onsemi NCP700MN300R2G

Overview

NCP700MN300R2G from onsemi is a 3.0 V, 200 mA ultra-low-noise BiCMOS LDO regulator optimized for RF power amplifier supply in cellular handsets. It delivers ±3% output voltage accuracy across −40°C to +85°C, achieves 15 µV_rms output noise (with 100 nF C_noise), and provides 80 dB PSRR at 1 kHz - enabling clean biasing of sensitive analog/RF circuitry.

For engineers reviewing the NCP700MN300R2G datasheet, pinout, applications, or equivalent options, key selection criteria include dropout voltage (140 mV @ 200 mA), active discharge capability, thermal shutdown (150°C), and stability with 1 µF ceramic output capacitors in space-constrained portable designs.

Technical Context

The NCP700MN300R2G integrates a bandgap reference, error amplifier, and PMOS pass device in a BiCMOS process to simultaneously achieve low ground current (70–220 µA) and high dynamic performance. Its dedicated C_noise pin provides direct access to the internal reference node, allowing external 10–100 nF capacitors to suppress noise before amplification.

It features logic-level enable control (0.4 V low / 1.2 V high threshold), internal 5 MΩ pull-down on CE, and an active discharge transistor that rapidly sinks output charge when disabled - reducing turn-off time to 200–800 µs depending on load and C_noise value.

Key Specifications

Pinout & Package

DFN6 2×2.2 mm package (Case 506BA) with exposed thermal pad (EPAD) fused to pins 2 and 5 for enhanced thermal dissipation in compact PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with MCP1700T-3002E/MB and XC6206P302MR-G, the NCP700MN300R2G uniquely combines 80 dB PSRR, 15 µV_rms noise via C_noise, and active discharge - making it the only option among the three qualified for cellular PA bias where supply integrity directly impacts ACLR and EVM.

Availability

NCP700MN300R2G is available at Aetrix Electronics and suitable for cellular telephone RF front-ends, portable GPS receivers, and battery-powered precision instrumentation requiring stable component supply with full traceability and long-term lifecycle support.

Supply support for NCP700MN300R2G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensor, and connectivity solutions for automotive, industrial, and consumer markets.

The NCP700MN300R2G belongs to onsemi's ultra-low-noise RF LDO family, designed specifically to replace legacy regulators in noise-sensitive wireless infrastructure and mobile handset power domains where PSRR and output noise dominate system-level RF performance.

FAQ

What is the maximum input voltage rating for the NCP700MN300R2G?

The NCP700MN300R2G has an absolute maximum input voltage (Vin) rating of −0.3 V to 6.0 V. Operation above 5.5 V is not recommended per electrical characteristics testing conditions, and sustained exposure beyond 6.0 V may cause permanent damage. The device is optimized for 2.5–5.5 V input range to maintain 3.0 V regulation with 140 mV dropout at full load.

Does the NCP700MN300R2G require an external capacitor on the Cnoise pin?

Yes - the NCP700MN300R2G requires a capacitor (10 nF to 100 nF) connected between the Cnoise pin and GND to achieve its specified 15 µV_rms output noise. Without this capacitor, noise rises to 20 µV_rms. The capacitor directly filters the internal bandgap reference node, and omitting it degrades RF performance in PA and LNA applications.

What is the purpose of the exposed pad (EPAD) on the DFN6 package of the NCP700MN300R2G?

The exposed pad (EPAD) on the NCP700MN300R2G's DFN6 2×2.2 mm package is electrically and thermally connected to GND (pins 2 and 5). It must be soldered to a PCB thermal pad with ≥4 thermal vias to reduce junction-to-ambient thermal resistance from 120°C/W to ~37°C/W, preventing thermal shutdown during 200 mA continuous operation at elevated ambient temperatures.

Can the NCP700MN300R2G be used without connecting the CE pin?

Yes - the NCP700MN300R2G can operate without external CE control by connecting the CE pin directly to Vin. An internal 5 MΩ pull-down resistor ensures the device remains enabled when CE is tied high. Leaving CE floating is not recommended, as the undefined voltage may cause intermittent enable/disable behavior due to noise susceptibility near the 0.4–1.2 V threshold window.

How does the active discharge feature of the NCP700MN300R2G improve system reliability?

The active discharge circuit in the NCP700MN300R2G rapidly pulls down the Vout node when CE is driven low, reducing turn-off time to 200–800 µs depending on load and C_noise. This prevents residual voltage from causing unintended wake-up of downstream logic or latch-up in powered-off subsystems - a critical requirement for robust power sequencing in multi-rail portable electronics.