My Inquiry
My Account
onsemi NCP177AMX135TCG
- Part No.:
- NCP177AMX135TCG
- Manufacturer:
- onsemi
- Package:
- 4-XDFN Exposed Pad
- Datasheet:
-
NCP177AMX135TCG.pdf
- Description:
- IC REG LINEAR 1.35V 500MA 4XDFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,293
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NCP177AMX135TCG from onsemi is a CMOS low-dropout (LDO) linear voltage regulator delivering 500 mA output current with 1.35 V fixed output, 1.6 V to 5.5 V input range, and 200 mV typical dropout at 500 mA (VOUT = 1.8 V). It features enable control, ±0.8% output accuracy, and thermal shutdown protection - deployed in battery-powered image sensors and portable communication devices.
For engineers reviewing the NCP177AMX135TCG datasheet, pinout, applications, or equivalent options, key selection criteria include fast transient response, ultra-low quiescent current (60 µA typ.), output discharge capability (NCP177A variant), stability with 1 µF ceramic capacitors, and XDFN4 1 mm × 1 mm package compatibility for space-constrained designs.
Technical Context
The NCP177AMX135TCG integrates a PMOS pass transistor with adaptive ground current control, enabling 60 µA quiescent current at no load and <1 µA standby current when disabled. Its internal reference and soft-start circuitry ensure monotonic power-up without output overshoot.
It implements over-current protection with 750 mA typical current limit and thermal shutdown at 175°C with 20°C hysteresis. The EN pin (active-high, 1.0 V threshold) controls both regulation and active output discharge (60 Ω typ.) - exclusive to the "A" version - enabling rapid VOUT ramp-down during power sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 1.35 V ±0.8% over −40°C to +85°C - ensures stable core bias for low-voltage image sensor analog blocks. |
| Max Output Current | 500 mA continuous - supports peak loads in portable camera modules without thermal derating under typical PCB copper area. |
| Dropout Voltage | 200 mV typ. at 500 mA (for VOUT = 1.8 V); 295 mV typ. at 500 mA (for VOUT = 1.4 V) - enables operation down to 1.64 V input with 1.35 V output. |
| Quiescent Current | 60 µA typ. at no load - minimizes battery drain in always-on sensor standby modes. |
| PSRR | 75 dB at 1 kHz - suppresses switching noise from adjacent DC-DC converters feeding the LDO input. |
| Output Noise | 54 µVRMS (10 Hz–100 kHz) - preserves signal integrity in analog front-ends of CMOS image sensors. |
| Enable Threshold | VENH = 1.0 V min., VENL = 0.4 V max. - compatible with 1.8 V GPIOs and provides noise margin against logic-level interference. |
Pinout & Package
Package: XDFN4 (Case 711AJ), 1.0 mm × 1.0 mm × 0.4 mm, exposed pad (EPAD) for thermal dissipation - requires soldering EPAD to PCB ground plane per JEDEC JESD51-7 board spec.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - OUT | Regulated output voltage node | Delivers stable 1.35 V to load; connects directly to local 1 µF ceramic capacitor for transient response. |
| 2 - GND | Power supply ground reference | Primary return path for load and quiescent current; must be tied to EPAD and system ground plane. |
| 3 - EN | Enable control input (active high) | Drives internal pass transistor and output discharge switch; internal 300 nA pull-down ensures safe default-off state. |
| 4 - IN | Input voltage supply node | Accepts 1.6–5.5 V; requires local 1 µF ceramic capacitor to suppress input ripple and trace inductance effects. |
| EPAD | Thermal and electrical ground terminal | Not electrically isolated; must be soldered to ≥25 mm² copper area for RJA = 223°C/W and reliable 500 mA operation. |
Key Features
| Feature | Design Value |
|---|---|
| Fast transient response | Stabilizes within 20 µs after 100 mA load step (Fig. 27), critical for burst-mode image capture without voltage droop. |
| Active output discharge | 60 Ω typ. discharge path (NCP177A only) pulls VOUT to GND in <1 ms when EN deasserted - prevents floating bias in multi-rail power sequencing. |
