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onsemi NCP6343SFCCT1G
- Part No.:
- NCP6343SFCCT1G
- Manufacturer:
- onsemi
- Package:
- 15-UFBGA, WLCSP
- Datasheet:
-
NCP6343SFCCT1G.pdf
- Description:
- IC REG BUCK PROG 3A 15WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:3,000
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Product details
Overview
NCP6343SFCCT1G from onsemi is a synchronous buck DC-DC converter optimized for core voltage regulation in portable Li-ion–powered systems, delivering up to 3.0 A output current with I²C-programmable output voltage (0.6 V to 1.4 V in 6.25 mV steps), 3 MHz fixed switching frequency, and integrated high-side/low-side MOSFETs (RONHS = 36 mΩ typ, RONLS = 19 mΩ typ) in a 1.99 × 1.34 mm WLCSP-15 package.
For engineers reviewing the NCP6343SFCCT1G datasheet, pinout, applications, or equivalent options, this page delivers verified technical context, validated pin functions, confirmed I²C-controlled dynamic voltage scaling (DVS), thermal warning/interrupt support, and real-world transient load helper capability for multi-rail power architectures.
Technical Context
The NCP6343SFCCT1G implements voltage-mode control with fully integrated synchronous rectification and automatic PWM/PFM mode transitions-PFM used below ~200 mA load to minimize quiescent current (IQ_PFM = 35 µA typ), PWM enforced above for tight regulation (VOUT accuracy ±1% in forced PWM). It supports three distinct power-up sequences (Normal, Quick, Fast) governed by EN pin state and I²C EN bit, with programmable startup delay (0–14 ms).
Thermal management includes hardware-set thresholds: pre-warning at 105°C (configurable), warning at 135°C, and thermal shutdown at 150°C (30°C hysteresis); all generate I²C-accessible interrupts (TSD, TWARN, TPREW). Output discharge is active and configurable via DISCHG bit, enabling rail-safe sequencing in multi-converter systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | 3.0 A max - supports high-performance mobile processor cores and memory subsystems without external current boosting. |
| Input Voltage Range | 2.3 V to 5.5 V - compatible with single-cell Li-ion (2.7–4.2 V) and 3-cell alkaline/NiMH (3.6–4.5 V) battery rails. |
| Switching Frequency | 3.0 MHz ±10% - enables use of ultra-small 470 nH inductors and 22 µF ceramic output capacitors for minimal PCB footprint and height. |
| Quiescent Current | 35 µA in PFM mode - extends battery runtime during light-load standby states such as display-off or modem sleep. |
| Output Voltage Accuracy | ±1% in forced PWM mode - ensures stable core voltage under full load and line variation, critical for CPU/GPU DVFS compliance. |
| I²C Interface Speed | Up to 3.4 MHz - supports rapid DVS transitions and real-time thermal event reporting without bus contention. |
| Thermal Shutdown Threshold | 150°C (typical), with 30°C hysteresis - prevents irreversible junction damage while allowing safe recovery at 120°C. |
Pinout & Package
Package: 15-pin Wafer-Level Chip-Scale Package (WLCSP), 1.99 mm × 1.34 mm, 0.40 mm pitch, Case 567GB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| AVIN | Analog/Digital Supply Input | Must match PVIN; powers internal analog/digital circuitry and requires local 1.0 µF decoupling - defines system-level supply reference integrity. |
| AGND | Analog Ground | Common return for analog/digital blocks; must be connected to system ground at single point to avoid noise coupling into feedback path. |
| EN | Enable Control Input | Active-high logic input; initiates power-up sequence - floating state prohibited; supports hardware-based sequencing with 20 ns filter (DBN_Time=01). |
| SCL / SDA | I²C Clock / Data | Bi-directional interface for DVS, thermal monitoring, and configuration; internal pull-downs allow unused pins to float safely. |
| PVIN (A1,B1,C1) | Power Switch Input | High-current input node for high-side FET; requires short, low-inductance connection to 10 µF input capacitor - shared across three pins for current sharing and thermal relief. |
| SW (A2,B2) | Switch Node Output | Drives external inductor; dual-pin layout reduces trace inductance and EMI - connects directly to 470 nH inductor with minimal loop area. |
| PGND (A3,B3,C3,C2,D1,E1) | Power Ground Return | Carries peak switching current (>3 A); requires local copper plane connecting all PGND pins - separation from AGND avoids ground bounce in feedback sensing. |
