My Inquiry
My Account
onsemi NCP170AMX310TCG
- Part No.:
- NCP170AMX310TCG
- Manufacturer:
- onsemi
- Package:
- 4-XDFN Exposed Pad
- Datasheet:
-
NCP170AMX310TCG.pdf
- Description:
- IC REG LINEAR 3.1V 150MA 4XDFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,874
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NCP170AMX310TCG from onsemi is a CMOS ultra-low IQ LDO regulator delivering 150 mA output with 3.1 V fixed output voltage, 170 mV typical dropout at full load, ±1% output accuracy, and 500 nA typical quiescent current-designed for battery-powered image sensors and portable wireless modules where standby power and transient response are critical.
For engineers reviewing the NCP170AMX310TCG datasheet, pinout, applications, or equivalent options, this page provides verified package mapping (XDFN4), confirmed EN/OUT/IN/GND pin roles, thermal shutdown behavior (175°C), active discharge capability (RLOW = 100 Ω), and real-world PSRR/noise performance across 100 Hz–1 MHz.
Technical Context
The NCP170AMX310TCG uses a PMOS pass transistor architecture enabling ultra-low IQ and fast load transient recovery via dynamic boost circuitry. Its enable input (EN) features TTL-compatible thresholds (VENH = 1.2 V, VENL ≤ 0.4 V) and sub-10 nA leakage, supporting precise system-level power sequencing.
It operates across 2.2 V–5.5 V input while maintaining regulation down to 170 mV dropout at 150 mA (VOUT = 3.1 V), and remains stable with 1 µF ceramic output capacitors-eliminating need for bulk electrolytics in space-constrained designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.1 V ±1% over −40°C to +85°C - ensures consistent biasing for 3.3 V logic interfaces with margin. |
| Max Output Current | 150 mA continuous - supports moderate-power imaging sensors or RF front-end ICs without thermal derating in XDFN4. |
| Quiescent Current | Typ. 500 nA - extends coin-cell or Li-ion battery life by >10× versus standard LDOs in always-on sensor nodes. |
| Dropout Voltage | Typ. 170 mV at 150 mA - enables operation down to VIN = 3.27 V while sustaining 3.1 V output, critical for aging batteries. |
| PSRR @ 1 kHz | 41 dB at IOUT = 150 mA - suppresses switching noise from adjacent DC-DC converters feeding mixed-signal loads. |
| Output Noise | 125 µVRMS (100 Hz–1 MHz) - low enough for analog sensor signal chains without added filtering. |
| Thermal Shutdown | 175°C with 25°C hysteresis - protects against sustained overload in sealed enclosures without external monitoring. |
Pinout & Package
Package: XDFN4 (1 mm × 1 mm, 0.4 mm height), case 711AJ, moisture sensitivity level 1 - suitable for high-density PCB layouts and automated optical inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (IN) | Input Power Supply | Accepts 2.2–5.5 V; requires local 1 µF ceramic decoupling per datasheet layout guidelines. |
| 2 (GND) | Power Ground | Primary ground reference; EPAD internally connected to GND for thermal conduction and EMI reduction. |
| 3 (EN) | Enable Control Input | Active-high logic input; draws ≤10 nA; drives internal bandgap and pass device when ≥1.2 V applied. |
| 4 (OUT) | Regulated Output | Delivers 3.1 V ±1%; requires 1 µF ceramic capacitor (X5R/X7R) placed within 2 mm of pin per stability requirements. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low IQ | 500 nA typical - reduces standby power to <1.6 µW at 3.1 V, enabling multi-year battery life in IoT endpoints. |
| Active Output Discharge | 100 Ω internal pull-down (NCP170A variant only) - discharges output to <0.1 V within 1 ms after disable, preventing floating states in sequenced systems. |
| Ceramic-Capacitor Stability | Stable with 1 µF X5R/X7R MLCC - eliminates need for larger, less reliable tantalum or aluminum electrolytics in wearables. |
| Dynamic Transient Boost | Enhanced load-step response (1–50 mA) - limits output droop to <30 mV, preserving timing margins in burst-mode wireless transceivers. |
