My Inquiry
My Account
onsemi NCP4589DMX12TCG
- Part No.:
- NCP4589DMX12TCG
- Manufacturer:
- onsemi
- Package:
- 6-XFDFN
- Datasheet:
-
NCP4589DMX12TCG.pdf
- Description:
- IC REG LINEAR 1.2V 300MA 6XDFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,064
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NCP4589DMX12TCG from onsemi is a 300 mA tri-mode CMOS LDO voltage regulator with 1.2 V fixed output, operating from 1.4 V to 5.25 V input, featuring auto-eco/fast/standby modes, 230 mV typical dropout at 300 mA, and ±1% output accuracy - deployed in portable image sensors and battery-powered camera modules.
For engineers reviewing the NCP4589DMX12TCG datasheet, pinout, applications, or equivalent options, key selection criteria include tri-mode quiescent current (1.0 µA low-power, 55 µA fast, 0.1 µA standby), AE pin-controlled mode switching, ceramic-capacitor stability, and XDFN6 1.2×1.2 mm ultra-thin packaging for space-constrained imaging subsystems.
Technical Context
The NCP4589DMX12TCG implements an adaptive tri-mode architecture: it autonomously transitions between low-power mode (<3 mA load) and fast-response mode (>8 mA load), with AE pin enabling permanent fast mode. Its internal N-channel pass transistor delivers 230 mV dropout at full 300 mA load and 2.8 V output.
It integrates current-foldback protection, 70 dB PSRR at 1 kHz in fast mode, and stable operation with ≥1 µF ceramic output capacitors. The device supports 0.02%/V line regulation and ±50 ppm/°C output voltage temperature coefficient across −40°C to +85°C ambient.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 1.2 V ±1% (at VOUT > 2 V; ±20 mV for ≤2 V), enabling precise core biasing for image sensor analog front-ends. |
| Max Output Current | 300 mA continuous, supporting high-current pixel array drivers without thermal derating in XDFN6 package. |
| Dropout Voltage | 230 mV typical at 300 mA and 2.8 V output, allowing operation from single-cell Li-ion (3.0 V min) down to 1.43 V input. |
| Quiescent Current | 1.0 µA in low-power mode (VOUT ≤ 1.85 V), extending battery life in always-on camera standby states. |
| PSRR | 70 dB at 1 kHz in fast mode, suppressing switching noise from PMICs or DC-DC converters feeding the LDO input. |
| Operating Input Range | 1.4 V to 5.25 V, compatible with wide-input battery stacks, USB-powered peripherals, and multi-rail embedded systems. |
| Thermal Resistance | RJA = 250 °C/W (XDFN), enabling 400 mW power dissipation with <40°C junction rise at 25°C ambient. |
Pinout & Package
XDFN6 package: 1.2 mm × 1.2 mm × 0.4 mm ultra-thin, leadless, wettable flank design optimized for automated optical inspection and high-density PCB layouts in mobile imaging modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Input supply connection | Accepts 1.4–5.25 V; requires local 1 µF ceramic decoupling to minimize line transients. |
| GND | Ground reference | Common return path for input/output currents; must be low-impedance and thermally coupled to PCB copper pour. |
| CE | Chip enable control | Active-high logic input (VCEH = 1.0 V); internal pull-down enables default ON operation when left unconnected. |
| VOUT | Regulated output | Delivers stable 1.2 V ±1%; requires 1 µF ceramic capacitor placed adjacent to pin for stability and transient response. |
| AE | Auto Eco mode select | Logic input (VAEH = 1.0 V) forcing permanent fast mode when high; enables automatic tri-mode switching when low. |
| NC | No connection | Unbonded pad; must remain floating - no routing or solder mask opening required. |
Key Features
| Feature | Design Value |
|---|---|
| Tri-mode dynamic current optimization | Switches automatically between 1.0 µA (low-power), 55 µA (fast), and 0.1 µA (standby) supply currents based on load, reducing average system power by >90% during idle imaging cycles. |
| Ceramic capacitor compatibility | Stable with ≥1 µF X5R/X7R ceramics only - eliminates need for costly tantalum or polymer capacitors and avoids ESR-related oscillation risks. |
