Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Logic > Gates and Inverters

onsemi NC7S00L6X-L22175

Name: NC7S00L6X-L22175
Brand: onsemi
SKU: NC7S00L6X-L22175
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: NC7S00L6X-L22175

Manufacturer:: onsemi

Category:: Gates and Inverters

Package:: 6-UFDFN

Datasheet:: NC7S00L6X-L22175.pdf

Description:: IC GATE NAND 1CH 2-INP 6MICROPAK

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:4,167

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

NC7S00L6X-L22175 from onsemi is a single 2-input high-performance CMOS NAND gate in a leadless MicroPak-6 (SIP6) package, operating across 2 V–6 V supply, with 3.5 ns typical propagation delay at 5 V and ±2 mA balanced output drive. It delivers high noise immunity via three-stage gain and is used in space-constrained logic interfacing, level translation, and enable control in portable industrial sensors.

For engineers reviewing the NC7S00L6X-L22175 datasheet, pinout, applications, or equivalent options, key selection factors include its MicroPak-6 footprint compatibility, 2–6 V wide V_CC range, guaranteed 0.1 V_OL at 2 mA sink, and input leakage <±1.0 µA over −40°C to +85°C.

Technical Context

The NC7S00L6X-L22175 implements a standard two-input NAND Boolean function (Y = A·B) using advanced silicon-gate CMOS technology. Its three-stage inverter chain ensures robust noise margin and insensitivity to input edge rate variation, enabling reliable operation in mixed-signal environments with noisy supply rails.

All inputs and outputs feature integrated ESD protection diodes referenced to V_CC and GND. The device is specified for functional operation from −40°C to +85°C with recommended V_CC between 2.0 V and 6.0 V, and supports dynamic loading up to 15 pF at 1 MHz.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Range	2.0 V to 6.0 V - Enables direct interface with 2.5 V, 3.3 V, and 5 V logic families without level shifters.
t_PD (Typ)	3.5 ns at V_CC = 5 V, C_L = 15 pF - Supports >100 MHz toggle rates in low-load digital control paths.
I_OH/I_OL	−2 mA / +2 mA - Provides symmetrical sourcing/sinking for driving multiple CMOS inputs or small LEDs.
V_OL Max	0.10 V at I_OL = 20 µA - Ensures solid LOW-level recognition even under light capacitive loads.
I_IN Leakage	±1.0 µA max at V_CC = 6.0 V - Minimizes standby current impact in battery-powered wake-up circuits.
Operating Temp	−40°C to +85°C - Qualified for industrial ambient environments without derating.

Pinout & Package

NC7S00L6X-L22175 uses the SIP6 (MicroPak-6) leadless package (1.45 mm × 1.0 mm, 0.5 mm pitch), optimized for ultra-dense PCB layouts and automated reflow assembly. It features exposed die pad for thermal enhancement and requires solder paste stencil design per onsemi BRD8011/D.

Pin/Terminal	Circuit Role	Design Meaning
1 (A)	Input	First NAND input; must be actively driven HIGH or LOW - floating not permitted.
2 (B)	Input	Second NAND input; shares same DC/AC specs as Pin 1, fully interchangeable in layout.
3 (GND)	Ground Reference	Primary return path for all internal logic and I/O currents; connects to PCB ground plane.
4 (Y)	Output	Inverted AND result; capable of sinking 2 mA while maintaining ≤0.1 V_OL.
5 (NC)	No Connect	Internally unconnected; must remain unbonded and unpopulated on PCB - no routing or stitching.
6 (V_CC)	Power Supply	Single positive supply rail; bypass capacitor (100 nF) required within 2 mm of this pin.

Key Features

Feature	Design Value
Three-stage gain architecture	Provides >400 mV noise margin at 3.3 V and reduces sensitivity to slow input edges in noisy systems.
Integrated ESD protection	Diodes on all pins rated to ±20 mA DC clamp current - eliminates need for external TVS in Class 1B IEC 61000-4-2 designs.
Ultra-small MicroPak-6 footprint	1.45 mm × 1.0 mm area - saves >65% board space vs. SC-74A and enables 0.4 mm trace routing in wearables.
Balanced propagation delays	t_PLH and t_PHL differ by <15% across V_CC range - ensures minimal duty-cycle distortion in clocked logic chains.
Pb-free, RoHS-compliant construction	Meets J-STD-020C MSL3 reflow profile - supports lead-free manufacturing without reliability compromise.

