onsemi NCP565MN30T2G
- Part No.:
- NCP565MN30T2G
- Manufacturer:
- onsemi
- Package:
- 6-VDFN Exposed Pad
- Datasheet:
-
NCP565MN30T2G.pdf
- Description:
- IC REG LINEAR 3V 1.5A 6DFN
- Quantity:
- Payment:

- Shipping:

Inventory:3,442
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NCP565MN30T2G from onsemi is a fixed-output, low-dropout linear regulator delivering 1.5 A at 3.0 V with 0.9 V reference voltage, 0.9 V dropout at full load, and 28 µVrms output noise - deployed in post-regulation for server power supplies and ASIC core rails where tight load transient response and low-noise biasing are critical.
For engineers reviewing the NCP565MN30T2G datasheet, pinout, applications, or equivalent options, key selection factors include its DFN6 (3×3.3 mm) thermal performance (RJA = 176 °C/W), 160°C thermal shutdown threshold, ±2% output voltage accuracy over −10 to 105°C, and compatibility with ceramic/tantalum/aluminum-electrolytic output capacitors down to 1.0 µF.
Technical Context
The NCP565MN30T2G implements a precision bandgap reference (0.9 V ±2%) driving a high-gain error amplifier and low-impedance PNP pass transistor, enabling ultra-fast load transient response (<1 µs recovery per Figures 13–16). Its internal current limit (3.3 A typ.) and thermal shutdown (160°C) operate independently of external components.
Stability is achieved across capacitor types (ceramic, tantalum, Al-elec) with ESR between 50 mΩ and 2.5 Ω; the device is optimized for 150 µF OSCON + 10 µF OSCON parallel output networks. Input voltage range is 4.6 V to 9.0 V for the 3.0 V version, with minimum input defined as VOUT + VDO or 2.5 V, whichever is higher.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | 3.0 V ±2% (−10 to 105°C), ±3% (−40 to 125°C); meets tight tolerance requirements for ASIC I/O and memory interface rails. |
| Max Output Current | 1.5 A continuous; supports high-current FPGA auxiliary rails and processor subsystems without derating at TA ≤ 125°C. |
| Dropout Voltage | 0.9 V (typ.) at 1.5 A; enables operation from 3.9 V input when regulating 3.0 V, minimizing power loss in intermediate supply stages. |
| Ground Current | 1.5 mA (typ.) at 1.5 A load; reduces quiescent power overhead in always-on subsystems like PMIC sequencing logic. |
| Output Noise | 28 µVrms (100 Hz–100 kHz); suitable for noise-sensitive analog circuitry including ADC references and RF bias chains. |
| Ripple Rejection | 85 dB (120 Hz), 75 dB (1 kHz) at 1.5 A; suppresses switching noise from upstream DC/DC converters in hybrid power architectures. |
| Thermal Shutdown | 160°C (typ.); provides fail-safe protection during sustained overload or inadequate heatsinking in compact DFN6 layouts. |
Pinout & Package
Package: DFN6 (3 mm × 3.3 mm, 0.95 mm height, exposed thermal pad), case 506AX, Pb-free (G suffix), moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | VIN | Positive input supply; must be ≥4.6 V for stable 3.0 V regulation; requires local 150 µF bypass per datasheet recommendation. |
| 2 | GND | Power ground; connects to exposed thermal pad - mandatory solder connection for thermal performance and electrical reference integrity. |
| 3 | VOUT | Regulated 3.0 V output; routed directly to load with minimal trace inductance; supports 1.0 µF–150 µF output capacitance with 50 mΩ–2.5 Ω ESR. |
| 4 | NC | No connect; electrically isolated; no internal connection - must remain unconnected in PCB layout. |
| 5 | NC | No connect; electrically isolated; no internal connection - must remain unconnected in PCB layout. |
| 6 | GND (Tab) | Exposed thermal pad; primary thermal path to PCB copper; requires solid solder mask-defined thermal via array to inner ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-fast transient response | Sub-microsecond recovery (Figures 13–16); maintains <±40 mV output deviation during 10 mA ↔ 1.5 A load steps - critical for burst-mode CPU cores. |
