onsemi NCP163AFCS250T2G

Overview

NCP163AFCS250T2G from onsemi is a 250 mA ultra-low-noise, high-PSRR LDO regulator optimized for RF and analog circuits. It delivers a fixed 2.5 V output with ±2% accuracy over load and temperature, 80 mV dropout at 250 mA, 6.5 µV_RMS output noise (10 Hz–100 kHz), and 92 dB PSRR at 1 kHz - enabling clean power in smartphones and wireless LAN devices.

For engineers reviewing the NCP163AFCS250T2G datasheet, pinout, applications, or equivalent options, key selection criteria include its WLCSP4 package footprint (0.64 mm × 0.64 mm × 0.33 mm), active discharge capability, 12 µA quiescent current, and stability with 1 µF ceramic capacitors - critical for space-constrained, battery-powered designs.

Technical Context

The NCP163AFCS250T2G integrates a PMOS pass transistor with thermal shutdown (160°C trip), current limiting (700 mA typ.), and internal soft-start. Its enable logic supports 0.4 V low-threshold disable and 1.2 V high-threshold enable, activating an integrated 280 Ω active discharge path when disabled.

Designed for RF-sensitive loads, it achieves ultra-low noise via bandgap reference filtering and high PSRR through multi-stage error amplifier compensation - validated across 100 Hz to 100 kHz input ripple rejection and load transient response under 1 mA–250 mA step changes.

Key Specifications

Pinout & Package

NCP163AFCS250T2G uses the WLCSP4 (Case 567KA) package: 0.64 mm × 0.64 mm × 0.33 mm, Pb-free, with microdot marking. Exposed die pad (EPAD) enhances thermal dissipation and must be connected to GND.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with XC6210B252MR-G and RT9080-25GB, the NCP163AFCS250T2G uniquely combines WLCSP4 miniaturization, 6.5 µV_RMS noise, and active discharge - making it the only viable option for next-gen smartphone camera modules requiring sub-1 mm² footprint and controlled power-down timing.

Availability

NCP163AFCS250T2G is available at Aetrix Electronics and suitable for smartphone baseband power, Wi-Fi transceiver bias, and digital camera ISP core applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for NCP163AFCS250T2G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi is a global semiconductor supplier delivering energy-efficient silicon solutions for automotive, industrial, cloud, medical, and edge applications - with leadership in power management, imaging, and signal processing.

The NCP163AFCS250T2G belongs to onsemi's ultra-low-noise LDO family, engineered specifically for RF and high-fidelity analog circuits where power integrity directly impacts system-level performance metrics like EVM, SNR, and phase noise.

FAQ

What is the output voltage tolerance of the NCP163AFCS250T2G over temperature and load?

The NCP163AFCS250T2G maintains ±2% output voltage accuracy across −40°C to +125°C junction temperature and 0–250 mA load range, as specified in the Electrical Characteristics table under "Output Voltage Accuracy" with VIN = VOUT(NOM) + 1 V. This ensures reliable operation in automotive and industrial environments without external trimming.

Does the NCP163AFCS250T2G require external capacitors, and what type is recommended?

Yes, the NCP163AFCS250T2G requires both input (CIN) and output (COUT) 1 µF ceramic capacitors - X7R or X5R dielectric preferred for stable capacitance over temperature and DC bias. The device remains stable down to 0.7 µF effective COUT, accommodating capacitance loss in 0201/0402 packages.

How does the active discharge function operate in the NCP163AFCS250T2G?

When the EN pin voltage drops below 0.4 V, the NCP163AFCS250T2G disables regulation and activates an internal 280 Ω discharge path from OUT to GND. This pulls the output voltage to near-zero within microseconds, preventing unintended wake-up or latch-up in downstream circuits during power-down sequences.

What is the thermal performance of the NCP163AFCS250T2G in its WLCSP4 package?

In the WLCSP4 (Case 567KA) package, the NCP163AFCS250T2G has a junction-to-ambient thermal resistance (R_JA) of 108°C/W on standard JEDEC test board. With proper PCB copper area (≥200 mm² 1 oz Cu), it sustains continuous 250 mA output at ambient temperatures up to +85°C without thermal shutdown.

Can the NCP163AFCS250T2G be used with input voltages below 2.5 V?

No - the NCP163AFCS250T2G requires a minimum input voltage of 2.2 V, but achieving 2.5 V output demands VIN ≥ VOUT + V_DO. At 250 mA, dropout is 80 mV, so VIN must be ≥2.58 V for regulation. Below that, the device enters dropout and output voltage drops linearly with input.