onsemi NCP170BMX320TCG
- Part No.:
- NCP170BMX320TCG
- Manufacturer:
- onsemi
- Package:
- 4-XDFN Exposed Pad
- Datasheet:
-
NCP170BMX320TCG.pdf
- Description:
- IC REG LINEAR 3.2V 150MA 4XDFN
- Quantity:
- Payment:

- Shipping:

Inventory:75,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NCP170BMX320TCG from onsemi is a CMOS low-dropout (LDO) regulator designed for ultra-low-power portable battery applications, delivering 150 mA output with 3.2 V fixed output voltage, 170 mV typical dropout at full load, ±1% output accuracy, and ultra-low 500 nA quiescent current - enabling multi-year operation in coin-cell–powered IoT sensors and wearables.
For engineers reviewing the NCP170BMX320TCG datasheet, pinout, applications, or equivalent options, key selection criteria include its XDFN4 1 × 1 mm package, enable-pin control logic, ceramic-capacitor stability, thermal shutdown behavior, and performance under dynamic load transients in space-constrained wireless edge nodes.
Technical Context
The NCP170BMX320TCG implements a PMOS pass transistor architecture optimized for minimal quiescent current and fast transient response. Its internal bandgap reference and error amplifier maintain regulation across −40°C to +85°C while supporting input voltages from 2.2 V to 5.5 V.
It features active-high enable (EN) with 1.2 V threshold, over-current protection that limits short-circuit current to 195 mA, and thermal shutdown triggered at 175°C with 25°C hysteresis - ensuring robust operation in thermally dense PCB layouts without external supervision circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.2 V ±1% over −40°C to +85°C - ensures stable supply for 3.3 V I/O–tolerant microcontrollers and sensors without external feedback resistors. |
| Max Output Current | 150 mA continuous - sufficient to power BLE SoCs, low-power ADCs, and MEMS accelerometers in compact wearable designs. |
| Dropout Voltage | 170 mV typical at 150 mA - enables regulation down to 3.37 V input, preserving battery runtime in Li-MnO₂ or alkaline systems nearing end-of-life. |
| Quiescent Current | 500 nA typical at zero load - extends shelf life and operational life of battery-powered devices exceeding 10 years in sleep mode. |
| PSRR @ 1 kHz | 41 dB at 150 mA load - suppresses switching noise from adjacent DC-DC converters, critical for analog signal chains and RF front-ends. |
| Stability | Stable with 1 µF ceramic output capacitor - eliminates need for large tantalum or electrolytic capacitors, reducing board area and cost. |
| Operating Input Range | 2.2 V to 5.5 V - compatible with single-cell Li-ion (2.7–4.2 V), Li-FePO₄ (2.0–3.6 V), and dual-alkaline (2.4–3.2 V) sources. |
Pinout & Package
XDFN4 package (1.0 mm × 1.0 mm, 0.4 mm height, case 711AJ), thermally enhanced with exposed EPAD internally connected to GND. Pin pitch: 0.5 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (IN) | Input Power Supply | Accepts 2.2–5.5 V input; requires local 1 µF ceramic decoupling close to pin for stability and EMI suppression. |
| 2 (GND) | Ground Reference | Primary ground return path; must be connected to EPAD and system ground plane for thermal and noise performance. |
| 3 (EN) | Enable Control Input | Active-high logic input (1.2 V threshold); pulls to GND via 10 nA max leakage when disabled - enables low-power sequencing. |
| 4 (OUT) | Regulated Output | Delivers 3.2 V ±1%; requires 1 µF ceramic output capacitor placed adjacent to pin for transient response and stability. |
| EPAD | Thermal & Electrical Ground | Internally tied to GND; soldered to PCB thermal pad for junction-to-board heat transfer (RJA = 250°C/W). |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low IQ | 500 nA typical quiescent current - reduces standby power loss to <1.5 µW, enabling >10-year battery life in always-on sensor nodes. |
