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onsemi NCN26010XMNTXG
- Part No.:
- NCN26010XMNTXG
- Manufacturer:
- onsemi
- Category:
- Controllers
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
NCN26010XMNTXG.pdf
- Description:
- ETHERNET CONTROLLER, 10 MB/S, SI
- Quantity:
- Payment:
- Shipping:
Inventory:8,959
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Product details
Overview
NCN26010XMNTXG from onsemi is an IEEE 802.3cg-compliant 10BASE-T1S MAC+PHY IC for industrial multi-drop Ethernet over single unshielded twisted pair (UTP). It integrates Media Access Controller, PLCA Reconciliation Sublayer, and 10BASE-T1S PHY; operates at 10 Mb/s half-duplex; supports Open Alliance MACPHY SPI interface; and delivers fast startup (<100 ms) in sensor interfacing and building control systems.
For engineers reviewing the NCN26010XMNTXG datasheet, pinout, applications, or equivalent options, key selection factors include PLCA-enabled collision-free operation on shared media, enhanced noise immunity mode, 3.3 V single-supply operation, QFN32 4×4 mm package, and support for >8 nodes over >25 m UTP cable.
Technical Context
The NCN26010XMNTXG implements a full 10BASE-T1S physical layer with integrated CSMA/CD MAC and PLCA Reconciliation Sublayer (RS), enabling deterministic, low-latency communication on multi-drop topologies. Its PMA includes enhanced noise immunity (ENI) mode and configurable transmit gain (TX_GAIN), while the PCS handles frame synchronization, FCS generation/checking, and statistic counters.
It communicates via slave-mode Open Alliance–compliant SPI (up to 25 MHz at 3.3 V), supporting 8/16/32/64-byte data chunks, store-and-forward or cut-through operation, and protected/unprotected control transactions. Local configuration enables PLCA coordinator selection, precedence mode, and collision detection masking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 10 Mb/s half-duplex - matches IEEE 802.3cg 10BASE-T1S standard for low-cost industrial Ethernet over single UTP. |
| Supply Voltage | 3.3 V ±10% - single rail simplifies power design; VDDIO supports 2.5 V or 3.3 V I/O logic levels. |
| Operating Temperature | −40 °C to +125 °C - qualified for harsh industrial environments including factory automation and field instrumentation. |
| Power Consumption | 150–215 mW active - enables thermally constrained designs; idle power as low as 55 mW reduces system energy use. |
| Cable Reach | >25 m UTP - supports daisy-chained sensor networks without repeaters in building control or process monitoring. |
| Startup Time | <100 ms - ensures rapid network rejoin after reset or power cycle in time-critical control loops. |
| ESD Rating (LINEP/LINEN) | 8 kV HBM - robust against field-induced transients in industrial wiring environments. |
Pinout & Package
NCN26010XMNTXG is housed in a 4 mm × 4 mm, 0.4 mm pitch QFN32 package (Case 485GH) with exposed thermal pad. The package supports high-density PCB layouts and efficient heat dissipation in compact industrial modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| XO / XI | Crystal oscillator interface | Accepts 25 MHz ±100 ppm crystal or LVCMOS clock; internal oscillator eliminates external oscillator IC. |
| LINEP / LINEN | Differential MDI interface | Direct connection to unshielded twisted pair; supports 10BASE-T1S signaling with 800–1200 mVpp differential output. |
| VDRVN | TX driver regulator output | Requires external 2.2 µF decoupling capacitor; stabilizes analog transmit path for EMI compliance. |
| SCLK / MOSI / MISO / CSn / IRQn / RSTn | Open Alliance MACPHY SPI interface | 4-wire SPI slave interface with interrupt-driven status reporting; supports up to 25 MHz clock at 3.3 V. |
| DIO0 / DIO1 | Configurable GPIO / LED drivers | Programmable pull-up/down; can drive low-current LEDs or external circuitry; used for boot mode strapping (NORMAL/ISOLATED). |
| CLKO | 25 MHz clock output | Provides synchronous clock to host MCU or FPGA; rated for ≤4 LVCMOS loads; requires buffer for 2.5 V I/O. |
Key Features
