontroller interface without external logic |
| RE# | Read Enable (active-low) | Controls output drivers during read cycles; timing critical for sequential access (50 ns min) |
| WE# | Write Enable (active-low) | Strobes command/address/data into internal registers; governs setup/hold for reliable programming |
| AL | Address Latch Enable | Latches column/row address bits during command sequence; separates address phase from data phase |
| CL | Command Latch Enable | Latches command byte (e.g., 0x00 for read, 0x80 for program); initiates internal state machine transitions |
| WP# | Write Protect (active-low) | Hardware lock preventing accidental program/erase; active during power transitions for robustness |
| RB# | Ready/Busy (open-drain) | Signals internal P/E/R activity; shared pull-up enables multi-device status monitoring with single MCU input |
Key Features
| Feature | Design Value |
|---|---|
| Automatic Page 0 Read at Power-Up | Enables boot-from-NAND without external ROM or bootloader initialization overhead |
| Copy Back Program Mode | Allows page-to-page data relocation within flash without host RAM buffering, accelerating bad-block remapping |
| Chip Enable 'Don't Care' Option | Permits CE# to float or remain inactive during command execution, simplifying glueless MCU interfacing |
| Electronic Signature Read | Provides manufacturer ID (0x20), device ID (0xDA), and extended ID for runtime device identification and BOM validation |
| Status Register Monitoring | SR0 (error), SR6 (busy), SR7 (write-protect lock) enable precise, low-overhead operation status tracking |
Applications
| Industrial HMI Boot Storage | Medical Device Firmware Vault |
|---|---|
Use Scenario: Human-machine interface panel boots directly from NAND upon power-on reset. IC Role / Device Role / Timing Role: Primary non-volatile boot medium storing bootloader and OS kernel image. Use Value: Automatic Page 0 read eliminates need for external boot ROM; 1.8V operation matches low-power display controller supply rails. | Use Scenario: Portable diagnostic instrument stores calibrated firmware and safety-critical configuration data. IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware repository with hardware write protection enabled. Use Value: WP# pin prevents unauthorized firmware modification during field servicing; 100,000 P/E cycles ensure longevity across device lifecycle. |
| Automotive Telematics Log Buffer | Smart Meter Event Recorder |
Use Scenario: In-vehicle telematics unit logs GPS, CAN, and sensor data between cloud sync intervals. IC Role / Device Role / Timing Role: High-endurance cyclic logging medium supporting wear-leveling and bad-block management. Use Value: Copy Back mode accelerates dynamic remapping of failing blocks; 2 ms block erase enables real-time log rotation without interrupt latency spikes. | Use Scenario: Utility smart meter records timestamped energy consumption events for regulatory compliance reporting. IC Role / Device Role / Timing Role: Long-retention, low-power event journal with guaranteed 10-year data integrity at ambient temperature. Use Value: 10-year data retention specification meets ANSI C12.1 and IEC 62056 requirements; TSOP48 package ensures mechanical reliability under thermal cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F128G08CBACAWP | 128 Gbit (16 GB), 3.3V, 2048-byte page, ONFI 3.2 interface | Higher density, faster throughput, but requires ONFI controller and 3.3V supply | Select when scaling storage capacity beyond 16 MB and migrating to standardized high-speed NAND interfaces |
| TC58NVG0S3ETA00 | 1 Gbit (128 MB), 3.3V, 2112-byte page, Toshiba toggle-mode interface | Higher density, toggle DDR interface, no auto Page 0 read or CE don't-care feature | Select for cost-sensitive consumer applications where boot-from-NAND is handled externally and voltage margin allows 3.3V operation |
Compared with MT29F128G08CBACAWP and TC58NVG0S3ETA00, NAND128W3A0AN6F offers unique value in ultra-low-voltage (1.8V) boot-capable embedded designs with minimal glue logic - making it optimal for space- and power-constrained industrial controllers where legacy NAND compatibility and deterministic startup behavior are required.
Availability
NAND128W3A0AN6F is available at Aetrix Electronics and suitable for industrial HMI boot storage, medical device firmware vaults, automotive telematics log buffers, and smart meter event recorders requiring stable component supply and long-term obsolescence planning.
Supply support for NAND128W3A0AN6F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering innovative solutions across automotive, industrial, and embedded markets with strong IP in non-volatile memory and microcontrollers.
NAND128W3A0AN6F belongs to the NAND128-A family, designed specifically for cost-effective, low-voltage mass storage in resource-constrained embedded systems - emphasizing boot capability, hardware data protection, and seamless migration across density variants.
FAQ
Does NAND128W3A0AN6F support x16 bus width?
No. NAND128W3A0AN6F is an x8 device with 8-bit I/O bus (I/O[7:0]). The part number suffix "W3A" indicates 1.8V operation and x8 configuration. x16 variants in this family use different suffixes (e.g., "W3B") and have distinct pinouts and timing - mixing them risks interface failure.
What is the purpose of the "Don't Care" CE option?
The Chip Enable "Don't Care" option allows CE# to remain inactive (high) during command execution phases, eliminating the need for precise CE timing control. This simplifies interface design with microcontrollers lacking dedicated NAND timing logic, enabling glueless connection in cost-sensitive applications.
How does the Copy Back Program Mode improve system reliability?
Copy Back Program allows data from a failing or worn page to be relocated to a healthy page within the same device without transferring data through the host processor. This reduces host RAM usage, shortens remapping time, and minimizes exposure to data corruption during bad-block recovery - critical for real-time embedded systems.
Is automatic Page 0 read compatible with all bootloaders?
Yes - automatic Page 0 read delivers the first 528 bytes (including 16-byte spare area) directly onto I/O[7:0] after power-up, independent of bootloader implementation. However, the bootloader must be designed to interpret the initial data stream correctly and handle ECC correction if spare-area metadata is used for error detection.
NAND128W3A0AN6F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 50ns
- Access Time:
- 50 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
NAND128W3A0AN6F FAQ
1.How can I place an order for NAND128W3A0AN6F through Aetrix?
Please submit a Request for Quotation (RFQ) for NAND128W3A0AN6F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NAND128W3A0AN6F reliable?
The price and inventory of NAND128W3A0AN6F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NAND128W3A0AN6F is usually 5 days.
3.What payment methods are accepted for NAND128W3A0AN6F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NAND128W3A0AN6F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NAND128W3A0AN6F?
NAND128W3A0AN6F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NAND128W3A0AN6F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NAND128W3A0AN6F?
For technical support, including NAND128W3A0AN6F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NAND128W3A0AN6F requirements.
6.How does Aetrix verify that NAND128W3A0AN6F is sourced from the original manufacturer or authorized distributors?
All NAND128W3A0AN6F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NAND128W3A0AN6F meets industry standards.
7.What is the process for return or replacement of NAND128W3A0AN6F?
All NAND128W3A0AN6F units undergo pre-shipment inspection (PSI). If there is an issue with NAND128W3A0AN6F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NAND128W3A0AN6F part is unused and in its original packaging.
Return procedure for NAND128W3A0AN6F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NAND128W3A0AN6F Tags
-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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