My Inquiry
My Account
onsemi NCP170BXV280T2G
- Part No.:
- NCP170BXV280T2G
- Manufacturer:
- onsemi
- Package:
- SOT-563, SOT-666
- Datasheet:
-
NCP170BXV280T2G.pdf
- Description:
- IC REG LIN 2.8V 150MA SOT563-6
- Quantity:
- Payment:
- Shipping:
Inventory:2,415
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NCP170BXV280T2G from onsemi is a CMOS low-dropout (LDO) regulator designed for ultra-low-power portable battery applications, delivering 2.8 V output at up to 150 mA with 500 nA typical quiescent current, 210 mV typical dropout at full load, ±1% output voltage accuracy, and stable operation with 1 µF ceramic capacitors.
For engineers reviewing the NCP170BXV280T2G datasheet, pinout, applications, or equivalent options, this page provides verified electrical specs, package mapping to XDFN4 (1 × 1 mm), EN-controlled enable functionality, thermal shutdown behavior, and real-world use cases in space-constrained, long-life battery systems.
Technical Context
The NCP170BXV280T2G integrates a PMOS pass transistor enabling ultra-low IQ operation and fast transient response via dynamic boost circuitry. Its EN pin supports active-high logic control with 1.2 V threshold and sub-10 nA input leakage, allowing precise system-level power sequencing.
It operates across 2.2 V–5.5 V input range and maintains regulation down to 210 mV dropout at 150 mA (VOUT = 2.8 V), with built-in over-current protection, thermal shutdown at 175 °C, and hysteresis of 25 °C - all validated per AEC-Q100 stress test standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | 2.8 V ±1% over −40°C to +85°C - ensures stable core/sensor rail under temperature variation |
| Max Output Current | 150 mA - sufficient for microcontrollers, image sensors, and RF transceivers in compact devices |
| Quiescent Current | 0.5 µA typical - extends battery life in always-on or sleep-mode IoT endpoints |
| Dropout Voltage | 210 mV typical at 150 mA - enables operation from single-cell Li-ion (3.0 V min) or two-cell alkaline |
| PSRR @ 1 kHz | 40 dB at 150 mA - suppresses switching noise from adjacent DC-DC converters |
| Output Noise | 125 µVRMS (100 Hz–1 MHz) - suitable for noise-sensitive analog/RF supply domains |
| Enable Threshold | VENH = 1.2 V, VENL = 0.4 V - compatible with 1.8 V and 3.3 V GPIO without level-shifting |
Pinout & Package
Package: XDFN4 (1 mm × 1 mm, 0.4 mm height), case 711AJ, Pb-free and RoHS compliant. Exposed pad internally connected to GND for thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN | Input Power Supply | Accepts 2.2–5.5 V; requires 1 µF ceramic input capacitor for stability |
| GND | Ground Reference | Primary return path; EPAD tied internally to GND for enhanced thermal dissipation |
| EN | Enable Control Input | Active-high logic; <10 nA leakage allows direct MCU GPIO drive without pull-up burden |
| OUT | Regulated Output | Delivers 2.8 V ±1%; stable with 1 µF ceramic output capacitor |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low IQ (0.5 µA) | Enables >10-year battery life in coin-cell-powered sensors with periodic wake-up |
| Low Dropout (210 mV @ 150 mA) | Permits use with aging batteries or low-headroom sources without brownout risk |
| ±1% Output Accuracy | Meets tight tolerance requirements for ADC references and precision analog circuits |
| Stable with 1 µF Ceramic Cap | Reduces BOM count and board area vs. legacy LDOs requiring ≥10 µF tantalum |
| Thermal Shutdown (175 °C) | Protects against sustained overload or ambient overheating in sealed enclosures |
Applications
| Wearable Health Monitor | Smart Camera Module |
|---|---|
|
Use Scenario: Continuous ECG/PPG sensing with BLE transmission every 5 seconds. IC Role / Device Role / Timing Role: Supplies clean 2.8 V to analog front-end and BLE SoC during active and sleep states. Use Value: 0.5 µA quiescent current extends CR2032 battery life beyond 2 years; 210 mV dropout sustains regulation as battery discharges from 3.0 V to 2.5 V. |
Use Scenario: Low-light image capture using CMOS image sensor with on-chip ADC. IC Role / Device Role / Timing Role: Provides low-noise 2.8 V bias for sensor analog core and digital interface. Use Value: 125 µVRMS output noise prevents quantization errors; ±1% accuracy ensures consistent pixel response across temperature. |
| Industrial Wireless Sensor Node | Portable Medical Diagnostic Device |
|
Use Scenario: LoRaWAN node measuring temperature/humidity with 1-minute reporting interval. IC Role / Device Role / Timing Role: Powers MCU, sensor IC, and LoRa transceiver from primary lithium thionyl chloride cell. Use Value: 2.2–5.5 V input range accommodates wide battery voltage swing; EN pin enables MCU-controlled power gating to minimize idle draw. |
Use Scenario: Handheld blood glucose meter with LCD display and electrochemical sensor. IC Role / Device Role / Timing Role: Delivers regulated 2.8 V to sensor excitation circuit and display driver IC. Use Value: Thermal shutdown prevents fault-induced overheating during extended self-test; 1 µF ceramic compatibility reduces PCB footprint in handheld form factor. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCP1700T-2802E/MB | 250 mV dropout at 150 mA; 1.6 µA IQ; SOT-23-5 package (2.9 mm × 1.6 mm) | Larger footprint; higher IQ reduces battery life in multi-year deployments | Select when board layout already uses SOT-23 and 1.6 µA IQ is acceptable |
| Torex XC6206P282MR-G | 200 mV dropout at 100 mA; 1 µA IQ; SOT-25 package; no EN pin | No enable control - limits power sequencing flexibility in complex systems | Select when minimal dropout at light loads is critical and EN functionality is unnecessary |
Compared with MCP1700T-2802E/MB and XC6206P282MR-G, the NCP170BXV280T2G offers the lowest quiescent current (0.5 µA), smallest footprint (XDFN4), and integrated EN pin - making it optimal for ultra-long-life, space-constrained, and sequenced-power designs.