| Ultra-low IQ operation | 60 µA typ. quiescent current enables >1-year battery life in always-on sensor nodes with 200 mAh coin cells. |
| Stable with 1 µF ceramic output cap | No ESR requirement; eliminates need for larger, higher-ESR tantalum caps - reduces BOM count and PCB area in 0201/0402 layouts. |
| Robust protection suite | Integrated over-current limit (750 mA typ.), short-circuit current limiting (700 mA typ.), and thermal shutdown (175°C) prevent latch-up or damage during fault conditions. |
Applications
| CMOS Image Sensor Bias | Portable Audio Codec Power |
|---|---|
Use Scenario: Powers analog pixel array and column ADC in compact camera modules requiring clean, low-noise 1.35 V supply. IC Role / Device Role / Timing Role: Primary LDO delivering regulated 1.35 V with <54 µVRMS noise and 75 dB PSRR to suppress DC-DC switching artifacts. Use Value: Prevents fixed-pattern noise and quantization errors in 12-bit image data by maintaining sub-0.5% output regulation during dynamic load transients. | Use Scenario: Supplies headphone amplifier and DAC core in Bluetooth earbuds where battery voltage drops from 4.2 V to 3.0 V. IC Role / Device Role / Timing Role: Low-IQ LDO stepping down intermediate rail to fixed 1.35 V for analog audio stages with enable-controlled power gating. Use Value: Extends playback time by 18% vs. standard LDOs due to 60 µA quiescent current and maintains THD+N <−95 dB across full battery range. |
| Wearable Health Sensor Core | IoT Edge Node MCU I/O Rail |
Use Scenario: Provides precision 1.35 V bias to optical heart-rate monitor (PPG) analog front-end in wrist-worn wearables. IC Role / Device Role / Timing Role: Noise-sensitive LDO with active discharge ensuring rapid power-down between measurement bursts to conserve energy. Use Value: Enables 30-second measurement intervals with <10 nA average system current via EN-controlled sleep/wake cycling. | Use Scenario: Generates 1.35 V I/O supply for ultra-low-power microcontrollers (e.g., ARM Cortex-M0+) in battery-operated environmental sensors. IC Role / Device Role / Timing Role: Enable-controlled LDO supporting deep-sleep mode with <1 µA standby current and fast wake-up (<50 µs). Use Value: Reduces total system sleep current by 42% compared to non-discharge LDOs, extending 200 mAh battery life to 18 months. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCP1804T-135IDB | Fixed 1.35 V, 150 mA max output, 220 mV dropout at 150 mA, no enable pin, no output discharge | Limited to low-current sensor interfaces; unsuitable for 500 mA camera loads or EN-controlled sequencing | Select only for cost-sensitive, low-power analog sensors where 150 mA suffices and enable/discharge are unnecessary. |
| Torex XC6210B135MR-G | Fixed 1.35 V, 300 mA max output, 160 mV dropout at 300 mA, enable pin present, no output discharge | Lower current rating and missing discharge function - cannot replace NCP177AMX135TCG in image sensor power-down sequences | Consider for mid-power portable devices needing better dropout than MCP1804 but lacking discharge-critical timing requirements. |
Compared with MCP1804T-135IDB and XC6210B135MR-G, the NCP177AMX135TCG uniquely combines 500 mA output, active output discharge, and 60 µA quiescent current in a 1 mm² package - making it the only viable option for high-dynamic-range image sensor bias with strict power sequencing constraints.
Availability
NCP177AMX135TCG is available at Aetrix Electronics and suitable for battery-powered equipment, portable communication devices, and CMOS image sensor modules requiring stable component supply, long-term lifecycle support, and Pb-free compliance.
Supply support for NCP177AMX135TCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient technologies for automotive, industrial, cloud, medical, and IoT applications.
The NCP177AMX135TCG belongs to onsemi's high-performance LDO family designed specifically for noise-sensitive, battery-constrained portable electronics - emphasizing ultra-low IQ, fast transient response, and robust protection in miniature packages.
FAQ
What is the maximum input voltage rating for the NCP177AMX135TCG?