Applications

Industrial Sensor Interface	Portable Power Sequencing
Use Scenario: Signal conditioning and enable gating for MEMS pressure sensor output before ADC sampling in a handheld diagnostic tool. IC Role / Device Role / Timing Role: Logic-level NAND gate performing active-low enable control and signal inversion prior to analog front-end. Use Value: Delivers sub-4 ns delay and 0.1 V_OL to ensure clean timing alignment with 1 MSPS SAR ADC sampling window.	Use Scenario: Coordinating power-up sequence of RF transceiver, MCU, and display driver in a Bluetooth LE asset tracker. IC Role / Device Role / Timing Role: Single-gate logic element implementing reset hold-off and voltage-rail interlock functions. Use Value: Wide 2–6 V V_CC range allows direct use from LDO outputs without additional regulators.
IoT Edge Node Wake-Up Logic	Automated Test Equipment (ATE) Signal Conditioning
Use Scenario: Debouncing and combining interrupt signals from motion and ambient light sensors to trigger MCU deep-sleep exit. IC Role / Device Role / Timing Role: Low-power combinatorial logic block generating synchronized wake event pulses. Use Value: Quiescent ICC <10 µA at 3.3 V extends battery life beyond 5 years in coin-cell-powered nodes.	Use Scenario: Level-shifting and polarity correction of TTL-compatible test strobes before FPGA capture in benchtop calibration hardware. IC Role / Device Role / Timing Role: Signal integrity gate ensuring precise edge alignment and impedance-matched drive into 50 Ω traces. Use Value: 3.5 ns t_PD and <10 pF C_IN minimize jitter accumulation across multi-stage test signal paths.

Industrial Sensor Interface

Portable Power Sequencing

Use Scenario: Signal conditioning and enable gating for MEMS pressure sensor output before ADC sampling in a handheld diagnostic tool.

IC Role / Device Role / Timing Role: Logic-level NAND gate performing active-low enable control and signal inversion prior to analog front-end.

Use Value: Delivers sub-4 ns delay and 0.1 V_OL to ensure clean timing alignment with 1 MSPS SAR ADC sampling window.

Use Scenario: Coordinating power-up sequence of RF transceiver, MCU, and display driver in a Bluetooth LE asset tracker.

IC Role / Device Role / Timing Role: Single-gate logic element implementing reset hold-off and voltage-rail interlock functions.

Use Value: Wide 2–6 V V_CC range allows direct use from LDO outputs without additional regulators.

IoT Edge Node Wake-Up Logic

Automated Test Equipment (ATE) Signal Conditioning

Use Scenario: Debouncing and combining interrupt signals from motion and ambient light sensors to trigger MCU deep-sleep exit.

IC Role / Device Role / Timing Role: Low-power combinatorial logic block generating synchronized wake event pulses.

Use Value: Quiescent ICC <10 µA at 3.3 V extends battery life beyond 5 years in coin-cell-powered nodes.

Use Scenario: Level-shifting and polarity correction of TTL-compatible test strobes before FPGA capture in benchtop calibration hardware.

IC Role / Device Role / Timing Role: Signal integrity gate ensuring precise edge alignment and impedance-matched drive into 50 Ω traces.

Use Value: 3.5 ns t_PD and <10 pF C_IN minimize jitter accumulation across multi-stage test signal paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND gate applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74LVC1G00DBVR	SC-70-5 package (2.0 mm × 1.25 mm); 3.7 ns t_PD at 3.3 V; IOH/IOL = ±32 mA.	Higher drive strength suits heavier capacitive loads (>30 pF); larger footprint limits ultra-dense layouts.	Select when higher output current or legacy SC-70 footprint compatibility is required.
74AUP1G00GW,125	SC-88A package; 2.3 ns t_PD at 3.3 V; V_CC = 0.8–3.6 V; ICC < 0.9 µA typical.	Narrower supply range excludes 5 V systems; ultra-low ICC benefits always-on monitoring nodes.	Select when sub-1 µA quiescent current or 0.8 V minimum V_CC is mandatory.

Compared with SN74LVC1G00DBVR and 74AUP1G00GW,125, the NC7S00L6X-L22175 uniquely balances ultra-small MicroPak-6 size, 2–6 V universal supply support, and 2 mA drive - making it optimal for space-constrained industrial modules requiring 5 V compatibility and moderate fan-out.

Availability

NC7S00L6X-L22175 is available at Aetrix Electronics and suitable for industrial sensor interfaces, portable power sequencing, and IoT edge node wake-up logic requiring stable component supply, full RoHS compliance, and MicroPak-6 footprint continuity.

Supply support for NC7S00L6X-L22175 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.

The NC7S00L6X-L22175 belongs to the TinyLogic HS family - designed specifically for high-speed, low-voltage, space-constrained logic interfacing where propagation delay, package size, and supply flexibility are critical.