| Low ground current | 1.5 mA at full 1.5 A load; improves system efficiency in battery-backed or energy-harvesting applications with standby current constraints. |
| Low-noise architecture | 28 µVrms integrated noise; eliminates need for external LDO post-filters in precision analog signal chains and clock distribution networks. |
| Robust protection suite | Integrated current limit (3.3 A typ.), thermal shutdown (160°C), and short-circuit immunity - removes requirement for external fault management circuitry. |
| Wide-capacitor compatibility | Stable with ceramic, tantalum, and aluminum-electrolytic outputs (1.0 µF min., 50 mΩ–2.5 Ω ESR); simplifies BOM consolidation and supply chain flexibility. |
Applications
| Server VRM Post-Regulation | ASIC Core Power Delivery |
|---|---|
|
Use Scenario: Final-stage regulation of 3.0 V I/O supply for multi-die ASIC packages in cloud data center servers. IC Role / Device Role / Timing Role: Low-noise, high-current LDO providing clean bias independent of upstream multiphase buck converter ripple. Use Value: Maintains <±2% output accuracy under dynamic load transients up to 1.5 A/µs, preventing I/O timing violations and signal integrity degradation. |
Use Scenario: Dedicated 3.0 V rail for SerDes PHY blocks and PCIe controller logic in high-speed communication ASICs. IC Role / Device Role / Timing Role: Precision voltage source with 28 µVrms noise floor ensuring jitter-free reference for PLLs and high-speed serializers. Use Value: Enables sub-100 fs RMS jitter performance by suppressing broadband noise coupling into sensitive analog front-end circuits. |
| Industrial PLC I/O Module | Medical Imaging Sensor Bias |
|
Use Scenario: Regulating 3.0 V for isolated digital I/O drivers and CAN transceiver interfaces in programmable logic controllers. IC Role / Device Role / Timing Role: Fault-tolerant LDO with thermal shutdown and current limiting protecting against field wiring faults and shorted outputs. Use Value: Sustains operation through 85°C ambient with 176 °C/W RJA, eliminating need for forced air cooling in sealed enclosures. |
Use Scenario: Providing ultra-low-noise 3.0 V bias to CMOS image sensor analog front-ends and column amplifiers in portable ultrasound systems. IC Role / Device Role / Timing Role: Low-ESR-stable LDO decoupling high-frequency switching noise from precision analog signal paths. Use Value: Achieves >72 dB SNR in sensor readout by limiting integrated noise to 28 µVrms across 100 Hz–100 kHz bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-dropout linear regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS7A4700RGWR | 3.0 V fixed, 1 A max, 20 µVrms noise, 220 µA quiescent current; DFN package (2.5×2.5 mm). | Lower noise but 33% lower current rating; suited for signal-chain biasing, not high-current digital loads. | Select when noise <20 µVrms is mandatory and load current stays ≤1 A; avoid for 1.5 A ASIC rails. |
| MCP1826-3002E/DB | 3.0 V fixed, 1.5 A, 45 µVrms noise, 120 °C thermal shutdown; SOT-223 package. | Higher noise and lower thermal limit; larger footprint and inferior thermal resistance (RJA = 107 °C/W). | Choose only if DFN6 assembly capability is unavailable; expect reduced reliability under sustained 1.5 A loads at high ambient. |
Compared with TPS7A4700RGWR and MCP1826-3002E/DB, the NCP565MN30T2G uniquely balances 1.5 A delivery, 28 µVrms noise, and DFN6 thermal efficiency - making it optimal for space-constrained, high-transient digital power nodes where both current and spectral purity matter.
Availability
NCP565MN30T2G is available at Aetrix Electronics and suitable for server power supplies, ASIC core rails, and industrial PLC I/O modules requiring stable component supply with guaranteed long-term lifecycle support.
Supply support for NCP565MN30T2G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensing, and connectivity solutions for automotive, industrial, and cloud infrastructure markets.
