onsemi NCP114AMX320TCG
- Part No.:
- NCP114AMX320TCG
- Manufacturer:
- onsemi
- Package:
- 4-UDFN Exposed Pad
- Datasheet:
-
NCP114AMX320TCG.pdf
- Description:
- IC REG LINEAR 3.2V 300MA 4UDFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,843
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NCP114AMX320TCG from onsemi is a 300 mA CMOS low-dropout linear regulator with fixed 3.2 V output, 135 mV typical dropout at full load, ±1% output accuracy, and active output discharge function. It operates from 1.7 V to 5.5 V input and delivers ultra-low quiescent current (50 µA typ.) for battery-powered portable electronics requiring stable, low-noise voltage regulation.
For engineers reviewing the NCP114AMX320TCG datasheet, pinout, applications, or equivalent options, key selection criteria include dropout performance at 300 mA, thermal shutdown behavior, EN pin threshold compatibility, and stability with 1 µF ceramic output capacitor in space-constrained designs.
Technical Context
The NCP114AMX320TCG integrates a PMOS pass transistor with dynamic quiescent current adjustment and an internal active discharge switch (100 Ω) activated during shutdown. Its bandgap reference and MOSFET driver support tight line/load regulation (≤30 mV load regulation, UDFN package) and high PSRR (75 dB at 1 kHz).
Designed for noise-sensitive applications, it features thermal shutdown (160 °C trip, 20 °C hysteresis), current limiting (600 mA typ.), and operates stably with 1 µF X7R/X5R ceramic output capacitors without ESR requirements-enabling compact, robust power delivery in portable systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.2 V ±1% at room temperature - ensures precise biasing for 3.3 V–tolerant logic and RF circuitry. |
| Max Output Current | 300 mA continuous - sufficient for powering baseband processors, sensors, or wireless transceivers in handheld devices. |
| Dropout Voltage | 135 mV typical at 300 mA (VOUT = 3.2 V) - enables operation down to VIN = 3.335 V, extending battery runtime in single-cell Li-ion systems. |
| Quiescent Current | 50 µA typical at no load - minimizes standby power loss in always-on subsystems like Bluetooth LE or GPS receivers. |
| PSRR | 75 dB at 1 kHz - suppresses switching noise from adjacent DC-DC converters, critical for analog/RF signal integrity. |
| Enable Threshold | VEN_HI = 0.9 V, VEN_LO = 0.4 V - compatible with 1.8 V/3.3 V GPIOs and supports clean sequencing in multi-rail systems. |
| Active Discharge | 100 Ω pull-down on OUT during shutdown - prevents floating output and ensures fast, controlled discharge of downstream capacitance. |
Pinout & Package
Package: UDFN4 (1.0 mm × 1.0 mm, 0.65 mm pitch, exposed pad), Case 517CU - optimized for thermal dissipation and PCB area efficiency in ultra-thin mobile designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (IN) | Input supply connection | Accepts 1.7–5.5 V; requires ≥1 µF ceramic decoupling capacitor placed adjacent to minimize trace inductance. |
| 2 (GND) | Power ground reference | Primary return path; exposed pad must be soldered directly to large GND copper plane for thermal management (RJA = 170 °C/W). |
| 3 (EN) | Enable control input | Logic-high (>0.9 V) enables regulation; logic-low (<0.4 V) disables output and activates active discharge. |
| 4 (OUT) | Regulated output | Delivers stable 3.2 V; requires ≥1 µF ceramic capacitor to ground for stability; supports active discharge via internal 100 Ω switch. |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic IQ adjustment | Reduces quiescent current to 50 µA at no load while maintaining fast transient response for burst-mode operation. |
| Stable with 1 µF ceramic COUT | Eliminates need for tantalum or high-ESR capacitors, reducing BOM cost and board area in miniaturized layouts. |
| Active output discharge | Ensures rapid, controlled VOUT decay during shutdown-prevents latch-up or unintended wake-up in multi-voltage domain systems. |
| Thermal shutdown + current limit | Protects against sustained overload or poor heatsinking; auto-recovery after die cools below 140 °C avoids manual reset requirement. |
| Pb-free UDFN4 package | Meets RoHS/REACH requirements; 1.0×1.0 mm footprint supports high-density routing and automated optical inspection (AOI). |
Applications
| Smartphone Baseband Power | Bluetooth LE Module Supply |
|---|---|
Use Scenario: Regulating 3.2 V for application processor I/O banks and memory interfaces in smartphones with single-cell Li-ion batteries. IC Role / Device Role / Timing Role: Primary LDO delivering clean, sequenced power with active discharge to prevent back-powering during sleep mode transitions. Use Value: 135 mV dropout extends usable battery range by ~45 minutes at end-of-discharge; ±1% accuracy maintains timing margin for DDR I/O compliance. | Use Scenario: Supplying 3.2 V to Bluetooth Low Energy SoCs in wearables where standby current dominates total system power budget. IC Role / Device Role / Timing Role: Always-on LDO with 50 µA IQ and fast EN turn-on (<100 µs) enabling microsecond-level wake-from-sleep response. Use Value: Active discharge eliminates 10–100 ms residual hold-up time, allowing immediate re-initialization of radio peripherals after wake-up. |
| Portable Medical Sensor Hub | GPS/GLONASS Front-End Bias |