The NCP177AMX135TCG has an absolute maximum input voltage rating of 6.0 V. Operation above this level risks permanent damage. For reliable continuous use, the recommended input voltage range is 1.6 V to 5.5 V - ensuring proper regulation and dropout performance while maintaining thermal safety margins across temperature extremes.
Does the NCP177AMX135TCG require external components for stability?
Yes, the NCP177AMX135TCG requires two external ceramic capacitors: a minimum 1 µF X7R/X5R type at the IN pin and a minimum 1 µF X7R/X5R type at the OUT pin, placed as close as possible to their respective pins. These capacitors ensure loop stability, suppress input ripple, and maintain fast transient response - no ESR or series resistance is required on either capacitor.
How does the output discharge function operate in the NCP177AMX135TCG?
The NCP177AMX135TCG ('A' variant) activates its internal 60 Ω discharge transistor when the EN pin falls below 0.4 V, pulling the OUT pin to GND within ~1 ms. This prevents floating voltages on downstream circuitry during power-down sequences. The discharge path is automatically disabled when EN rises above 1.0 V, allowing normal regulation to resume without delay.
What is the thermal shutdown behavior of the NCP177AMX135TCG?
The NCP177AMX135TCG triggers thermal shutdown at 175°C junction temperature and remains latched off until the die cools by at least 20°C (hysteresis). During shutdown, the pass transistor and output discharge are disabled. Once temperature falls to ≤155°C, regulation resumes automatically - no external reset is needed. This protects against sustained overload or poor PCB thermal design.
Can the NCP177AMX135TCG be used with a 0.8 µF output capacitor?
Yes - the NCP177AMX135TCG is specified to remain stable with a minimum effective output capacitance of 0.8 µF. However, using exactly 0.8 µF requires careful selection of a high-DC-bias-tolerance X7R/X5R ceramic capacitor (e.g., 0402/0201 size rated ≥6.3 V) to maintain effective capacitance across temperature and bias. For robust design, 1 µF is strongly recommended.
NCP177AMX135TCG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- 4-XDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.35V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- -
- Current - Output:
- 500mA
- Current - Quiescent (Iq):
- 90 µA
- Current - Supply (Max):
- -
- PSRR:
- 75dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-XDFN (1x1)
NCP177AMX135TCG FAQ
1.How can I place an order for NCP177AMX135TCG through Aetrix?
Please submit a Request for Quotation (RFQ) for NCP177AMX135TCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCP177AMX135TCG reliable?
The price and inventory of NCP177AMX135TCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP177AMX135TCG is usually 5 days.
3.What payment methods are accepted for NCP177AMX135TCG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP177AMX135TCG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCP177AMX135TCG?
NCP177AMX135TCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCP177AMX135TCG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCP177AMX135TCG?
For technical support, including NCP177AMX135TCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP177AMX135TCG requirements.
6.How does Aetrix verify that NCP177AMX135TCG is sourced from the original manufacturer or authorized distributors?
All NCP177AMX135TCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP177AMX135TCG meets industry standards.
7.What is the process for return or replacement of NCP177AMX135TCG?
All NCP177AMX135TCG units undergo pre-shipment inspection (PSI). If there is an issue with NCP177AMX135TCG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCP177AMX135TCG part is unused and in its original packaging.
Return procedure for NCP177AMX135TCG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NCP177AMX135TCG Tags
-
MIC5504-1.8YM5-TR
Microchip Technology
-
MIC5504-3.3YM5-TR
Microchip Technology
-
MIC5365-3.0YC5-TR
Microchip Technology
-
MIC5365-1.8YC5-TR
Microchip Technology
-
MIC5365-2.5YC5-TR
Microchip Technology
-
MIC5365-3.3YC5-TR
Microchip Technology
-
MIC5365-3.3YD5-TR
Microchip Technology
-
MIC5317-3.3YM5-TR
Microchip Technology
-
TLV1117LV33DCYR
Texas Instruments
-
MIC5317-3.3YMT-TZ
Microchip Technology
-
MIC5528-3.3YMT-TR
Microchip Technology
-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
