onsemi NC7SZ08L6X-L22175

Overview

NC7SZ08L6X-L22175 from onsemi is a single two-input AND gate in the TinyLogic UHS family, designed for ultra-high-speed logic interfacing in space-constrained applications. It operates across 1.65 V to 5.5 V V_CC, delivers 2.7 ns typical propagation delay at 5 V into 50 pF, supports ±24 mA output drive at 3 V, and features over-voltage tolerant inputs (up to 5.5 V) independent of supply voltage - enabling robust 5 V-to-3 V level translation in mixed-voltage systems.

For engineers reviewing the NC7SZ08L6X-L22175 datasheet, pinout, applications, or equivalent options, key selection considerations include its MicroPak-6 (SIP6) package footprint, power-down high-impedance I/O behavior, input noise/EMI suppression, and compatibility with low-voltage logic families including LVC and LCX.

Technical Context

The NC7SZ08L6X-L22175 implements a CMOS-based two-input AND function with rail-to-rail input tolerance and active-low/high output swing defined by V_CC. Its propagation delay scales predictably with supply voltage (2.2 ns typ. at 5 V, 5.2 ns typ. at 1.8 V), and it maintains functional integrity across −40 °C to +85 °C ambient temperature.

It integrates proprietary noise/EMI reduction circuitry and exhibits power-down high-impedance behavior when V_CC = 0 V, with input leakage ≤±1 µA and power-off leakage ≤1 µA. Input thresholds are V_IH ≥ 0.70 V_CC and V_IL ≤ 0.30 V_CC for V_CC ≥ 2.3 V, ensuring reliable switching in noisy environments.

Key Specifications

Pinout & Package

NC7SZ08L6X-L22175 is packaged in SIP6 (MicroPak), a 1.45 mm × 1.0 mm, 6-pin, leadless surface-mount package with exposed thermal pad. Pin 1 is marked by a dot or beveled corner; pins are arranged in a single row with no internal die bonding to Pin 5 (NC).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar two-input AND gate applications.

Compared with SN74LVC1G08DBVR and 74AUP1G08GW,125, the NC7SZ08L6X-L22175 uniquely combines 5.5 V input tolerance, 2.7 ns speed at 5 V, and SIP6 miniaturization - making it optimal for mixed-voltage, space-constrained, and timing-critical AND logic functions where level translation and footprint efficiency are design priorities.

Availability

NC7SZ08L6X-L22175 is available at Aetrix Electronics and suitable for industrial PLC I/O modules, USB-C power delivery controllers, automotive body control units, and wearable health sensor hubs requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.

Supply support for NC7SZ08L6X-L22175 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (Nasdaq: ON) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.

The NC7SZ08L6X-L22175 belongs to onsemi's TinyLogic UHS family - engineered for ultra-high-speed, low-voltage logic interfacing in miniaturized, power-sensitive systems where traditional logic families lack speed or voltage flexibility.

FAQ

What is the operating temperature range for NC7SZ08L6X-L22175?

The NC7SZ08L6X-L22175 is specified for operation from −40 °C to +85 °C ambient temperature. This range is validated per JEDEC JESD22-A104 for temperature cycling and JESD22-A108 for steady-state bias life testing. The device maintains full logic functionality and parameter compliance across this range, including propagation delay, output drive, and input threshold specifications - making it suitable for under-hood automotive and industrial edge computing applications.

Does NC7SZ08L6X-L22175 support 5 V input signals when powered from 1.8 V?

Yes, NC7SZ08L6X-L22175 supports input voltages up to 5.5 V regardless of V_CC level. When powered from 1.8 V, its inputs remain tolerant to 5 V signals without damage or latch-up, enabling direct 5 V-to-1.8 V level translation. This is achieved via on-chip input protection structures and is confirmed in the Absolute Maximum Ratings table (VIN max = 6.5 V) and DC Electrical Characteristics (VIH/VIL defined across VCC range).

What is the thermal resistance (θ_JA) of the SIP6 package used by NC7SZ08L6X-L22175?

The thermal resistance θ_JA for NC7SZ08L6X-L22175 in the SIP6 (MicroPak) package is 154 °C/W, as specified in the datasheet's Recommended Operating Conditions table. This value assumes standard JEDEC 2-layer board layout (1 in² copper pad per side, 2 oz Cu). The low θ_JA results from the exposed thermal pad and compact die size, allowing continuous operation at full output drive (±24 mA) without derating up to +85 °C ambient.

Is Pin 5 (NC) on NC7SZ08L6X-L22175 required to be left floating or grounded?

Pin 5 on NC7SZ08L6X-L22175 is designated "No Connect" (NC) and is not internally bonded to the die. It must remain unconnected on the PCB - neither grounded nor tied to V_CC. Connecting Pin 5 may introduce parasitic capacitance or unintended coupling that degrades signal integrity or increases EMI susceptibility. The datasheet explicitly states "NC" in the Pin Definitions table and shows no internal connection in Figure 3 (MicroPak top-through view).

How does the power-down behavior of NC7SZ08L6X-L22175 improve system reliability?

When V_CC = 0 V, NC7SZ08L6X-L22175 places both inputs and output into high-impedance state, preventing back-current flow from other powered sections of the system. This eliminates risk of latch-up, unintended logic transitions, or excessive current draw during partial power-down sequences - a critical feature for hot-swap capable systems and battery-backed subsystems. Measured power-off leakage is ≤1 µA, verified per datasheet Table "IOFF".