My Inquiry
My Account
onsemi NCP154MX310310TAG
- Part No.:
- NCP154MX310310TAG
- Manufacturer:
- onsemi
- Package:
- 8-XFDFN Exposed Pad
- Datasheet:
-
NCP154MX310310TAG.pdf
- Description:
- IC REG LINEAR 3.1V/3.1V 8XDFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,895
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NCP154MX310310TAG from onsemi is a dual-output, 300 mA low-dropout linear voltage regulator with independent input pins (IN1/IN2), fixed 3.1 V / 3.1 V outputs, ultra-low noise (75 µVRMS, 10 Hz–100 kHz), 75 dB PSRR at 1 kHz, and adaptive ground current for battery-powered RF systems.
For engineers reviewing the NCP154MX310310TAG datasheet, pinout, applications, or equivalent options, this page delivers verified electrical specs, XDFN8 package layout, dual-channel enable control logic, thermal shutdown behavior, and real-world load transient performance data for portable power rail design.
Technical Context
The NCP154MX310310TAG integrates two independent PMOS LDO regulators sharing a common ground but with separate input, enable, and output terminals-enabling asymmetric supply sequencing and independent channel shutdown. Each channel features active discharge (50 Ω pull-down) and thermal shutdown (160 °C trip, 20 °C hysteresis).
It operates across 1.9 V to 5.25 V input range, delivers ±2% output accuracy for VOUT > 2 V, maintains stability with only 1 µF ceramic output capacitors, and achieves 140 mV typical dropout at 300 mA for 3.3 V output (scaling per VOUT spec).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | 3.1 V / 3.1 V (dual fixed, ±2% accuracy over −40°C to +85°C) |
| Max Output Current | 300 mA per channel (400 mA current limit, short-circuit protected) |
| Dropout Voltage | 150 mV typical at 300 mA (for 3.1 V output, derived from 3.0 V/3.3 V interpolation in Table 4) |
| PSRR | 75 dB at 1 kHz (enables clean RF biasing without external filtering) |
| Quiescent Current | 55 µA per channel (typical, enables multi-day battery life in standby) |
| Noise | 75 µVRMS (10 Hz–100 kHz, no bypass capacitor required) |
| Enable Threshold | EN high ≥0.9 V, EN low ≤0.4 V (TTL-compatible, internal 300 nA pull-down) |
Pinout & Package
XDFN8 package (1.2 mm × 1.6 mm, 0.4 mm pitch), thermally enhanced with exposed pad tied to GND; 8-pin layout supports compact, high-density PCB placement with minimal thermal resistance (θJA = 160 °C/W on 1 oz FR4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4 | GND | Power ground reference; both pins must be connected to PCB ground plane for thermal and EMI performance |
| 2 | OUT1 | Regulated 3.1 V output; requires 1 µF ceramic capacitor to GND for stability |
| 3 | OUT2 | Regulated 3.1 V output; independent of OUT1, stable with same 1 µF ceramic capacitor |
| 5 | EN2 | Enable control for OUT2; <0.4 V disables OUT2 and activates 50 Ω active discharge to GND |
| 6 | IN2 | Input supply for OUT2; decoupled with 1 µF ceramic capacitor close to pin |
| 7 | IN1 | Input supply for OUT1; electrically isolated from IN2, enabling dual-input flexibility |
| 8 | EN1 | Enable control for OUT1; identical logic to EN2, supporting independent channel sequencing |
| EP | Exposed Pad | Thermal and electrical connection to GND; mandatory soldering for thermal dissipation and EMI reduction |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent inputs | Enables separate power domains (e.g., VBAT and USB input) without external diode OR-ing |
| Active output discharge | 50 Ω pull-down per channel ensures fast, controlled turn-off (<1 ms decay for 1 µF load) |
| Ultra-low noise operation | 75 µVRMS noise without external bypass caps-critical for RF transceiver LNA/VCO rails |
| Adaptive ground current | Reduces IQ to 55 µA/channel at light load, extending battery runtime in sleep modes |
| Stable with 1 µF ceramic COUT | Eliminates need for large or high-ESR capacitors, reducing BOM cost and board area |
Applications
| Smartphone Core Logic Power | Wireless LAN Baseband Supply |
|---|---|
Use Scenario: Dual 3.1 V rails powering application processor I/O and memory interface in space-constrained smartphone mainboard. IC Role / Device Role / Timing Role: Primary dual-LDO regulator delivering tightly regulated, low-noise 3.1 V supplies with independent enable control for power sequencing. Use Value: Enables simultaneous voltage ramp-up/down of two critical subsystems while maintaining <±2% regulation under 300 mA dynamic load steps. | Use Scenario: Providing clean 3.1 V bias to WLAN baseband IC and RF front-end in tablet designs. IC Role / Device Role / Timing Role: Low-PSRR, low-noise dual regulator isolating sensitive analog RF sections from noisy digital domains. Use Value: 75 dB PSRR at 1 kHz suppresses switching noise from adjacent DC-DC converters, preventing RX desensitization. |
| Bluetooth Audio SoC Core | Industrial IoT Sensor Hub |
Use Scenario: Powering dual-core Bluetooth audio SoC requiring matched 3.1 V supplies for DSP and radio subsystems. IC Role / Device Role / Timing Role: Dual-output LDO with independent EN pins enabling staggered wake-up of processing and RF blocks. Use Value: Active discharge on each channel ensures rapid rail collapse during sleep transitions, meeting Bluetooth LE deep-sleep current targets. | Use Scenario: Regulating 3.1 V for microcontroller and 3.1 V for precision ADC/sensor interface in battery-operated edge node. IC Role / Device Role / Timing Role: High-accuracy, low-IQ dual LDO supporting long-life operation with thermal shutdown protection in unventilated enclosures. Use Value: ±2% output accuracy and 160 °C thermal shutdown prevent sensor drift and ensure system reliability across −40°C to +85°C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-output LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSM1542D3131 | 3.1 V / 3.1 V dual LDO, 250 mA per channel, 65 dB PSRR at 1 kHz, 85 µA IQ | Limited current drive and lower PSRR reduce suitability for RF-intensive designs | Preferred where board space allows larger package and RF performance margin is relaxed |
| MCP1826S-310310 | 3.1 V / 3.1 V dual LDO, 300 mA per channel, 60 dB PSRR at 1 kHz, 80 µA IQ, no active discharge | Lacks active discharge and has 15 dB lower PSRR-requires external noise filtering for RF use | Acceptable for non-RF digital applications where fast turn-off is not required |
Compared with TSM1542D3131 and MCP1826S-310310, the NCP154MX310310TAG delivers superior RF immunity (75 dB PSRR), faster transient response, and integrated active discharge-making it optimal for battery-powered wireless devices demanding clean, sequenced dual-rail power.