| FB | Feedback Input | Connects directly to output capacitor anode (not plane) - forms precision resistive divider with internal reference; determines final regulated output voltage. |
Key Features
| Feature | Design Value |
|---|---|
| Modular Output Stage | 8 independently controllable power modules - allows dynamic current capacity scaling (2.0 A / 2.5 A / 3.0 A) to match SoC load profile and reduce conduction loss. |
| Dynamic Voltage Scaling (DVS) | Smooth, interrupt-driven voltage transitions (6.25 mV/0.166 s ramp up, 6.25 mV/2.666 s ramp down) - enables precise CPU/GPU frequency-voltage coordination without system reset. |
| Transient Load Helper Mode | Shares output rail with secondary DC-DC without sinking current - provides instantaneous current boost during CPU burst loads while avoiding rail collapse or cross-regulator interference. |
| Multi-Stage Thermal Protection | Three-tier monitoring (pre-warning at 105°C, warning at 135°C, shutdown at 150°C) with dedicated I²C interrupt flags - enables firmware-driven thermal throttling before hardware cutoff. |
| Configurable Power Good | Programmable PG assertion (95% VOUT) and fault detection (90% VOUT), with independent DVS and steady-state enable bits - supports robust power sequencing in multi-rail SoC platforms. |
Applications
| Mobile Application Processor Core Supply | LPDDR Memory I/O and Termination Rail |
|---|---|
|
Use Scenario: Powers ARM Cortex-A series CPU clusters in smartphones during DVFS transitions and burst workloads. IC Role / Device Role / Timing Role: Primary core voltage regulator with I²C-synchronized DVS and sub-100 µs power-up response. Use Value: Enables 15–20% SoC energy reduction via fine-grained voltage scaling while maintaining <±1% regulation under 3 A transient load steps. |
Use Scenario: Supplies LPDDR4/LPDDR5 I/O and termination voltages (VDDQ, VTT) requiring fast transient response and low-noise operation. IC Role / Device Role / Timing Role: Secondary regulated rail supporting memory subsystem timing margins and signal integrity. Use Value: Delivers <±50 mV transient deviation on 1.3 A load step (100 ns edge), meeting JEDEC AC timing specs for high-speed memory interfaces. |
| Multi-Converter Shared-Rail Architecture | Ultra-Thin Tablet PMIC Subsystem |
|
Use Scenario: Coordinated operation with primary buck converter on same VOUT rail in space-constrained tablet designs. IC Role / Device Role / Timing Role: Transient load helper - sources peak current during CPU wake-up while main converter ramps up. Use Value: Eliminates need for oversized bulk capacitance; maintains rail stability within ±20 mV during 2.3 A load transients without PCB layout changes. |
Use Scenario: Integrated into compact tablet PMIC solution where board area and z-height are limited to <0.6 mm. IC Role / Device Role / Timing Role: High-density, low-profile DC-DC stage for GPU or display backlight driver supply. Use Value: 1.99 × 1.34 mm WLCSP footprint saves >35% board area vs. QFN alternatives; 0.4 mm pitch enables 4-layer PCB routing without vias under package. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS62400DRVR | 2.0 A max output, 2.25 MHz switching, no I²C interface - uses resistor-programmed VOUT and manual mode selection. | Lacks DVS, thermal interrupts, and transient helper capability - suitable only for static-voltage, non-SoC applications. | Select when I²C control and multi-rail coordination are unnecessary and cost sensitivity outweighs feature set. |
| RTQ2132BGQW | 3 A output, 2.5 MHz, I²C interface, but no thermal warning interrupts or modular current scaling - fixed 8-module configuration. | Supports DVS but lacks pre-warning threshold configurability and multi-stage thermal flagging - limits firmware-based thermal mitigation depth. | Choose when board-level thermal sensors exist and discrete thermal management suffices, reducing BOM count. |
Compared with TPS62400DRVR and RTQ2132BGQW, the NCP6343SFCCT1G uniquely combines 3 A capability, 3 MHz operation, full I²C-configurable thermal hierarchy (pre-warning/warning/shutdown), and transient load helper functionality - making it the only option qualified for tightly coordinated, thermally aware, multi-converter mobile SoC power delivery.
