Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Voltage Regulators - Linear, Low Drop Out (LDO) Regulators

onsemi NCP4587DMX30TCG

Name: NCP4587DMX30TCG
Brand: onsemi
SKU: NCP4587DMX30TCG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: NCP4587DMX30TCG

Manufacturer:: onsemi

Category:: Voltage Regulators - Linear, Low Drop Out (LDO) Regulators

Package:: 6-XFDFN

Datasheet:: NCP4587DMX30TCG.pdf

Description:: IC REG LINEAR 3V 150MA 6XDFN

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,034

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

NCP4587DMX30TCG from onsemi is a 150 mA tri-mode CMOS LDO voltage regulator with 3.0 V fixed output, ultra-low dropout (120 mV typ. at 150 mA), ±1% output accuracy (V_OUT > 2 V), and auto Eco/fast mode switching via AE pin. It operates from 1.4 V to 5.25 V input and delivers stable power to noise-sensitive analog rails in portable imaging systems.

For engineers reviewing the NCP4587DMX30TCG datasheet, pinout, applications, or equivalent options, key selection criteria include its 0.4 mm ultra-thin XDFN-6 package, 1.0 µA low-power mode quiescent current, fast transient response under load steps, and integrated output discharge function for controlled shutdown in battery-powered cameras and image sensors.

Technical Context

The NCP4587DMX30TCG implements a CMOS-based pass transistor architecture with dual operating modes: low-power Eco mode (1.0 µA I_Q) below 2.0 mA load and fast-response mode (55 µA I_GND) above 8.0 mA load, triggered automatically or forced via AE pin. Its internal fold-back current limit protects against short circuits while maintaining stability with 1 µF ceramic output capacitors.

It features an active output discharge path (D-version) activated during disable, enabling rapid V_OUT collapse, and supports high PSRR (70 dB at 1 kHz in fast mode) for rejecting supply ripple in mixed-signal camera modules where clean 3.0 V bias is required for image sensor analog front-ends.

Key Specifications

Parameter	Value and Actual Design Meaning
Output Voltage	Fixed 3.0 V ±1% (at V_OUT > 2 V, T_J = 25°C); ensures precise biasing of 3.0 V image sensor cores and ADC reference rails.
Max Output Current	150 mA continuous; sufficient to power entire CMOS image sensor subsystems including analog and digital blocks.
Dropout Voltage	120 mV typical at 150 mA (V_OUT ≥ 2.6 V); enables operation down to VIN = 3.12 V, extending battery runtime in single-cell Li-ion systems.
Quiescent Current	1.0 µA in Low Power Mode; minimizes standby drain in always-on camera wake-up circuits.
PSRR	70 dB at 1 kHz (Fast Mode); suppresses switching noise from adjacent DC-DC converters feeding digital logic.
Operating Input Range	1.4 V to 5.25 V; compatible with wide-input PMIC outputs and direct connection to 3.3 V or 3.6 V battery rails.
Thermal Resistance	R_JA = 250 °C/W (XDFN-6); requires minimal PCB copper area for thermal management in space-constrained camera modules.

Pinout & Package

XDFN-6 (1.2 mm × 1.2 mm × 0.4 mm) ultra-thin leadless package with wettable flanks; optimized for automated optical inspection (AOI) and high-density portable PCB layouts.

Pin/Terminal	Circuit Role	Design Meaning
VIN	Input supply pin	Accepts 1.4–5.25 V input; must be decoupled with 1 µF ceramic capacitor placed adjacent to pin 1 for line transient immunity.
GND	Ground reference	Common return for input/output paths; connects directly to thermal pad for junction-to-board heat transfer.
CE	Chip enable (active-high)	Pulls up internally; tie to VIN if always-on operation required; enables system-level power sequencing control.
VOUT	Regulated output	Delivers stable 3.0 V; requires 1 µF ceramic capacitor at pin 4 to ensure stability and dynamic response.
AE	Auto Eco mode select	Logic high forces permanent Fast Mode (55 µA I_GND); floating or low enables automatic Eco/Fast switching based on load current.
NC	No connection	Pin 5 is unconnected die bond site; must remain unpopulated and unconnected on PCB.

Key Features

Feature	Design Value
Tri-mode operation	Automatically switches between Low Power (1.0 µA), Fast (55 µA), and Standby (0.1 µA) modes-reducing average system power without firmware intervention.
Integrated output discharge	Active NMOS discharge path pulls VOUT to GND during CE deactivation-preventing floating rail issues and enabling safe hot-swap in modular camera designs.
Ceramic-capacitor stability	Stable with ≥1 µF X5R/X7R ceramic output capacitors-eliminates need for bulky tantalum or electrolytic caps in thin-profile camera PCBs.
High-accuracy output	±1% initial tolerance (VOUT > 2 V) and ±2.5% over −40°C to +85°C-meets tight analog supply requirements for image sensor analog signal chains.
Ultra-low profile packaging	XDFN-6 (0.4 mm height) fits within 1.2 mm × 1.2 mm footprint-enables placement directly beneath stacked camera modules or under display bezels.

