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onsemi NCP115AMX120TBG
- Part No.:
- NCP115AMX120TBG
- Manufacturer:
- onsemi
- Package:
- 4-XDFN Exposed Pad
- Datasheet:
-
NCP115AMX120TBG.pdf
- Description:
- IC REG LINEAR 1.2V 300MA 4XDFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,575
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Product details
Overview
NCP115AMX120TBG from onsemi is a 300 mA, 1.2 V fixed-output low-dropout linear regulator in XDFN4 package, featuring ±1% output accuracy, 70 dB PSRR at 1 kHz, and 250 mV typical dropout at 300 mA (VOUT = 2.8 V), designed for noise-sensitive battery-powered applications including mobile phone baseband processors and camera sensor power rails.
For engineers reviewing the NCP115AMX120TBG datasheet, pinout, applications, or equivalent options, key selection criteria include its active output discharge function (100 Ω), normal slew-rate (190 mV/s), 50 µA typical quiescent current, and stability with only 1 µF ceramic output capacitor - critical for space-constrained portable designs.
Technical Context
The NCP115AMX120TBG implements a PMOS pass transistor architecture enabling reverse-current blocking and active output discharge during shutdown. Its dynamic quiescent current adjustment maintains ultra-low IQ across load conditions, while internal thermal shutdown (160°C) and current limiting (600 mA typ.) ensure robust operation under fault conditions.
This variant belongs to the NCP115A series, confirming normal VOUT slew rate (190 mV/s), active discharge capability, and XDFN4 1.0×1.0 mm package with exposed pad. It operates across 1.7–5.5 V input range and delivers 1.2 V output with ±1% accuracy over −40°C to +85°C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 1.2 V ±1% at room temperature - ensures precise core voltage for low-power microcontrollers and sensors. |
| Max Output Current | 300 mA continuous - supports moderate-power RF transceivers and display drivers without external boost. |
| Dropout Voltage | 250 mV typical at 300 mA (VOUT = 2.8 V) - enables operation from single-cell Li-ion (3.0 V min) with margin. |
| PSRR | 70 dB at 1 kHz - suppresses switching noise from adjacent DC-DC converters in mixed-signal SoC power domains. |
| Quiescent Current | 50 µA typical at no load - extends battery life in always-on sensor nodes and wearable standby modes. |
| Shutdown Current | 0.01 µA typical - reduces system leakage during deep sleep, critical for multi-week battery runtime. |
| Active Discharge Resistance | 100 Ω - rapidly discharges output capacitance (<1 ms for 1 µF) to prevent latch-up in multi-rail sequencing. |
Pinout & Package
XDFN4 1.0×1.0 mm package with exposed thermal pad (Case 711AJ); requires direct solder connection of EPAD to ground plane for thermal performance (RJA = 208°C/W on 1 oz FR4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (IN) | Input supply connection | Accepts 1.7–5.5 V; requires ≥1 µF ceramic capacitor close to pin to suppress high-frequency noise and stabilize transient response. |
| 2 (GND) | Power ground reference | Common return path for IN, OUT, and EN; must be connected to large copper pour and tied directly to EPAD for thermal management. |
| 3 (EN) | Enable control input | Logic-high (>0.9 V) enables regulation; logic-low (<0.4 V) disables output and activates 100 Ω discharge path to GND. |
| 4 (OUT) | Regulated output | Delivers stable 1.2 V; requires ≥1 µF X5R/X7R ceramic capacitor placed adjacent to pin for loop stability and load transient suppression. |
| EPAD | Exposed thermal pad | Not electrically active; must be soldered to solid GND plane to achieve specified RJA and prevent thermal shutdown at >150°C junction. |
Key Features
| Feature | Design Value |
|---|---|
| Active output discharge | 100 Ω pull-down on OUT during disable - eliminates hold-up voltage that could cause downstream IC latch-up or false wake-up. |
| Normal slew-rate option | 190 mV/s VOUT ramp-up - balances fast turn-on against inrush current and avoids overshoot in digital load sequencing. |
| Ultra-low quiescent current | 50 µA typical at zero load - enables >1-year battery life in coin-cell-powered IoT endpoints with periodic wake cycles. |
| Stable with minimal capacitance | 1 µF ceramic output capacitor sufficient - reduces BOM count and PCB area vs. legacy LDOs requiring ≥10 µF tantalum. |
| High PSRR at audio band | 70 dB @ 1 kHz - rejects ripple from buck converter switching frequencies and their harmonics in RF front-end biasing. |
Applications
| Mobile Baseband Power | Camera Sensor Bias |
|---|---|
Use Scenario: Powering ARM Cortex-M4 core and peripheral I/O in smartphone application processors during active mode. IC Role / Device Role / Timing Role: Primary 1.2 V core LDO delivering clean, low-noise supply with fast load transient response to handle burst-mode CPU activity. Use Value: Maintains <±1% regulation during 0–300 mA load steps (tFALL = 1 µs), preventing core voltage collapse and system reset. |
Use Scenario: Supplying image sensor analog front-end (AFE) and phase-locked loop (PLL) circuits in dual-camera modules. IC Role / Device Role / Timing Role: Low-noise 1.2 V bias rail with 70 dB PSRR suppressing switching noise from nearby PMICs to preserve SNR. Use Value: Delivers 62.3 µVRMS output noise (10 Hz–100 kHz) at 300 mA, meeting CIS image sensor noise floor requirements. |
| Wearable Heart Rate Monitor | Bluetooth LE Peripheral |
Use Scenario: Powering optical heart rate sensor ASIC and ADC in fitness tracker wristbands. IC Role / Device Role / Timing Role: Always-on 1.2 V supply with 0.01 µA shutdown current, enabling multi-week battery life in sleep mode. Use Value: Reduces system standby power by >95% vs. non-shutdown regulators, extending CR2032 coin cell lifetime to 18+ months. |