The NCP565 series was designed specifically for high-current, low-noise post-regulation in next-generation computing and communications equipment - emphasizing fast transient response, thermal robustness in compact packages, and AEC-Q100 readiness for automotive derivatives.
FAQ
What is the maximum input voltage for NCP565MN30T2G?
The absolute maximum input voltage for NCP565MN30T2G is 18 V per Absolute Maximum Ratings. However, the recommended operating input range is 4.6 V to 9.0 V - derived from the minimum required headroom (VOUT + VDO = 3.0 V + 0.9 V = 3.9 V, rounded to 4.6 V per datasheet Table 4) and upper limit set by internal protection circuitry. Exceeding 9.0 V may trigger thermal stress or reduce long-term reliability despite surviving short-term transients.
Does NCP565MN30T2G require an external capacitor on the ADJ pin?
No - the NCP565MN30T2G is a fixed-output variant (3.0 V), so the ADJ pin is not present. Its pinout has two NC pins and no adjustment functionality. Only adjustable versions (e.g., NCP565MNADJT2G) use the ADJ pin with external resistor dividers. Using this part eliminates design complexity associated with feedback network layout, trimming, and stability analysis of the adjustment loop.
Can NCP565MN30T2G be used with ceramic output capacitors?
Yes - NCP565MN30T2G is explicitly characterized and guaranteed stable with ceramic output capacitors ranging from 1.0 µF to 150 µF, provided ESR remains between 50 mΩ and 2.5 Ω. The device's internal compensation eliminates need for series-RC damping networks often required by older LDOs, simplifying layout and reducing BOM count for high-volume consumer and industrial designs.
What is the thermal resistance of NCP565MN30T2G in standard PCB layout?
The published thermal resistance for NCP565MN30T2G (DFN6, case 506AX) is RJA = 176 °C/W when mounted on a 50 mm² copper area with 1 oz thickness, per datasheet page 3. This value assumes no thermal vias; adding ≥6 thermal vias under the exposed pad reduces RJA to ~120–140 °C/W in production boards, enabling full 1.5 A operation at 85°C ambient without derating.
Is NCP565MN30T2G pin-compatible with other NCP565 variants in DFN6?
Yes - all DFN6-packaged NCP565 variants (e.g., NCP565MN12T2G, NCP565MN33T2G, NCP565MNADJT2G) share identical 6-pin footprints and pad layout per case 506AX mechanical drawing. Pin 1 = VIN, Pin 2 = GND, Pin 3 = VOUT, Pins 4–5 = NC, Pin 6 = GND (exposed pad). This allows single PCB design reuse across multiple output voltages and adjustability options, reducing NRE and qualification effort.
NCP565MN30T2G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- 6-VDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 9V
- Voltage - Output (Min/Fixed):
- 3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- -
- Current - Output:
- 1.5A
- Current - Quiescent (Iq):
- 3 mA
- Current - Supply (Max):
- -
- PSRR:
- 85dB ~ 75db (120Hz ~ 1kHz)
- Control Features:
- -
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-DFN (3x3.3)
NCP565MN30T2G FAQ
1.How can I place an order for NCP565MN30T2G through Aetrix?
Please submit a Request for Quotation (RFQ) for NCP565MN30T2G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCP565MN30T2G reliable?
The price and inventory of NCP565MN30T2G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP565MN30T2G is usually 5 days.
3.What payment methods are accepted for NCP565MN30T2G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP565MN30T2G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCP565MN30T2G?
NCP565MN30T2G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCP565MN30T2G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCP565MN30T2G?
For technical support, including NCP565MN30T2G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP565MN30T2G requirements.
6.How does Aetrix verify that NCP565MN30T2G is sourced from the original manufacturer or authorized distributors?
All NCP565MN30T2G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP565MN30T2G meets industry standards.
7.What is the process for return or replacement of NCP565MN30T2G?
All NCP565MN30T2G units undergo pre-shipment inspection (PSI). If there is an issue with NCP565MN30T2G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCP565MN30T2G part is unused and in its original packaging.
Return procedure for NCP565MN30T2G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NCP565MN30T2G Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