| Fast transient recovery | Sub-10 µs load-step response (e.g., 1→50 mA) in fast mode, maintaining <±20 mV output deviation for burst-mode image capture timing. |
| Integrated output discharge (D version) | Internal VOUT-to-GND switch activates during disable, discharging output capacitance in <1 ms - prevents residual voltage from interfering with sequenced power-down of sensor interfaces. |
| Pb-free XDFN6 packaging | 1.2×1.2 mm footprint with wettable flanks supports fine-pitch reflow, AOI verification, and thermal performance matching SOT-23-5 while occupying 40% less board area. |
Applications
| Mobile Camera Modules | Portable Medical Imaging Sensors |
|---|---|
Use Scenario: Powering CIS (CMOS Image Sensor) analog and digital cores in smartphones and action cameras. IC Role / Device Role / Timing Role: Primary 1.2 V LDO supplying sensor pixel array and ADC reference rails with ultra-low noise and fast load transient response. Use Value: Enables clean 1.2 V bias under burst-mode exposure (0→300 mA in <5 µs), preventing image artifacts caused by supply droop or ripple. | Use Scenario: Regulating power for handheld ultrasound probe front-end ASICs and low-light endoscope sensors. IC Role / Device Role / Timing Role: Low-noise, low-quiescent LDO delivering stable 1.2 V to precision analog signal chains in battery-operated diagnostic tools. Use Value: 70 dB PSRR at 1 kHz suppresses noise from nearby wireless transceivers, preserving SNR in sub-100 µV medical signal paths. |
| Wearable AR/VR Eye-Tracking Systems | Industrial Machine Vision Smart Cameras |
Use Scenario: Supplying 1.2 V to high-speed eye-tracking image sensors in compact AR glasses with strict thermal envelope limits. IC Role / Device Role / Timing Role: Compact-area LDO providing regulated power with minimal self-heating in thermally isolated lens assemblies. Use Value: XDFN6's 250 °C/W RJA and 0.4 mm height allow direct mounting behind optics without airflow, sustaining 300 mA at <85°C junction. | Use Scenario: Powering global-shutter CMOS sensors in factory-floor smart cameras exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Industrial-grade LDO ensuring ±1% output accuracy and ±50 ppm/°C drift over −40°C to +85°C for consistent exposure calibration. Use Value: Maintains sensor gain linearity across thermal cycles, eliminating recalibration requirements during extended production runs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCP1804T-1202E/MB | Fixed 1.2 V, 150 mA max, 220 mV dropout, 3.5 µA IQ, SOT-23 package | Limited to lower current; lacks tri-mode and AE pin control; no auto-discharge | Select when cost sensitivity outweighs current headroom and dynamic efficiency needs. |
| Torex XC6210B122MR-G | Fixed 1.2 V, 300 mA, 250 mV dropout, 1.0 µA IQ, SOT-25 package, no AE pin | Single-mode (ultra-low IQ only); no fast-mode PSRR boost or load-triggered mode switching | Choose for static low-power applications where transient response and PSRR are secondary to minimum quiescent draw. |
Compared with MCP1804T-1202E/MB and XC6210B122MR-G, the NCP4589DMX12TCG uniquely delivers full 300 mA capability with adaptive tri-mode operation, enabling both microamp-level standby and millisecond-scale transient recovery - critical for imaging workloads with intermittent high-current bursts.
Availability
NCP4589DMX12TCG is available at Aetrix Electronics and suitable for mobile camera modules, portable medical imaging sensors, and industrial machine vision smart cameras requiring stable component supply, long-term lifecycle support, and Pb-free XDFN packaging.
Supply support for NCP4589DMX12TCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensor, and connectivity solutions for automotive, industrial, cloud, and consumer markets.
The NCP4589DMX12TCG belongs to onsemi's high-efficiency LDO family designed specifically for battery-powered imaging and portable electronics, emphasizing ultra-low IQ, fast transient response, and miniature packaging for space-constrained applications.
FAQ
What is the output voltage tolerance of the NCP4589DMX12TCG over temperature and load?