| Robust Protection | Integrated over-current limit (225 mA typ.) and thermal shutdown (175°C) - prevents latch-up or damage during short-circuit or ambient overheating. |
Applications
| Image Sensor Power | Wireless Module Bias |
|---|---|
|
Use Scenario: Powers CMOS image sensors in compact security cameras or medical endoscopes operating from single-cell Li-ion (3.0–4.2 V). IC Role / Device Role / Timing Role: Provides clean, low-noise 3.1 V supply to analog pixel array and ADC reference, synchronized with exposure timing signals. Use Value: 125 µVRMS noise and ±1% accuracy prevent fixed-pattern noise and gain drift across temperature. |
Use Scenario: Supplies 3.1 V to BLE/Wi-Fi SoCs during deep-sleep and active transmit bursts in asset trackers. IC Role / Device Role / Timing Role: Delivers regulated voltage with fast transient recovery (<10 µs) to maintain RF PA linearity during TX ramp-up. Use Value: 170 mV dropout allows operation until battery reaches 3.27 V, extending usable runtime by ~12% vs. higher-dropout alternatives. |
| Portable Medical Monitor | Low-Power Industrial Sensor Node |
|
Use Scenario: Powers ECG front-end ASIC and OLED display controller in handheld patient monitors using CR2032 coin cell. IC Role / Device Role / Timing Role: Serves as primary power rail with EN controlled by microcontroller wake signal to minimize sleep current. Use Value: 500 nA IQ reduces total system sleep current to <1 µA, enabling >5-year battery life at 1-min sampling intervals. |
Use Scenario: Regulates power for LoRaWAN node MCU, SX1276 transceiver, and MEMS accelerometer in remote environmental sensors. IC Role / Device Role / Timing Role: Enables deterministic power-on reset via EN pin while maintaining tight voltage tolerance during RF transmission peaks. Use Value: ±1% output accuracy ensures consistent ADC reference and RF oscillator frequency stability across −40°C to +85°C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6210B312MR-G | 3.1 V fixed, 150 mA, 1.0 µA IQ, no EN pin, SOT-25 package | Lacks enable control and active discharge; requires external ON/OFF switch for sequencing | Choose if board space permits SOT-25 and EN functionality is unnecessary |
| Richtek RT9080-31GB | 3.1 V fixed, 200 mA, 2.5 µA IQ, EN pin, SOT-563 package | Higher IQ increases standby power 5×; larger footprint than XDFN4; no active discharge | Prefer when higher output current headroom is needed and 1 mm² area constraint is relaxed |
Compared with Torex XC6210B312MR-G and Richtek RT9080-31GB, the NCP170AMX310TCG uniquely combines XDFN4 size, 500 nA IQ, EN control, and active discharge-making it optimal for miniaturized, battery-critical systems requiring precise power sequencing and rapid output discharge.
Availability
NCP170AMX310TCG is available at Aetrix Electronics and suitable for portable medical monitors, wireless sensor nodes, and image sensor modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for NCP170AMX310TCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Nasdaq: ON) is a global semiconductor leader delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The NCP170 series targets ultra-low-power portable electronics, with the NCP170AMX310TCG specifically engineered for space-constrained, battery-operated devices needing precision regulation, minimal standby draw, and robust protection.
FAQ
What is the output voltage tolerance of the NCP170AMX310TCG over temperature?
The NCP170AMX310TCG delivers 3.1 V output with ±1% accuracy across the full operating junction temperature range of −40°C to +85°C. At +25°C, the tolerance tightens to ±0.2% (3.094 V to 3.106 V), ensuring stable biasing for precision analog circuits without external trimming. This specification is guaranteed by design and production-tested per onsemi's characterization protocols.
