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STMicroelectronics NAND512W3A2BZA6E

Part No.:
NAND512W3A2BZA6E
Manufacturer:
STMicroelectronics
Category:
Memory
Package:
63-VFBGA
Datasheet:
AetrixNAND512W3A2BZA6E.pdf
Description:
IC FLASH 512MBIT PAR 63VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,458

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Product details

Overview

NAND512W3A2BZA6E from STMicroelectronics is a 512 Mbit (64 MB) x8 NAND Flash memory with 1.8V supply, 528-byte page size (512 data + 16 spare), 16 KB block size (16K + 512 spare), and VFBGA55 (8 × 10 mm, 0.8 mm pitch) package. It supports automatic Page 0 read at power-up for boot code loading and features hardware write protection via WP pin.

For engineers reviewing the NAND512W3A2BZA6E datasheet, NAND512W3A2BZA6E pinout, NAND512W3A2BZA6E application, or NAND512W3A2BZA6E equivalent, key selection criteria include page/block architecture compatibility, 1.8V I/O tolerance, Ready/Busy open-drain timing, Copy Back program support, and VFBGA55 mechanical footprint alignment with host controller NAND interface routing.

Technical Context

This device implements a standard NAND interface with multiplexed I/O[7:0] for address/data/command transfer, AL/CL control signals for latch timing, and E/R/W/RE/WE logic for command execution. Its internal P/E/R controller manages erase suspend/resume, status register polling (SR0–SR7), and electronic signature verification (0x00EC).

The memory array is organized as 4,096 blocks × 32 pages × 528 bytes, supporting random access (12 µs max), sequential read (50 ns min), page program (200 µs typ), and block erase (2 ms typ). Bad block management relies on factory-marked defective blocks in the first and last pages of each block, flagged via non-FFh values in spare area byte 0.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 512 Mbit (64 MB) total capacity, x8 bus width - defines raw storage volume and minimum system partitioning granularity.
Page Size 528 bytes (512 data + 16 spare) - determines ECC sector boundary, firmware update chunk size, and buffer allocation in host controller.
Block Size 16,384 bytes (16 KB + 512 spare) - sets minimum erasable unit; impacts wear leveling granularity and garbage collection overhead.
Supply Voltage VDD = 1.7–1.95 V - requires dedicated 1.8V LDO; incompatible with 3.3V-only NAND controllers without level shifting.
Page Program Time 200 µs typical - constrains maximum sustained write throughput to ~4.8 MB/s before accounting for inter-page delays.
Block Erase Time 2 ms typical - defines worst-case latency during background erase operations in managed NAND firmware.
Data Retention 10 years at 25°C - specifies maximum archival reliability without refresh; degrades with elevated temperature or program/erase cycling.

Pinout & Package

VFBGA55 (8 × 10 mm, 0.8 mm pitch, 6×8 active ball array) package with 55-ball layout. Ball pitch and pad dimensions comply with JEDEC MO-241AC standard.

Pin/Terminal Circuit Role Design Meaning
I/O[7:0] Multiplexed Data/Address/Command Bus Shared 8-bit path for all transfers; requires AL/CL strobes to distinguish address vs. command vs. data phases.
AL Address Latch Enable Active-low signal latching column/row address bits into internal registers during address phase.
CL Command Latch Enable Active-low signal latching command codes (e.g., 0x00, 0x30, 0x60) into command register.
E Chip Enable Active-low chip select; "don't care" option allows simplified microcontroller interface by ignoring E during command/address setup.
R Read Enable Active-low strobe enabling output drivers for sequential data reads after page load.
W Write Enable Active-low strobe qualifying data writes during command, address, or program data phases.
WP Write Protect Active-low hardware lock disabling all program/erase operations; prevents accidental corruption during power transitions.
RB Ready/Busy Open-drain output indicating internal P/E/R controller activity; low = busy, high = ready (requires external pull-up).
VDD Core Supply 1.7–1.95 V power input; must be filtered per datasheet decoupling requirements (e.g., 100 nF + 1 µF near VDD balls).
VSS Ground Reference return path for all signals; multiple VSS balls required for low-impedance grounding in high-speed operation.

Key Features

Feature Design Value
Automatic Page 0 Read at Power-Up Enables direct boot code execution from NAND without host-side initialization - reduces BOM count and boot time in embedded systems.
Copy Back Program Mode Allows intra-die page-to-page data relocation without external buffering - critical for bad block remapping in firmware-based FTL layers.
Chip Enable 'Don't Care' Option Permits omission of E assertion during command/address setup - simplifies glueless interfacing with 8080-style microcontrollers.
Hardware Data Protection Internal lock during VDD ramp-up/down prevents partial writes/erases - eliminates need for external power-fail detection circuitry.
Status Register Monitoring Real-time visibility into P/E/R progress, error flags (SR0), and write-protection state (SR7) - enables deterministic host driver timeout handling.

Applications

Mobile Handset Storage Industrial HMI Data Logging

Use Scenario: Storing firmware images, OS partitions, and user configuration in cost-sensitive GSM/GPRS handsets with limited PCB area.

IC Role / Device Role / Timing Role: Primary non-volatile boot and application storage; interfaces directly to ARM9-based baseband processor via NAND controller peripheral.

Use Value: VFBGA55 footprint minimizes board space; 1.8V operation aligns with mobile SoC I/O voltage; automatic Page 0 read enables zero-latency boot sequence.

Use Scenario: Capturing sensor readings, alarm logs, and calibration data in panel-mounted HMIs operating continuously in factory environments.