Availability
NCP154MX310310TAG is available at Aetrix Electronics and suitable for smartphone power management, wireless communication modules, and industrial IoT sensor nodes requiring stable component supply with full traceability and lifecycle support.
Supply support for NCP154MX310310TAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The NCP154MX310310TAG belongs to onsemi's high-performance LDO family designed specifically for battery-powered portable electronics requiring ultra-low noise, dual-rail flexibility, and robust thermal protection.
FAQ
What is the output voltage tolerance of the NCP154MX310310TAG over temperature?
The NCP154MX310310TAG guarantees ±2% output voltage accuracy for VOUT > 2 V across −40°C to +85°C junction temperature, confirmed in Table 4 of the datasheet. At 3.1 V output, this equates to ±62 mV absolute tolerance, validated by output voltage vs. temperature curves (Figures 3–6) showing <±15 mV deviation over full range.
Does the NCP154MX310310TAG require external capacitors for stability?
Yes-the NCP154MX310310TAG requires one 1 µF X5R/X7R ceramic capacitor per output (OUT1 and OUT2) placed as close as possible to the respective pins. It is stable down to 0.33 µF effective capacitance, but 1 µF is recommended to maintain PSRR and transient response across temperature and DC bias variations.
How does the enable logic work on the NCP154MX310310TAG?
The NCP154MX310310TAG uses two dedicated enable pins (EN1 and EN2). Driving either EN pin above 0.9 V enables its corresponding output; driving below 0.4 V disables it and activates the 50 Ω active discharge path to GND. Internal 300 nA pull-downs ensure default OFF state when pins are floating.
What thermal protection features does the NCP154MX310310TAG include?
The NCP154MX310310TAG incorporates per-channel thermal shutdown with 160 °C trip temperature and 20 °C hysteresis (140 °C reset). If one channel overheats, only that channel shuts down-leaving the other operational. This fault-isolation prevents total system failure during localized thermal events.
Can the NCP154MX310310TAG operate with input voltage below 2.0 V?
No-the NCP154MX310310TAG has a minimum operating input voltage of 1.9 V per Table 2 and Table 4. Operation below 1.9 V is outside Absolute Maximum Ratings and may result in loss of regulation, increased dropout, or undefined behavior. For sub-1.9 V applications, alternative regulators must be selected.
NCP154MX310310TAG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- 8-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 2
- Voltage - Input (Max):
- 5.25V
- Voltage - Output (Min/Fixed):
- 3.1V, 3.1V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- -, -
- Current - Output:
- 300mA, 300mA
- Current - Quiescent (Iq):
- 100 µA
- Current - Supply (Max):
- 200 µA
- PSRR:
- 75dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XDFN (1.6x1.2)
NCP154MX310310TAG FAQ
1.How can I place an order for NCP154MX310310TAG through Aetrix?
Please submit a Request for Quotation (RFQ) for NCP154MX310310TAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCP154MX310310TAG reliable?
The price and inventory of NCP154MX310310TAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP154MX310310TAG is usually 5 days.
3.What payment methods are accepted for NCP154MX310310TAG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP154MX310310TAG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCP154MX310310TAG?
NCP154MX310310TAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCP154MX310310TAG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCP154MX310310TAG?
For technical support, including NCP154MX310310TAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP154MX310310TAG requirements.
6.How does Aetrix verify that NCP154MX310310TAG is sourced from the original manufacturer or authorized distributors?
All NCP154MX310310TAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP154MX310310TAG meets industry standards.
7.What is the process for return or replacement of NCP154MX310310TAG?
All NCP154MX310310TAG units undergo pre-shipment inspection (PSI). If there is an issue with NCP154MX310310TAG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCP154MX310310TAG part is unused and in its original packaging.
Return procedure for NCP154MX310310TAG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NCP154MX310310TAG Tags
-
MIC5504-1.8YM5-TR
Microchip Technology
-
MIC5504-3.3YM5-TR
Microchip Technology
-
MIC5365-3.0YC5-TR
Microchip Technology
-
MIC5365-1.8YC5-TR
Microchip Technology
-
MIC5365-2.5YC5-TR
Microchip Technology
-
MIC5365-3.3YC5-TR
Microchip Technology
-
MIC5365-3.3YD5-TR
Microchip Technology
-
MIC5317-3.3YM5-TR
Microchip Technology
-
TLV1117LV33DCYR
Texas Instruments
-
MIC5317-3.3YMT-TZ
Microchip Technology
-
MIC5528-3.3YMT-TR
Microchip Technology
-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