| Low Dropout | 170 mV typical at 150 mA - allows operation with minimal headroom, maximizing usable battery voltage range in energy-harvesting systems. |
| Ceramic-Cap Stable | Stable with 1 µF X5R/X7R ceramic output capacitor - eliminates ESR requirements and simplifies BOM by removing polymer/tantalum alternatives. |
| Integrated Protection | Thermal shutdown (175°C) and over-current limit (195 mA) - prevents damage during fault conditions without external circuitry. |
| Pb-Free & RoHS | Pb-free, halogen-free/BFR-free construction per JEDEC J-STD-020 - compliant with industrial and consumer environmental regulations. |
Applications
| Wearable Health Monitor | BLE Beacon Node |
|---|---|
Use Scenario: Continuous ECG/PPG sensing powered by CR2032 coin cell with 10-year shelf life requirement. IC Role / Device Role / Timing Role: Primary 3.2 V LDO supplying analog front-end, MCU, and BLE radio during active and deep-sleep cycles. Use Value: 500 nA quiescent current minimizes self-discharge; 170 mV dropout extends usable battery range from 3.3 V down to 3.37 V input. |
Use Scenario: Battery-powered indoor location beacon transmitting periodic iBeacon packets every 100 ms. IC Role / Device Role / Timing Role: Regulated 3.2 V supply for Nordic nRF52832 SoC, enabling consistent RF output power and timing accuracy. Use Value: 41 dB PSRR at 1 kHz suppresses noise from digital switching, maintaining BLE packet error rate <1% in noisy environments. |
| Industrial Wireless Sensor | Smart Home Motion Detector |
Use Scenario: LoRaWAN node monitoring temperature/humidity in remote factory settings using AA alkaline batteries. IC Role / Device Role / Timing Role: Main power regulator for STM32WL SoC and Si7021 sensor, activated only during scheduled transmissions. Use Value: Active-high EN pin enables precise MCU-controlled power gating, reducing average system current to sub-µA levels between reports. |
Use Scenario: PIR-based occupancy detector with wake-on-motion, operating from two AA cells for >5 years. IC Role / Device Role / Timing Role: Low-noise 3.2 V rail for PIR signal conditioning, comparator, and ESP32-WROOM-32 Wi-Fi MCU. Use Value: ±1% output accuracy ensures consistent ADC reference and RF oscillator performance across temperature and battery aging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6219B322MR-G | 3.2 V fixed output, 150 mA, 250 nA IQ, SOT-25 package (2.9 × 2.8 mm) - smaller IQ but larger footprint and no EN pin. | Lacks enable control; unsuitable for MCU-gated power sequencing or ultra-deep sleep modes requiring pin-level shutdown. | Select when lowest possible IQ dominates and board space permits larger SOT-25; avoid when EN functionality or XDFN4 size is mandatory. |
| Richtek RT9013-32PQV | 3.2 V fixed output, 300 mA, 1.3 µA IQ, DFN-6 (1.5 × 1.5 mm) - higher current and IQ, includes EN and thermal shutdown. | Higher IQ increases standby power 26×; larger package occupies ~2.25× more area than XDFN4. | Choose only if >150 mA load or tighter thermal resistance (RJA = 160°C/W) is required; otherwise NCP170BMX320TCG offers superior size/power trade-off. |
Compared with XC6219B322MR-G and RT9013-32PQV, the NCP170BMX320TCG uniquely balances ultra-low 500 nA IQ, 1 × 1 mm XDFN4 footprint, integrated EN control, and ±1% accuracy - making it optimal for miniaturized, long-life battery systems where every nanoamp and square millimeter matters.
Availability
NCP170BMX320TCG is available at Aetrix Electronics and suitable for wearable health monitors, BLE beacon nodes, and industrial wireless sensors requiring stable component supply with guaranteed long-term availability and traceable sourcing.