IC Role / Device Role / Timing Role: High-endurance data archive storage; managed by real-time OS with integrated ECC and wear leveling.

Use Value: 100,000 P/E cycles and 10-year retention ensure >5 years of daily logging without replacement; WP pin prevents corruption during brown-out events.

Set-Top Box Firmware Automotive Infotainment Cache

Use Scenario: Holding bootloader, kernel, and middleware updates in DVB-T/C/S receivers where field-upgradability is mandatory.

IC Role / Device Role / Timing Role: Field-programmable firmware repository; accessed via MIPS-based media processor with NAND flash controller IP.

Use Value: Copy Back mode accelerates bad-block recovery during OTA updates; spare area supports embedded ECC metadata without host RAM overhead.

Use Scenario: Caching map tiles, voice recognition models, and UI assets in automotive head units requiring AEC-Q100-compliant components.

IC Role / Device Role / Timing Role: High-reliability cache layer between eMMC main storage and application processor; operates under extended temperature range (-40°C to +85°C).

Use Value: Hardware write protection (WP) prevents accidental overwrite during vehicle ignition transients; 2 ms block erase enables responsive cache invalidation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT29F4G08ABAEAH4-IT:E 4 Gbit density, x8, 1.8V, 4 KB pages, 128 KB blocks, ONFI 2.3 interface Requires ONFI-compliant controller; larger page/block sizes increase ECC complexity and reduce flexibility for small firmware updates Select when higher density and standardized interface outweigh legacy NAND compatibility needs
TC58NVG2S3ETA00 1 Gbit density, x8, 1.8V, 2 KB pages, 128 KB blocks, Toshiba-specific command set Larger block size increases minimum erase granularity; lacks automatic Page 0 read feature Choose for cost-optimized high-density storage where boot-from-NAND is handled externally

Compared with MT29F4G08ABAEAH4-IT:E and TC58NVG2S3ETA00, NAND512W3A2BZA6E offers optimal balance of proven 512 Mbit density, compact 16 KB blocks for efficient wear leveling, and built-in boot capability-making it ideal for resource-constrained embedded designs requiring field-deployable firmware updates.

Availability

NAND512W3A2BZA6E is available at Aetrix Electronics and suitable for mobile handset storage, industrial HMI data logging, and set-top box firmware requiring stable component supply across multi-year production cycles.

Supply support for NAND512W3A2BZA6E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, sensors, and non-volatile memory solutions for industrial, automotive, and consumer markets.

This part belongs to ST's NAND128-A/NAND256-A/NAND512-A/NAND01G-A family - designed specifically for cost-sensitive, high-volume embedded storage applications requiring boot-from-NAND capability, hardware write protection, and long-term data integrity in constrained environments.

FAQ

Does NAND512W3A2BZA6E support true 1.8V I/O signaling, or does it require level shifters with 3.3V controllers?

It supports true 1.8V I/O signaling: all inputs (AL, CL, E, R, W, WP) are 1.8V-tolerant with VIH = 0.7 × VDD and VIL = 0.3 × VDD, and outputs (I/O[7:0], RB) swing rail-to-rail within 1.8V. No level shifter is needed when interfacing with 1.8V microcontrollers or ASICs; however, direct connection to 3.3V controllers requires bidirectional level translation per JEDEC JESD8-12A.

What is the function of the "spare area" in each 528-byte page, and how is it used in practice?

The 16-byte spare area stores ECC parity bytes, logical-to-physical block mapping metadata, wear-leveling counters, and bad block markers. In production firmware, it is written alongside main data during page program and validated during read; factory-bad blocks are marked by non-0xFFh values in spare byte 0, while runtime bad blocks use spare byte 5.

Can the Copy Back Program mode be used across different blocks, or is it restricted to the same block?

Copy Back Program is restricted to pages within the same block: source and destination pages must reside in identical block numbers. This limitation ensures no inter-block timing violations occur during internal data transfer; cross-block copying requires full read-then-write via host controller and external buffer.

How does the "Chip Enable 'Don't Care' option" simplify hardware design, and is it enabled by default?

The option allows AL/CL/W/R signals to be asserted without asserting E, reducing GPIO count and eliminating timing-critical E setup/hold windows. It is enabled by programming bit 0 of the Configuration Register during initial setup; once set, E may be tied permanently low or omitted entirely in new designs.

NAND512W3A2BZA6E Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
63-VFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
50ns
Access Time:
50 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
63-VFBGA (8.5x15)

NAND512W3A2BZA6E FAQ

1.How can I place an order for NAND512W3A2BZA6E through Aetrix?

Please submit a Request for Quotation (RFQ) for NAND512W3A2BZA6E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NAND512W3A2BZA6E reliable?

The price and inventory of NAND512W3A2BZA6E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NAND512W3A2BZA6E is usually 5 days.

3.What payment methods are accepted for NAND512W3A2BZA6E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NAND512W3A2BZA6E transactions.

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NAND512W3A2BZA6E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NAND512W3A2BZA6E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NAND512W3A2BZA6E?

For technical support, including NAND512W3A2BZA6E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NAND512W3A2BZA6E requirements.

6.How does Aetrix verify that NAND512W3A2BZA6E is sourced from the original manufacturer or authorized distributors?

All NAND512W3A2BZA6E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NAND512W3A2BZA6E meets industry standards.

7.What is the process for return or replacement of NAND512W3A2BZA6E?

All NAND512W3A2BZA6E units undergo pre-shipment inspection (PSI). If there is an issue with NAND512W3A2BZA6E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NAND512W3A2BZA6E part is unused and in its original packaging.

Return procedure for NAND512W3A2BZA6E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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