onsemi NCP160AMX514TBG

Overview

NCP160AMX514TBG from onsemi is a 250 mA ultra-low-noise, high-PSRR LDO regulator with fixed 5.14 V output, 80 mV dropout at 250 mA, ±2% output accuracy over load and temperature, and 10 µV_RMS output noise (10 Hz–100 kHz). It targets RF and analog power rails in smartphones, wireless LAN modules, and camera subsystems where clean, stable voltage is critical.

For engineers reviewing the NCP160AMX514TBG datasheet, pinout, applications, or equivalent options, key selection criteria include its 5.14 V fixed output, XDFN-4 1 mm × 1 mm package, active discharge capability, 98 dB PSRR at 1 kHz, and compatibility with 1 µF ceramic input/output capacitors.

Technical Context

The NCP160AMX514TBG uses a PMOS pass transistor architecture enabling low dropout and inherent reverse-current protection. Its bandgap reference and integrated soft-start ensure stable startup under varying load conditions, while thermal shutdown (160°C trip, 140°C reset) and current limiting (700 mA typ.) provide robust fault protection.

Designed for RF/analog supply domains, it delivers ultra-low noise via optimized internal filtering and achieves high PSRR through multi-stage error amplifier compensation - verified at 98 dB @ 1 kHz (20 mA load) and 82 dB @ 10 kHz. The EN pin controls both regulation and active discharge (280 Ω pull-down), with precise thresholds (VENH = 1.2 V, VENL = 0.4 V).

Key Specifications

Pinout & Package

XDFN-4 (Case 711AJ), 1 mm × 1 mm × 0.4 mm, exposed pad (EPAD) for thermal enhancement. RoHS-compliant, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TPS7A20514PDBVR and MCP1825-514I/DB, the NCP160AMX514TBG delivers superior RF-grade noise suppression (10 µV_RMS, 98 dB PSRR) in a 1 mm² XDFN package with active discharge - making it optimal for space-constrained, high-performance portable electronics.

Availability

NCP160AMX514TBG is available at Aetrix Electronics and suitable for smartphone RF front-end design, wireless LAN transceiver power management, and digital camera image sensor biasing requiring stable component supply, full lifecycle support, and traceable sourcing.

Supply support for NCP160AMX514TBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient technologies for automotive, industrial, cloud, and IoT applications.

The NCP160 series is designed specifically for ultra-low-noise, high-PSRR power delivery to RF and precision analog circuits in battery-operated portable devices - emphasizing minimal footprint, low quiescent current, and robust transient response.

FAQ

What is the maximum input voltage rating for the NCP160AMX514TBG?

The NCP160AMX514TBG has an absolute maximum input voltage of 6 V. Operation above 5.5 V is not recommended per datasheet specifications, and sustained exposure beyond 6 V may cause permanent damage. For reliable 5.14 V output, the input should be maintained between 1.9 V and 5.5 V, with ≥60 mV headroom to ensure dropout margin at full 250 mA load.

Does the NCP160AMX514TBG include active output discharge functionality?

Yes, the NCP160AMX514TBG includes active output discharge. When the EN pin is pulled below 0.4 V, an internal 280 Ω resistor connects OUT to GND, rapidly discharging the output capacitor. This feature is confirmed in the datasheet's "PIN FUNCTION DESCRIPTION" and "APPLICATIONS INFORMATION" sections and is present in all "A"-suffix versions like NCP160AMX514TBG.

What ceramic capacitor values and dielectrics are recommended for NCP160AMX514TBG input and output?

The NCP160AMX514TBG is optimized for 1 µF X7R or X5R ceramic capacitors on both IN and OUT pins. These dielectrics maintain stable capacitance across temperature and DC bias. The device remains stable down to 0.7 µF effective output capacitance, but 1 µF is recommended to ensure robust line/load transient response and PSRR performance up to 100 kHz.

How does the thermal performance of NCP160AMX514TBG compare between CSP and XDFN packages?

The XDFN-4 package (used by NCP160AMX514TBG) has a junction-to-air thermal resistance (R_JA) of 198.1 °C/W on standard JEDEC test board, versus 108 °C/W for the WLCSP4 variant. While the CSP offers better thermal performance, the XDFN provides superior mechanical robustness and reworkability. For NCP160AMX514TBG, proper PCB copper area under the EPAD is essential to manage power dissipation at full 250 mA load.

Is the NCP160AMX514TBG pin-compatible with other variants in the NCP160 family?

Yes, all NCP160 XDFN-4 variants - including NCP160AMX514TBG - share identical pinout (IN, OUT, EN, GND) and package dimensions (1 mm × 1 mm). This allows direct substitution across output voltages (e.g., 1.8 V to 5.14 V) without PCB layout changes, provided the enable logic and thermal constraints are verified for the specific application.