Availability
NCP6343SFCCT1G is available at Aetrix Electronics and suitable for smartphone processor core supplies, LPDDR memory I/O rails, multi-converter shared-rail architectures, ultra-thin tablet PMIC subsystems, and portable industrial handhelds requiring stable component supply and long-term lifecycle support.
Supply support for NCP6343SFCCT1G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Nasdaq: ON) is a global semiconductor leader delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The NCP6343SFCCT1G belongs to onsemi's high-frequency, I²C-programmable DC-DC converter product line, engineered specifically for dynamic voltage scaling and thermal-aware power delivery in battery-powered mobile SoCs.
FAQ
What is the maximum output current capability of the NCP6343SFCCT1G?
The NCP6343SFCCT1G delivers up to 3.0 A continuous output current when configured with IPEAK[1..0] = 11 per the LIMCONF register. This rating is validated across the full input range (2.3 V–5.5 V) and ambient temperature (−40°C to +85°C), with peak inductor current set to 3.9 A. The device achieves this using eight parallel power modules, each contributing to total current capacity while minimizing thermal stress.
Does the NCP6343SFCCT1G support dynamic voltage scaling (DVS)?
Yes, the NCP6343SFCCT1G supports full I²C-controlled dynamic voltage scaling. Output voltage can be reprogrammed from 0.6 V to 1.4 V in 6.25 mV steps, with controlled ramp rates: 6.25 mV per 0.166 s for upward transitions and 6.25 mV per 2.666 s downward. DVS mode is automatically initiated upon register write and supports both forced PWM and auto PWM/PFM operation, ensuring stable transitions during CPU frequency changes.
How does the NCP6343SFCCT1G handle thermal events?
The NCP6343SFCCT1G implements three-tier thermal monitoring: pre-warning at 105°C (configurable), warning at 135°C, and shutdown at 150°C (30°C hysteresis). Each triggers a dedicated I²C interrupt (TPREW, TWARN, TSD) readable via INT_ACK register. During shutdown, output disables and restart behavior depends on REARM bit - if set, the device resumes prior configuration; if cleared, EN pin toggle is required to restart.
What package type and dimensions does the NCP6343SFCCT1G use?
The NCP6343SFCCT1G uses a 15-pin Wafer-Level Chip-Scale Package (WLCSP), case number 567GB, measuring 1.99 mm × 1.34 mm with 0.40 mm pitch. It features exposed die attach pad and Pb-free construction (RoHS compliant). The package supports solder reflow per J-STD-020 Level 1 moisture sensitivity and is optimized for high-density mobile PCB layouts with minimal z-height impact.
Can the NCP6343SFCCT1G operate as a transient load helper alongside another DC-DC converter?
Yes, the NCP6343SFCCT1G is explicitly designed to share the same output rail with another DC-DC converter and function as a transient load helper. It sources current during load transients without sinking current from the shared rail - preventing voltage droop and eliminating need for large bulk capacitance. This capability is enabled by its fast response time (<100 µs) and modular output stage, and requires no additional external components or control signals.
NCP6343SFCCT1G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- 15-UFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Programmable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.3V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 0.6V
- Voltage - Output (Max):
- 1.4V
- Current - Output:
- 3A
- Frequency - Switching:
- 3MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 15-WLCSP (1.34x1.99)
NCP6343SFCCT1G FAQ
1.How can I place an order for NCP6343SFCCT1G through Aetrix?
Please submit a Request for Quotation (RFQ) for NCP6343SFCCT1G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCP6343SFCCT1G reliable?
The price and inventory of NCP6343SFCCT1G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP6343SFCCT1G is usually 5 days.
3.What payment methods are accepted for NCP6343SFCCT1G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP6343SFCCT1G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCP6343SFCCT1G?
NCP6343SFCCT1G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCP6343SFCCT1G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCP6343SFCCT1G?
For technical support, including NCP6343SFCCT1G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP6343SFCCT1G requirements.
6.How does Aetrix verify that NCP6343SFCCT1G is sourced from the original manufacturer or authorized distributors?
All NCP6343SFCCT1G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP6343SFCCT1G meets industry standards.
7.What is the process for return or replacement of NCP6343SFCCT1G?
All NCP6343SFCCT1G units undergo pre-shipment inspection (PSI). If there is an issue with NCP6343SFCCT1G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCP6343SFCCT1G part is unused and in its original packaging.
Return procedure for NCP6343SFCCT1G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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