Availability
NCP170BXV280T2G is available at Aetrix Electronics and suitable for wearable health monitors, smart camera modules, industrial wireless sensor nodes, and portable medical diagnostic devices requiring stable component supply with guaranteed long-term availability.
Supply support for NCP170BXV280T2G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Nasdaq: ON) is a global semiconductor supplier delivering energy-efficient silicon solutions for automotive, industrial, cloud, medical, and IoT applications.
The NCP170 series targets ultra-low-power battery-operated systems, emphasizing nanoscale IQ, miniature packaging, and robustness in thermally constrained environments - directly addressing design needs in wearables and edge-sensing devices.
FAQ
What is the maximum input voltage rating for the NCP170BXV280T2G?
The NCP170BXV280T2G has an absolute maximum input voltage of 6.0 V. Operation above this level risks permanent damage. The recommended operating input range is 2.2 V to 5.5 V, which aligns with common battery chemistries including single-cell Li-ion, LiFePO₄, and dual-cell alkaline. Always observe derating guidelines in high-temperature environments.
Does the NCP170BXV280T2G require an external capacitor on the EN pin?
No, the NCP170BXV280T2G does not require an external capacitor on the EN pin. Its EN input draws only ≤10 nA leakage current and features clean threshold hysteresis (VENH = 1.2 V, VENL = 0.4 V), allowing direct connection to standard GPIO outputs. Adding capacitance may slow enable/disable timing and is unnecessary for noise immunity in typical layouts.
Can the NCP170BXV280T2G be used with ceramic output capacitors smaller than 1 µF?
No - the NCP170BXV280T2G is specified and characterized for stability with ≥1 µF ceramic output capacitance. Using smaller values may cause oscillation or degraded transient response. The datasheet explicitly validates performance with 1 µF X5R/X7R ceramics; lower values invalidate the guaranteed PSRR, noise, and load regulation specs.
What is the thermal resistance (RJA) of the NCP170BXV280T2G in its XDFN4 package?
The NCP170BXV280T2G in the XDFN4 (1 mm × 1 mm) package has a junction-to-air thermal resistance (RJA) of 250 °C/W, as measured per JEDEC JESD51-2. This value assumes standard 2-layer PCB with no thermal vias. Adding 4–6 thermal vias under the EPAD reduces RJA by ~30–40%, improving power handling capability in continuous 150 mA operation.
Is the NCP170BXV280T2G pin-compatible with other variants in the NCP170 family?
Yes - all NCP170 variants (including NCP170BXV280T2G, NCP170BXV330T2G, etc.) share identical XDFN4 pinout and footprint. Output voltage is laser-trimmed during manufacturing; no external resistors or configuration pins are required. This enables single PCB design reuse across multiple voltage options with only BOM change.
NCP170BXV280T2G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- SOT-563, SOT-666
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 2.8V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.3V @ 150mA
- Current - Output:
- 150mA
- Current - Quiescent (Iq):
- 900 nA
- Current - Supply (Max):
- -
- PSRR:
- 40dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-563
NCP170BXV280T2G FAQ
1.How can I place an order for NCP170BXV280T2G through Aetrix?
Please submit a Request for Quotation (RFQ) for NCP170BXV280T2G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCP170BXV280T2G reliable?
The price and inventory of NCP170BXV280T2G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP170BXV280T2G is usually 5 days.
3.What payment methods are accepted for NCP170BXV280T2G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP170BXV280T2G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCP170BXV280T2G?
NCP170BXV280T2G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCP170BXV280T2G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCP170BXV280T2G?
For technical support, including NCP170BXV280T2G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP170BXV280T2G requirements.
6.How does Aetrix verify that NCP170BXV280T2G is sourced from the original manufacturer or authorized distributors?
All NCP170BXV280T2G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP170BXV280T2G meets industry standards.
7.What is the process for return or replacement of NCP170BXV280T2G?
All NCP170BXV280T2G units undergo pre-shipment inspection (PSI). If there is an issue with NCP170BXV280T2G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCP170BXV280T2G part is unused and in its original packaging.
Return procedure for NCP170BXV280T2G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NCP170BXV280T2G Tags
-
MIC5504-1.8YM5-TR
Microchip Technology
-
MIC5504-3.3YM5-TR
Microchip Technology
-
MIC5365-3.0YC5-TR
Microchip Technology
-
MIC5365-1.8YC5-TR
Microchip Technology
-
MIC5365-2.5YC5-TR
Microchip Technology
-
MIC5365-3.3YC5-TR
Microchip Technology
-
MIC5365-3.3YD5-TR
Microchip Technology
-
MIC5317-3.3YM5-TR
Microchip Technology
-
TLV1117LV33DCYR
Texas Instruments
-
MIC5317-3.3YMT-TZ
Microchip Technology
-
MIC5528-3.3YMT-TR
Microchip Technology
-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