The NCP4589DMX12TCG provides ±1% output voltage accuracy for VOUT > 2 V at TA = 25°C; over −40°C to +85°C and 1–10 mA load, accuracy degrades to ±1.5% (±20 mV for ≤2 V outputs). This ensures reliable 1.2 V biasing for image sensor analog blocks across industrial temperature ranges.
Does the NCP4589DMX12TCG require external components for stability?
Yes - the NCP4589DMX12TCG requires a minimum 1 µF X5R/X7R ceramic capacitor on both input (CIN) and output (COUT), placed adjacent to their respective pins. Tantalum or high-ESR capacitors risk instability; parallel ceramic arrays may cause oscillation per datasheet Section "APPLICATION INFORMATION".
How does the AE pin affect the operation of the NCP4589DMX12TCG?
The AE pin on the NCP4589DMX12TCG selects between automatic tri-mode switching (AE = low) and forced fast mode (AE = high). In automatic mode, it transitions from low-power (≤2 mA load) to fast mode (≥8 mA load); in forced mode, it remains in fast mode regardless of load, optimizing PSRR and transient response at the cost of higher quiescent current.
What thermal performance can be expected from the NCP4589DMX12TCG in its XDFN6 package?
The NCP4589DMX12TCG in XDFN6 has RJA = 250 °C/W. At 300 mA output into 1.2 V (360 mW dissipation), junction temperature rise is ~90°C above ambient - requiring adequate PCB copper area. Derating to 200 mA reduces rise to ~60°C, enabling reliable operation in sealed enclosures up to +65°C ambient.
Is the NCP4589DMX12TCG pin-compatible with other packages in the NCP4589 family?
No - the NCP4589DMX12TCG uses XDFN6 (6-pin), while SC-70 and SOT-23-5 variants have different pinouts and footprints. Pin mapping differs: XDFN6 assigns AE to pin 1 and NC to pin 5; SOT-23-5 places AE on pin 4 and omits NC. PCB layout must be package-specific; no mechanical or electrical interchangeability exists.
NCP4589DMX12TCG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- 6-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.25V
- Voltage - Output (Min/Fixed):
- 1.2V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.7V @ 300mA
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 4 µA
- Current - Supply (Max):
- -
- PSRR:
- 70dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-XDFN (1.2x1.2)
NCP4589DMX12TCG FAQ
1.How can I place an order for NCP4589DMX12TCG through Aetrix?
Please submit a Request for Quotation (RFQ) for NCP4589DMX12TCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCP4589DMX12TCG reliable?
The price and inventory of NCP4589DMX12TCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP4589DMX12TCG is usually 5 days.
3.What payment methods are accepted for NCP4589DMX12TCG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP4589DMX12TCG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCP4589DMX12TCG?
NCP4589DMX12TCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCP4589DMX12TCG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCP4589DMX12TCG?
For technical support, including NCP4589DMX12TCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP4589DMX12TCG requirements.
6.How does Aetrix verify that NCP4589DMX12TCG is sourced from the original manufacturer or authorized distributors?
All NCP4589DMX12TCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP4589DMX12TCG meets industry standards.
7.What is the process for return or replacement of NCP4589DMX12TCG?
All NCP4589DMX12TCG units undergo pre-shipment inspection (PSI). If there is an issue with NCP4589DMX12TCG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCP4589DMX12TCG part is unused and in its original packaging.
Return procedure for NCP4589DMX12TCG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NCP4589DMX12TCG Tags
-
MIC5504-1.8YM5-TR
Microchip Technology
-
MIC5504-3.3YM5-TR
Microchip Technology
-
MIC5365-3.0YC5-TR
Microchip Technology
-
MIC5365-1.8YC5-TR
Microchip Technology
-
MIC5365-2.5YC5-TR
Microchip Technology
-
MIC5365-3.3YC5-TR
Microchip Technology
-
MIC5365-3.3YD5-TR
Microchip Technology
-
MIC5317-3.3YM5-TR
Microchip Technology
-
TLV1117LV33DCYR
Texas Instruments
-
MIC5317-3.3YMT-TZ
Microchip Technology
-
MIC5528-3.3YMT-TR
Microchip Technology
-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