Applications

Camera Image Sensor Biasing	Portable Medical Imaging Devices
Use Scenario: Providing clean, stable 3.0 V bias to analog front-end (AFE) and pixel array of CMOS image sensors in smartphone rear cameras. IC Role / Device Role / Timing Role: Primary analog LDO delivering regulated 3.0 V with ultra-low noise and high PSRR to suppress switching noise from nearby RF/PMIC sections. Use Value: Enables <115 µV_RMS output noise and 70 dB PSRR at 1 kHz-critical for achieving >60 dB SNR in 12-bit image capture without post-processing correction.	Use Scenario: Powering CCD/CMOS sensors and precision ADCs in handheld ultrasound or dermatology imaging probes. IC Role / Device Role / Timing Role: Low-quiescent, fast-transient LDO supplying 3.0 V to sensor bias and reference circuitry during intermittent acquisition bursts. Use Value: Delivers 150 mA peak current with <200 µs recovery from 1–150 mA load steps-ensuring no frame corruption during rapid sensor readout sequences.
Wearable Camera Modules	Industrial Machine Vision Sensors
Use Scenario: Regulating 3.0 V for compact action cameras and AR glasses with constrained board area and thermal envelope. IC Role / Device Role / Timing Role: Ultra-thin XDFN-6 LDO placed directly under lens housing to minimize trace inductance and EMI coupling. Use Value: 0.4 mm height and 1.2 mm × 1.2 mm footprint allow integration into sub-3 mm total device thickness-meeting mechanical specs for slim wearable form factors.	Use Scenario: Supplying 3.0 V to global-shutter CMOS sensors in factory-floor inspection cameras exposed to wide temperature swings. IC Role / Device Role / Timing Role: Industrial-grade LDO with −40°C to +85°C operation and ±2.5% output accuracy over full temperature range. Use Value: Maintains 3.0 V regulation within ±75 mV across −40°C to +85°C-preserving sensor gain linearity and preventing white-balance drift in production environments.

Camera Image Sensor Biasing

Portable Medical Imaging Devices

Use Scenario: Providing clean, stable 3.0 V bias to analog front-end (AFE) and pixel array of CMOS image sensors in smartphone rear cameras.

IC Role / Device Role / Timing Role: Primary analog LDO delivering regulated 3.0 V with ultra-low noise and high PSRR to suppress switching noise from nearby RF/PMIC sections.

Use Value: Enables <115 µV_RMS output noise and 70 dB PSRR at 1 kHz-critical for achieving >60 dB SNR in 12-bit image capture without post-processing correction.

Use Scenario: Powering CCD/CMOS sensors and precision ADCs in handheld ultrasound or dermatology imaging probes.

IC Role / Device Role / Timing Role: Low-quiescent, fast-transient LDO supplying 3.0 V to sensor bias and reference circuitry during intermittent acquisition bursts.

Use Value: Delivers 150 mA peak current with <200 µs recovery from 1–150 mA load steps-ensuring no frame corruption during rapid sensor readout sequences.

Wearable Camera Modules

Industrial Machine Vision Sensors

Use Scenario: Regulating 3.0 V for compact action cameras and AR glasses with constrained board area and thermal envelope.

IC Role / Device Role / Timing Role: Ultra-thin XDFN-6 LDO placed directly under lens housing to minimize trace inductance and EMI coupling.

Use Value: 0.4 mm height and 1.2 mm × 1.2 mm footprint allow integration into sub-3 mm total device thickness-meeting mechanical specs for slim wearable form factors.

Use Scenario: Supplying 3.0 V to global-shutter CMOS sensors in factory-floor inspection cameras exposed to wide temperature swings.

IC Role / Device Role / Timing Role: Industrial-grade LDO with −40°C to +85°C operation and ±2.5% output accuracy over full temperature range.

Use Value: Maintains 3.0 V regulation within ±75 mV across −40°C to +85°C-preserving sensor gain linearity and preventing white-balance drift in production environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TPS7A0530PDBVR	200 mA output, 0.9 µA IQ, but no AE pin or auto mode switching; fixed 3.0 V, SOT-23-5 package (1.6 mm × 2.9 mm).	Lacks tri-mode intelligence and output discharge; suited for simpler always-on bias rails without dynamic load profiling.	Select when board space allows larger SOT-23 and system firmware handles mode control externally.
MCP1703T-3002E/MB	250 mA output, 2.5 µA IQ, no AE pin; 3.0 V fixed, SOT-23-5; includes thermal shutdown but no output discharge.	Higher quiescent current and no fast transient optimization; better for cost-sensitive industrial controls than imaging.	Choose for non-critical analog rails where 2.5 µA IQ and basic regulation suffice, and output discharge is unnecessary.

Compared with TPS7A0530PDBVR and MCP1703T-3002E/MB, the NCP4587DMX30TCG uniquely combines ultra-low profile (0.4 mm), auto Eco/Fast mode switching, and integrated output discharge-making it the only option qualified for space- and noise-constrained camera sensor biasing where dynamic power management and controlled shutdown are mandatory.

