onsemi NCP163BMX275TBG

Overview

NCP163BMX275TBG from onsemi is a 250 mA ultra-low-noise, high-PSRR LDO regulator with fixed 2.75 V output, designed for RF and analog circuits requiring clean power. It delivers ±2% output accuracy over load and temperature, 80 mV dropout at 250 mA (XDFN4 package), 6.5 µV_RMS output noise (10 Hz–100 kHz), and 92 dB PSRR at 1 kHz - enabling stable biasing in smartphone camera modules and wireless transceivers.

For engineers reviewing the NCP163BMX275TBG datasheet, pinout, applications, or equivalent options, key selection criteria include its non-active-discharge enable behavior, XDFN4 1 mm × 1 mm × 0.4 mm package, 12 µA quiescent current, thermal shutdown at 160°C, and compatibility with 1 µF ceramic input/output capacitors.

Technical Context

The NCP163BMX275TBG integrates a PMOS pass transistor with bandgap reference, soft-start circuitry, and thermal shutdown protection. Its EN pin logic (enable threshold: 1.2 V, disable threshold: 0.4 V) controls regulation without active output discharge - distinguishing it from "A" and "C" variants.

This variant operates across 2.2 V–5.5 V input range, maintains stability with 0.7 µF minimum C_OUT, and achieves <±0.01 %/mA load regulation (XDFN4). Dropout voltage is characterized at 100 mV below nominal output, with typical values of 95 mV at 250 mA for 2.75 V output.

Key Specifications

Pinout & Package

XDFN4 package: 1 mm × 1 mm × 0.4 mm, exposed pad (EPAD) for thermal dissipation; RoHS-compliant, halogen-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TPS7A20275PDBVR and MCP1700T-275I/TT, the NCP163BMX275TBG offers superior thermal safety, lower quiescent current, and tighter dropout - making it optimal for thermally constrained, battery-sensitive RF/analog systems requiring programmable enable control.

Availability

NCP163BMX275TBG is available at Aetrix Electronics and suitable for smartphone camera modules, wireless LAN transceivers, and industrial IoT sensor nodes requiring stable component supply with full traceability and long-term lifecycle support.

Supply support for NCP163BMX275TBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.

The NCP163 series targets RF and high-performance analog subsystems, emphasizing ultra-low noise, high PSRR, and minimal quiescent current to meet stringent power integrity demands in portable and wireless systems.

FAQ

What is the dropout voltage specification for NCP163BMX275TBG at full load?

The NCP163BMX275TBG exhibits a typical dropout voltage of 95 mV at 250 mA output current for its 2.75 V output (XDFN4 package), measured when V_OUT drops 100 mV below nominal. This enables reliable operation from a 2.85 V input rail, supporting single-cell Li-ion or Li-poly battery systems with minimal headroom.

Does NCP163BMX275TBG provide active output discharge during disable?

No, the "B" suffix in NCP163BMX275TBG explicitly denotes the non-active-discharge variant. When the EN pin is pulled low (<0.4 V), the pass transistor turns off and output voltage decays only through external load paths - no internal discharge FET is activated, preserving charge on downstream hold-up capacitors.

What is the recommended output capacitor for NCP163BMX275TBG?

The NCP163BMX275TBG is optimized for stability with a 1 µF X7R or X5R ceramic capacitor placed directly at the OUT pin. The device remains stable down to 0.7 µF effective capacitance, accounting for DC bias and temperature derating - especially critical for 0201/0402 case sizes.

How does the thermal shutdown function operate in NCP163BMX275TBG?

NCP163BMX275TBG triggers thermal shutdown at 160°C (typ.) and resets at 140°C (typ.), providing 20°C hysteresis. During shutdown, regulation ceases and the device draws only ~0.01 µA. This protects against catastrophic failure in high-ambient or high-power-dissipation conditions without requiring external circuitry.

Is NCP163BMX275TBG compatible with standard PCB assembly processes?

Yes, NCP163BMX275TBG uses the XDFN4 package (CASE 711AJ), which is lead-free, halogen-free, and RoHS-compliant. Its 1 mm × 1 mm footprint and 0.4 mm height support standard reflow profiles, and the exposed pad enhances thermal performance when soldered to a solid GND plane per JEDEC JESD51-7 guidelines.