Use Scenario: Powering analog front-end (AFE) and MCU in handheld pulse oximeters or glucose monitors operating from coin-cell or LiPo batteries. IC Role / Device Role / Timing Role: Low-noise (70 µVRMS) LDO supplying precision ADC reference and sensor excitation circuits. Use Value: 75 dB PSRR rejects noise from display drivers or wireless transceivers, preserving <12-bit ENOB in 16-bit ADC measurements. | Use Scenario: Providing regulated 3.2 V bias to GPS RF front-end LNAs and mixers in asset trackers and navigation devices. IC Role / Device Role / Timing Role: Noise-immune LDO placed near RF IC to minimize supply-induced phase noise degradation. Use Value: Ultra-low output noise spectral density (<80 nV/√Hz at 10 kHz) prevents reciprocal mixing that would degrade GPS C/N0 by >2 dB-Hz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCP1700T-3202E/MB | 250 mA max output, 170 mV dropout at 250 mA, no active discharge, SOT-23-5 package | Lacks active discharge and higher current capability; suitable only for non-sequenced, low-power sensor nodes | Select when board space allows SOT-23 and active discharge is unnecessary; verify PSRR (65 dB @ 1 kHz) meets RF noise floor requirements |
| Torex XC6210B322MR-G | 300 mA, 150 mV dropout at 300 mA, 1% accuracy, no active discharge, SOT-25 package | Matches current rating but omits active discharge and has lower PSRR (68 dB @ 1 kHz); uses different EN polarity logic | Consider for cost-sensitive designs where discharge is handled externally; confirm EN pin compatibility (active-high vs. NCP114's active-high with hysteresis) |
Compared with MCP1700T-3202E/MB and XC6210B322MR-G, the NCP114AMX320TCG provides superior dropout performance, integrated active discharge for reliable power sequencing, and higher PSRR-making it optimal for noise-critical, battery-constrained portable systems requiring guaranteed shutdown behavior.
Availability
NCP114AMX320TCG is available at Aetrix Electronics and suitable for smartphone baseband power, Bluetooth LE module supply, portable medical sensor hubs, and GPS front-end bias applications requiring stable component supply, long-term lifecycle support, and Pb-free compliance.
Supply support for NCP114AMX320TCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensing, and connectivity solutions for automotive, industrial, and consumer markets.
The NCP114 product line delivers high-performance, low-IQ LDOs optimized for battery-powered portable electronics-emphasizing ultra-low quiescent current, small-footprint packaging, and robust protection features for space- and power-constrained designs.
FAQ
What is the maximum input voltage rating for the NCP114AMX320TCG?
The NCP114AMX320TCG has an absolute maximum input voltage rating of 6 V. Operation above 5.5 V violates the recommended operating conditions and may cause permanent damage. For reliable long-term use, VIN must remain within 1.7 V to 5.5 V per the datasheet's Electrical Characteristics table.
Does the NCP114AMX320TCG require an external pull-up resistor on the EN pin?
No, the NCP114AMX320TCG does not require an external pull-up resistor on the EN pin. It features an internal pull-down current source (300 nA typ.) that ensures the device remains disabled when EN is left floating. If enable functionality is unused, EN should be tied directly to IN to guarantee activation.
What is the purpose of the active output discharge function in the NCP114AMX320TCG?
The active output discharge function in the NCP114AMX320TCG pulls the OUT pin to GND through a 100 Ω internal resistor when EN < 0.4 V. This rapidly discharges downstream capacitance, preventing floating voltages that could cause latch-up, false wake-ups, or timing violations in multi-rail systems during power-down sequences.
Can the NCP114AMX320TCG operate stably with a 0.47 µF output capacitor?
No-the NCP114AMX320TCG is characterized and guaranteed stable only with ≥1 µF ceramic output capacitance (X5R/X7R). Using 0.47 µF risks instability, overshoot, or oscillation under load transients. The datasheet specifies minimum effective capacitance of 0.22 µF only to account for DC-bias derating of small-case MLCCs-not as a design target.
How does thermal performance differ between the UDFN4 and TSOP-5 packages for the NCP114AMX320TCG?
The UDFN4 package (Case 517CU) achieves RJA = 170 °C/W on a 1 oz FR-4 PCB with 645 mm² copper, while the TSOP-5 (Case 483) yields RJA = 236 °C/W under identical conditions. The UDFN4's exposed pad enables significantly better heat transfer, allowing higher continuous current or operation in higher ambient temperatures without thermal shutdown.
NCP114AMX320TCG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- 4-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.2V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- -
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 95 µA
- Current - Supply (Max):
- -
- PSRR:
- 75dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-UDFN (1.0x1.0)
NCP114AMX320TCG FAQ
1.How can I place an order for NCP114AMX320TCG through Aetrix?
Please submit a Request for Quotation (RFQ) for NCP114AMX320TCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCP114AMX320TCG reliable?
The price and inventory of NCP114AMX320TCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP114AMX320TCG is usually 5 days.
3.What payment methods are accepted for NCP114AMX320TCG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP114AMX320TCG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCP114AMX320TCG?
NCP114AMX320TCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCP114AMX320TCG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCP114AMX320TCG?
For technical support, including NCP114AMX320TCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP114AMX320TCG requirements.
6.How does Aetrix verify that NCP114AMX320TCG is sourced from the original manufacturer or authorized distributors?
All NCP114AMX320TCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP114AMX320TCG meets industry standards.
7.What is the process for return or replacement of NCP114AMX320TCG?
All NCP114AMX320TCG units undergo pre-shipment inspection (PSI). If there is an issue with NCP114AMX320TCG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCP114AMX320TCG part is unused and in its original packaging.
Return procedure for NCP114AMX320TCG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NCP114AMX320TCG Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