Availability

NCP4587DMX30TCG is available at Aetrix Electronics and suitable for portable imaging systems, medical diagnostic devices, and industrial machine vision equipment requiring stable component supply with guaranteed Pb-free compliance and automotive-grade reliability screening.

Supply support for NCP4587DMX30TCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensing, and connectivity solutions for automotive, industrial, cloud, and medical markets.

The NCP4587DMX30TCG belongs to onsemi's high-precision, low-noise LDO family designed specifically for powering sensitive analog circuitry in battery-operated imaging and sensing applications where size, efficiency, and transient performance are critical.

FAQ

What is the output voltage tolerance of the NCP4587DMX30TCG over temperature?

The NCP4587DMX30TCG maintains ±1% output voltage accuracy at T_J = 25°C for V_OUT > 2 V. Over the full operating temperature range (−40°C to +85°C), its output voltage deviation is specified as ±2.5% for V_OUT > 2 V, ensuring reliable 3.0 V regulation in demanding environmental conditions encountered in outdoor or industrial camera deployments. This specification is confirmed in the Electrical Characteristics table on page 3 of the official datasheet.

Does the NCP4587DMX30TCG require external components for stability?

Yes-the NCP4587DMX30TCG requires a minimum 1 µF ceramic capacitor on both input (CIN) and output (COUT) pins, placed as close as possible to the device. The datasheet explicitly states that tantalum capacitors with high ESR may cause oscillation, and parallel ceramic capacitors can destabilize the loop. No additional compensation components are needed, as the device is internally compensated for use with low-ESR ceramic capacitors.

How does the AE pin affect the operation of the NCP4587DMX30TCG?

The AE (Auto Eco) pin on the NCP4587DMX30TCG determines its operating mode: when AE is low or floating, the device automatically switches between Low Power Mode (<2 mA load) and Fast Mode (>8 mA load); when AE is high, it remains permanently in Fast Mode regardless of load. This enables design flexibility-system firmware can force fast response for burst imaging or let hardware manage power autonomously during idle periods.

What is the purpose of the NC pin on the NCP4587DMX30TCG XDFN-6 package?

Pin 5 of the NCP4587DMX30TCG in XDFN-6 package is designated NC (No Connection)-it corresponds to an unused die bond site and must remain unconnected on the PCB. The datasheet's Pin Function Description table (page 2) confirms this terminal has no internal connection, and routing or soldering to it may compromise thermal performance or cause unintended leakage paths.

Is the NCP4587DMX30TCG suitable for automotive applications?

The NCP4587DMX30TCG is not AEC-Q100 qualified and is not recommended for automotive safety-critical systems. While it operates across −40°C to +85°C and meets general industrial reliability standards, onsemi does not list it in their AEC-Q100 product portfolio. For automotive camera modules, designers should select AEC-Q100 qualified alternatives such as the NCV8170 series unless the application falls outside functional safety scope (e.g., non-safety infotainment displays).

NCP4587DMX30TCG Specifications

Product attributes: Attribute value

Manufacturer:: onsemi

Series:: -

Package/Case:: 6-XFDFN

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Output Configuration:: Positive

Output Type:: Fixed

Number of Regulators:: 1

Voltage - Input (Max):: 5.25V

Voltage - Output (Min/Fixed):: 3V

Voltage - Output (Max):: -

Voltage Dropout (Max):: 0.18V @ 150mA

Current - Output:: 150mA

Current - Quiescent (Iq):: 4 µA

Current - Supply (Max):: -

PSRR:: 70dB (1kHz)

Control Features:: Enable

Protection Features:: Over Current

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 6-XDFN (1.2x1.2)

NCP4587DMX30TCG FAQ

1.How can I place an order for NCP4587DMX30TCG through Aetrix?

Please submit a Request for Quotation (RFQ) for NCP4587DMX30TCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NCP4587DMX30TCG reliable?

The price and inventory of NCP4587DMX30TCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP4587DMX30TCG is usually 5 days.

3.What payment methods are accepted for NCP4587DMX30TCG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP4587DMX30TCG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for NCP4587DMX30TCG?

NCP4587DMX30TCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NCP4587DMX30TCG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NCP4587DMX30TCG?

For technical support, including NCP4587DMX30TCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP4587DMX30TCG requirements.

6.How does Aetrix verify that NCP4587DMX30TCG is sourced from the original manufacturer or authorized distributors?

All NCP4587DMX30TCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP4587DMX30TCG meets industry standards.

7.What is the process for return or replacement of NCP4587DMX30TCG?

All NCP4587DMX30TCG units undergo pre-shipment inspection (PSI). If there is an issue with NCP4587DMX30TCG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NCP4587DMX30TCG part is unused and in its original packaging.

Return procedure for NCP4587DMX30TCG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-09 Counterfeit Electronic Components: How to Detect, Authenticate, and Test Suspect Parts

Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…