FAQ

What is the maximum operating temperature for NC7S00L6X-L22175?

The NC7S00L6X-L22175 is rated for continuous operation from −40°C to +85°C ambient temperature. Junction temperature must not exceed +150°C under any condition, and thermal resistance (θ_JA) for the MicroPak-6 package is 154°C/W - requiring appropriate PCB copper area for heat dissipation in sustained high-current scenarios. This rating applies directly to the NC7S00L6X-L22175 as confirmed in the onsemi datasheet Section 3.

Does NC7S00L6X-L22175 require external pull-up resistors on its inputs?

No, NC7S00L6X-L22175 does not require external pull-up resistors because its inputs are CMOS and have negligible leakage (<±1.0 µA). However, unused inputs must be actively tied HIGH or LOW - floating is prohibited per datasheet Section 1. The NC7S00L6X-L22175 has no internal pull-ups; external biasing is only needed if the driving source is open-drain or high-impedance.

Can NC7S00L6X-L22175 operate reliably at 2.0 V supply?

Yes, NC7S00L6X-L22175 is fully specified down to 2.0 V V_CC, with guaranteed VIH = 1.50 V and VIL = 0.50 V at that voltage. Propagation delay increases to 19 ns (typ) at 2.0 V with 50 pF load, but logic functionality remains intact. This capability is explicitly validated in the Recommended Operating Conditions table of the NC7S00 datasheet, confirming NC7S00L6X-L22175's suitability for dual-supply or brown-out tolerant systems.

What is the function of Pin 5 (NC) on NC7S00L6X-L22175?

Pin 5 on NC7S00L6X-L22175 is designated "No Connect" - it is not bonded internally and carries no electrical function. Per the datasheet Pin Descriptions table, this terminal must remain unconnected on the PCB: no trace, no via, no solder mask opening. Routing or terminating Pin 5 may cause mechanical stress or solder bridging in the MicroPak-6 package, compromising NC7S00L6X-L22175 reliability.

Is NC7S00L6X-L22175 pin-compatible with other TinyLogic variants like NC7S04 or NC7S86?

No, NC7S00L6X-L22175 is not pin-compatible with NC7S04 (inverter) or NC7S86 (XOR), as each has distinct logic functions and non-interchangeable pin assignments. While all share the MicroPak-6 package outline, the NC7S00L6X-L22175 pinout (A, B, GND, Y, NC, V_CC) differs fundamentally from NC7S04 (A, GND, Y, V_CC, NC, NC) and NC7S86 (A, B, GND, Y, NC, V_CC). Substitution requires PCB redesign - the NC7S00L6X-L22175 pin mapping is unique to its NAND function.

NC7S00L6X-L22175 Specifications

Product attributes: Attribute value

Manufacturer:: onsemi

Series:: 7S

Package/Case:: 6-UFDFN

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Logic Type:: NAND Gate

Number of Circuits:: 1

Number of Inputs:: 2

Features:: -

Voltage - Supply:: 2V ~ 6V

Current - Quiescent (Max):: 1 µA

Current - Output High, Low:: 2.6mA, 2.6mA

Input Logic Level - Low:: 0.5V

Input Logic Level - High:: 1.5V

Max Propagation Delay @ V, Max CL:: 17ns @ 6V, 50pF

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 6-MicroPak

NC7S00L6X-L22175 FAQ

1.How can I place an order for NC7S00L6X-L22175 through Aetrix?

Please submit a Request for Quotation (RFQ) for NC7S00L6X-L22175 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NC7S00L6X-L22175 reliable?

The price and inventory of NC7S00L6X-L22175 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NC7S00L6X-L22175 is usually 5 days.

3.What payment methods are accepted for NC7S00L6X-L22175?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NC7S00L6X-L22175 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for NC7S00L6X-L22175?

NC7S00L6X-L22175 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NC7S00L6X-L22175 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NC7S00L6X-L22175?

For technical support, including NC7S00L6X-L22175 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NC7S00L6X-L22175 requirements.

6.How does Aetrix verify that NC7S00L6X-L22175 is sourced from the original manufacturer or authorized distributors?

All NC7S00L6X-L22175 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NC7S00L6X-L22175 meets industry standards.

7.What is the process for return or replacement of NC7S00L6X-L22175?

All NC7S00L6X-L22175 units undergo pre-shipment inspection (PSI). If there is an issue with NC7S00L6X-L22175, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NC7S00L6X-L22175 part is unused and in its original packaging.

Return procedure for NC7S00L6X-L22175:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-09 Counterfeit Electronic Components: How to Detect, Authenticate, and Test Suspect Parts

Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…