Use Scenario: Providing regulated 1.2 V to Bluetooth 5.0 SoC RF transceiver during advertising and connection intervals. IC Role / Device Role / Timing Role: Fast-enabling LDO with 190 mV/s slew rate synchronizing VOUT ramp with BLE stack wake timing. Use Value: Achieves 98% VOUT within 6.3 ms (1.2 V / 190 mV/s), eliminating RF initialization delays and improving connection latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6210B122MR-G | 1.2 V fixed, 300 mA, 250 mV dropout, but no active discharge; 1.5 µA IQ in shutdown. | Lacks output discharge - unsuitable for systems requiring strict power-rail sequencing or multi-voltage domain isolation. | Select when active discharge is unnecessary and lowest possible shutdown IQ is prioritized over sequencing safety. |
| Richtek RT9013-12GB | 1.2 V fixed, 300 mA, 220 mV dropout, 25 µA IQ, but only 55 dB PSRR at 1 kHz and no active discharge. | Lower PSRR limits use in RF-sensitive applications; missing discharge increases risk of backfeed in multi-rail systems. | Choose for cost-sensitive consumer electronics where PSRR >65 dB and active discharge are not required. |
Compared with Torex XC6210B122MR-G and Richtek RT9013-12GB, the NCP115AMX120TBG uniquely combines 100 Ω active discharge, 70 dB PSRR, and 50 µA operating IQ - making it optimal for sequenced, noise-critical, battery-constrained designs where reliability and signal integrity are non-negotiable.
Availability
NCP115AMX120TBG is available at Aetrix Electronics and suitable for mobile phone baseband power, wearable sensor bias, Bluetooth LE peripherals, and camera module applications requiring stable component supply with full traceability and long-term lifecycle support.
Supply support for NCP115AMX120TBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient electronics, delivering power management, analog, sensor, and connectivity solutions for automotive, industrial, and cloud infrastructure markets.
The NCP115AMX120TBG belongs to onsemi's high-PSRR LDO family engineered specifically for battery-powered portable electronics - emphasizing ultra-low IQ, fast transient response, and integrated protection for reliable operation in space- and power-constrained environments.
FAQ
What is the output voltage tolerance of the NCP115AMX120TBG over temperature?
The NCP115AMX120TBG provides ±1% output voltage accuracy at room temperature (25°C). Over the full operating junction temperature range (−40°C to +85°C), the device maintains tight regulation: for VOUT ≤ 2.0 V, the deviation is ±40 mV, ensuring stable 1.2 V supply even in thermally demanding handheld enclosures.
Does the NCP115AMX120TBG support active output discharge, and how does it function?
Yes, the NCP115AMX120TBG includes active output discharge. When the EN pin voltage drops below 0.4 V, the internal 100 Ω discharge transistor connects OUT to GND, rapidly discharging external capacitors. This feature prevents residual voltage from causing unintended behavior in downstream circuitry during power-down sequences.
What is the minimum output capacitor required for stability with the NCP115AMX120TBG?
The NCP115AMX120TBG is stable with a minimum 1 µF X5R or X7R ceramic output capacitor. The datasheet confirms stability down to 0.47 µF (accounting for DC bias and temperature derating), making it compatible with compact 0402-case MLCCs - reducing PCB footprint versus legacy LDOs requiring larger capacitors.
How does the NCP115AMX120TBG achieve low quiescent current in battery-powered applications?
The NCP115AMX120TBG employs dynamic quiescent current adjustment, reducing IQ to 50 µA typical at no load and maintaining ultra-low consumption across varying input voltages and temperatures. In shutdown mode (EN < 0.4 V), it draws just 0.01 µA, significantly extending battery life in always-on IoT and wearable devices.
What package type and thermal characteristics apply to the NCP115AMX120TBG?
The NCP115AMX120TBG uses the XDFN4 1.0×1.0 mm package (Case 711AJ) with an exposed thermal pad. Its junction-to-ambient thermal resistance is 208°C/W on standard 1 oz FR4 PCB with 645 mm² copper area. Proper EPAD grounding is mandatory to avoid thermal shutdown under 300 mA load at elevated ambient temperatures.
NCP115AMX120TBG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- 4-XDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.2V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- -
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 95 µA
- Current - Supply (Max):
- -
- PSRR:
- 70dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-XDFN (1x1)
NCP115AMX120TBG FAQ
1.How can I place an order for NCP115AMX120TBG through Aetrix?
Please submit a Request for Quotation (RFQ) for NCP115AMX120TBG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCP115AMX120TBG reliable?
The price and inventory of NCP115AMX120TBG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP115AMX120TBG is usually 5 days.
3.What payment methods are accepted for NCP115AMX120TBG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP115AMX120TBG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCP115AMX120TBG?
NCP115AMX120TBG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCP115AMX120TBG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCP115AMX120TBG?
For technical support, including NCP115AMX120TBG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP115AMX120TBG requirements.
6.How does Aetrix verify that NCP115AMX120TBG is sourced from the original manufacturer or authorized distributors?
All NCP115AMX120TBG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP115AMX120TBG meets industry standards.
7.What is the process for return or replacement of NCP115AMX120TBG?
All NCP115AMX120TBG units undergo pre-shipment inspection (PSI). If there is an issue with NCP115AMX120TBG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCP115AMX120TBG part is unused and in its original packaging.
Return procedure for NCP115AMX120TBG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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