| Feature | Design Value |
|---|---|
| PLCA Reconciliation Sublayer | Enables deterministic, round-robin arbitration across ≥8 nodes-eliminates CSMA/CD backoff latency and prevents "babbling idiot" failures. |
| Enhanced Noise Immunity Mode | Allows reliable operation under EMI conditions exceeding IEEE 802.3cg specifications-critical for motor drives and factory floor deployments. |
| Integrated MAC + PHY + RS | Reduces BOM count and PCB area vs. discrete MAC+PHY solutions; eliminates interposer timing constraints and signal integrity risks. |
| Isolated Boot Mode | Places all I/O pins in high-impedance until SPI command disables isolation-prevents bus contention during system power sequencing. |
| Factory-Programmed MAC Address | Guarantees globally unique Layer 2 identity out-of-box-simplifies device provisioning and avoids manual MAC assignment in large-scale deployments. |
Applications
| Industrial Automation | Sensor Interfacing |
|---|---|
Use Scenario: Multi-drop Ethernet backbone connecting PLC I/O modules, valve controllers, and HMIs over legacy wiring. IC Role / Device Role / Timing Role: Full MAC+PHY node providing deterministic PLCA-based scheduling and 10BASE-T1S line driving. Use Value: Eliminates need for switches or repeaters; supports >8 nodes per segment up to 25 m-reducing infrastructure cost and installation complexity. | Use Scenario: Distributed temperature, pressure, and vibration sensors in predictive maintenance systems. IC Role / Device Role / Timing Role: Edge node PHY with integrated MAC handling packet framing, FCS, and statistics collection before SPI forwarding to host MCU. Use Value: Enables ultra-low-power sleep modes (55 mW idle); ENI mode maintains link integrity near variable-frequency drives and welding equipment. |
| Home / Building Control | Security and Field Instrumentation |
Use Scenario: Lighting, HVAC, and access control nodes deployed in retrofit installations using existing telephone-grade UTP cabling. IC Role / Device Role / Timing Role: 10BASE-T1S transceiver with Open Alliance SPI interface enabling seamless integration with low-pin-count microcontrollers. Use Value: Fast <100 ms startup allows immediate network participation after power-on-critical for occupancy-sensing lighting controls. | Use Scenario: Remote environmental monitors and security perimeter sensors operating in electrically noisy outdoor enclosures. IC Role / Device Role / Timing Role: Robust PHY with 8 kV HBM ESD protection on LINEP/LINEN and −40 °C to +125 °C operation. Use Value: Survives lightning-induced surges and wide ambient swings; PLCA ensures guaranteed slot access for alarm reporting even under heavy network load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 10BASE-T1S MAC+PHY applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX22503EASA+ | Single-chip 10BASE-T1S PHY only (no integrated MAC or PLCA RS); requires external MCU for MAC-layer functions. | Lacks PLCA arbitration and embedded MAC-suitable for host-controlled networks but not deterministic multi-drop topologies. | Select when host MCU handles MAC/PLCA logic and lower BOM cost outweighs integration benefits of NCN26010XMNTXG. |
| TI DP83TC811RQWR | 10BASE-T1S PHY with integrated MAC but no PLCA RS; supports CSMA/CD only; no ENI mode or isolated boot. | Relies on statistical medium access-unsuitable for time-sensitive control where bounded latency is required. | Choose for simpler CSMA/CD-based networks where deterministic scheduling is not mandated by system architecture. |
Compared with MAX22503EASA+ and DP83TC811RQWR, NCN26010XMNTXG uniquely delivers full PLCA arbitration, factory MAC address, and ENI mode in a single chip-enabling deterministic, noise-resilient, and plug-and-play 10BASE-T1S deployment without host-side protocol stack development.
Availability
NCN26010XMNTXG is available at Aetrix Electronics and suitable for industrial automation, sensor interfacing, and building control applications requiring stable component supply, long-term lifecycle support, and automotive-grade reliability.