Does the NCP170AMX310TCG support active output discharge, and how does it function?
Yes, the NCP170AMX310TCG includes active output discharge via an internal 100 Ω pull-down resistor activated when the EN pin is driven low. When disabled, the output discharges to <0.1 V within 1 ms, preventing unintended operation of downstream circuitry. This feature is intrinsic to the "A" suffix variant and requires no external components-critical for safe power sequencing in multi-rail systems.
What is the minimum input voltage required for the NCP170AMX310TCG to maintain regulation at 150 mA load?
The NCP170AMX310TCG maintains 3.1 V regulation at 150 mA load with a minimum input voltage of 3.27 V, based on its typical 170 mV dropout voltage. At worst-case conditions (e.g., high temperature or process variation), the dropout may reach 240 mV, requiring VIN ≥ 3.34 V. Designers should verify margin using the datasheet's Figure 14 (dropout vs. current) for their specific thermal environment.
Can the NCP170AMX310TCG operate with a 1 µF ceramic output capacitor, and why is this significant?
Yes, the NCP170AMX310TCG is explicitly characterized and guaranteed stable with a 1 µF X5R or X7R ceramic capacitor on the output-no ESR requirements or additional compensation needed. This eliminates reliance on larger, less reliable tantalum or aluminum electrolytic capacitors, reducing PCB area, cost, and failure risk in high-reliability portable designs.
How does the NCP170AMX310TCG's PSRR performance compare at different load currents?
The NCP170AMX310TCG maintains 41 dB PSRR at 1 kHz under 150 mA load (per 3.1 V electrical characteristics), but PSRR degrades to ~57 dB at 10 mA due to higher loop gain at light loads. This trade-off is inherent to LDO architecture: designers targeting noisy DC-DC inputs should verify PSRR at actual operating current, especially in burst-mode applications where load swings occur.
NCP170AMX310TCG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- 4-XDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.1V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- -
- Current - Output:
- 150mA
- Current - Quiescent (Iq):
- 900 nA
- Current - Supply (Max):
- -
- PSRR:
- -
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-XDFN (1x1)
NCP170AMX310TCG FAQ
1.How can I place an order for NCP170AMX310TCG through Aetrix?
Please submit a Request for Quotation (RFQ) for NCP170AMX310TCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCP170AMX310TCG reliable?
The price and inventory of NCP170AMX310TCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP170AMX310TCG is usually 5 days.
3.What payment methods are accepted for NCP170AMX310TCG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP170AMX310TCG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCP170AMX310TCG?
NCP170AMX310TCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCP170AMX310TCG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCP170AMX310TCG?
For technical support, including NCP170AMX310TCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP170AMX310TCG requirements.
6.How does Aetrix verify that NCP170AMX310TCG is sourced from the original manufacturer or authorized distributors?
All NCP170AMX310TCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP170AMX310TCG meets industry standards.
7.What is the process for return or replacement of NCP170AMX310TCG?
All NCP170AMX310TCG units undergo pre-shipment inspection (PSI). If there is an issue with NCP170AMX310TCG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCP170AMX310TCG part is unused and in its original packaging.
Return procedure for NCP170AMX310TCG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NCP170AMX310TCG Tags
-
MIC5504-1.8YM5-TR
Microchip Technology
-
MIC5504-3.3YM5-TR
Microchip Technology
-
MIC5365-3.0YC5-TR
Microchip Technology
-
MIC5365-1.8YC5-TR
Microchip Technology
-
MIC5365-2.5YC5-TR
Microchip Technology
-
MIC5365-3.3YC5-TR
Microchip Technology
-
MIC5365-3.3YD5-TR
Microchip Technology
-
MIC5317-3.3YM5-TR
Microchip Technology
-
TLV1117LV33DCYR
Texas Instruments
-
MIC5317-3.3YMT-TZ
Microchip Technology
-
MIC5528-3.3YMT-TR
Microchip Technology
-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