Supply support for NCP170BMX320TCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi is a global semiconductor supplier delivering energy-efficient silicon solutions for automotive, industrial, cloud, medical, and IoT applications - focused on enabling sustainable technology through high-performance, reliable components.
The NCP170 series belongs to onsemi's ultra-low-power linear regulator product line, engineered specifically for battery-operated edge devices demanding nanowatt-level standby consumption and sub-millimeter packaging without sacrificing regulation accuracy or transient performance.
FAQ
What is the output voltage tolerance of the NCP170BMX320TCG over temperature?
The NCP170BMX320TCG maintains a fixed 3.2 V output with ±1% accuracy across the full operating junction temperature range of −40°C to +85°C. At +25°C, the typical output is 3.2 V with min/max bounds of 3.168 V and 3.232 V; over temperature, the worst-case deviation remains within ±1% of nominal, as confirmed in the Electrical Characteristics table for the 3.2 V version.
Does the NCP170BMX320TCG require an external pull-up resistor on the EN pin?
No, the NCP170BMX320TCG does not require an external pull-up resistor on the EN pin. Its EN input draws only 10 nA maximum leakage current and has a defined high-threshold of 1.2 V and low-threshold of 0.4 V. It can be driven directly from a GPIO or open-drain controller output; a pull-up is optional only if system-level default-on behavior is needed during reset.
Can the NCP170BMX320TCG operate with a 2.5 V input voltage?
No, the NCP170BMX320TCG cannot regulate at 2.5 V input because its minimum operating input voltage is 2.2 V, but its 3.2 V output requires ≥3.37 V input (3.2 V + 170 mV dropout) to sustain 150 mA load. At 2.5 V input, it enters dropout and cannot maintain regulation - use only with VIN ≥3.37 V for full-load operation or ≥3.2 V for light loads (<10 mA).
Is the NCP170BMX320TCG compatible with 1 µF ceramic output capacitors?
Yes, the NCP170BMX320TCG is explicitly characterized and guaranteed stable with a 1 µF X5R or X7R ceramic capacitor on the output. Unlike many older LDOs, it imposes no minimum ESR requirement - eliminating the need for bulkier, higher-ESR tantalum or aluminum electrolytic capacitors and simplifying layout in space-constrained designs.
What thermal protection features does the NCP170BMX320TCG include?
The NCP170BMX320TCG integrates thermal shutdown protection that activates at +175°C junction temperature, with 25°C hysteresis to prevent oscillation near the trip point. Once triggered, the device shuts down the pass element and disables output until junction temperature falls below +150°C. This fully autonomous protection requires no external components and is validated per JEDEC JESD78 latch-up and thermal stress standards.
NCP170BMX320TCG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- 4-XDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.2V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- -
- Current - Output:
- 150mA
- Current - Quiescent (Iq):
- 900 nA
- Current - Supply (Max):
- -
- PSRR:
- -
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-XDFN (1x1)
NCP170BMX320TCG FAQ
1.How can I place an order for NCP170BMX320TCG through Aetrix?
Please submit a Request for Quotation (RFQ) for NCP170BMX320TCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCP170BMX320TCG reliable?
The price and inventory of NCP170BMX320TCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP170BMX320TCG is usually 5 days.
3.What payment methods are accepted for NCP170BMX320TCG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP170BMX320TCG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCP170BMX320TCG?
NCP170BMX320TCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCP170BMX320TCG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCP170BMX320TCG?
For technical support, including NCP170BMX320TCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP170BMX320TCG requirements.
6.How does Aetrix verify that NCP170BMX320TCG is sourced from the original manufacturer or authorized distributors?
All NCP170BMX320TCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP170BMX320TCG meets industry standards.
7.What is the process for return or replacement of NCP170BMX320TCG?
All NCP170BMX320TCG units undergo pre-shipment inspection (PSI). If there is an issue with NCP170BMX320TCG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCP170BMX320TCG part is unused and in its original packaging.
Return procedure for NCP170BMX320TCG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NCP170BMX320TCG Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