Supply support for NCN26010XMNTXG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi is a global semiconductor supplier delivering energy-efficient silicon solutions for automotive, industrial, cloud, medical, and IoT applications.
The NCN26010XMNTXG belongs to onsemi's industrial Ethernet portfolio, designed specifically to enable robust, low-cost, multi-drop 10BASE-T1S networks in space- and power-constrained edge devices.
FAQ
What is the primary compliance standard for NCN26010XMNTXG?
NCN26010XMNTXG is fully compliant with IEEE 802.3cg for 10BASE-T1S Ethernet, including mandatory Physical Layer Collision Avoidance (PLCA) functionality, CSMA/CD support, and electrical characteristics defined for single-pair operation over unshielded twisted pair. It also conforms to Open Alliance TC6 MACPHY SPI interface specification.
Does NCN26010XMNTXG require an external crystal oscillator?
NCN26010XMNTXG supports both external 25 MHz ±100 ppm quartz crystals (connected to XO/XI pins) and LVCMOS clock sources. An external crystal is optional-the device includes integrated oscillator circuitry, and a CMOS clock input may be used instead if system-level timing requirements allow.
How does the PLCA feature in NCN26010XMNTXG improve network performance?
NCN26010XMNTXG implements PLCA via its integrated Reconciliation Sublayer to grant deterministic transmit opportunities using round-robin arbitration. This eliminates CSMA/CD backoff collisions, reduces maximum latency, prevents "babbling idiot" faults, and increases throughput under high load-enabling predictable real-time behavior in industrial control networks.
What are the power supply requirements for NCN26010XMNTXG?
NCN26010XMNTXG operates from a single 3.3 V ±10% supply (VDD) and supports dual I/O voltage options: VDDIO may be set to either 3.3 V or 2.5 V to interface with corresponding host MCU logic levels. All analog and digital supplies are internally regulated, and decoupling capacitors (2.2 µF on VDD/VDRVN/DVDD, 100 nF on VDDIO) are required per the datasheet layout guidelines.
Can NCN26010XMNTXG operate in isolated mode, and how is it enabled?
Yes, NCN26010XMNTXG supports ISOLATED boot mode, activated by asserting DIO1 = 1 during power-up or hard reset. In this mode, all interface pins (except IRQn and SPI lines) remain in high-impedance state until explicitly released via SPI command-preventing bus contention during system power sequencing and enabling safe hot-plug capability in modular architectures.
NCN26010XMNTXG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 32-VFQFN Exposed Pad
- Programmable:
- Not Verified
- Protocol:
- Ethernet
- Function:
- MAC Controller
- Interface:
- SPI
- Standards:
- IEEE 802.3, 10 Base-T PHY
- Voltage - Supply:
- 2.97V ~ 3.63V
- Current - Supply:
- -
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Supplier Device Package:
- 32-QFN (4x4)
- Grade:
- -
- Qualification:
- -
NCN26010XMNTXG FAQ
1.How can I place an order for NCN26010XMNTXG through Aetrix?
Please submit a Request for Quotation (RFQ) for NCN26010XMNTXG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCN26010XMNTXG reliable?
The price and inventory of NCN26010XMNTXG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCN26010XMNTXG is usually 5 days.
3.What payment methods are accepted for NCN26010XMNTXG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCN26010XMNTXG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCN26010XMNTXG?
NCN26010XMNTXG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCN26010XMNTXG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCN26010XMNTXG?
For technical support, including NCN26010XMNTXG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCN26010XMNTXG requirements.
6.How does Aetrix verify that NCN26010XMNTXG is sourced from the original manufacturer or authorized distributors?
All NCN26010XMNTXG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCN26010XMNTXG meets industry standards.
7.What is the process for return or replacement of NCN26010XMNTXG?
All NCN26010XMNTXG units undergo pre-shipment inspection (PSI). If there is an issue with NCN26010XMNTXG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCN26010XMNTXG part is unused and in its original packaging.
Return procedure for NCN26010XMNTXG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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