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onsemi NCP706MX300TAG
- Part No.:
- NCP706MX300TAG
- Manufacturer:
- onsemi
- Package:
- 8-XFDFN Exposed Pad
- Datasheet:
-
NCP706MX300TAG.pdf
- Description:
- IC REG LINEAR 3V 1A 8XDFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,110
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Product details
Overview
NCP706MX300TAG from onsemi is a 1 A, ±1% precision very low dropout (LDO) linear regulator with enable, designed for post-regulation and Li-ion battery-powered systems. It delivers stable 3.0 V output across −40°C to +125°C, supports 2.4 V–5.5 V input, achieves max 155 mV dropout at 1 A load, and integrates thermal shutdown and current limiting. It is used in space-constrained portable devices requiring high PSRR and low noise.
For engineers reviewing the NCP706MX300TAG datasheet, pinout, applications, or equivalent options, key selection criteria include dropout voltage at full load, output accuracy over temperature, EN threshold compatibility, stability with 1 µF ceramic output capacitor, and thermal performance in XDFN8 1.6×1.2 mm package.
Technical Context
The NCP706MX300TAG employs a PMOS pass transistor architecture enabling ultra-low dropout and no reverse current flow. Its internal soft-start limits inrush current during enable assertion, and remote sense (SNS) pin enables accurate regulation at the load by compensating for PCB trace IR drop.
It features undervoltage lockout (UVLO) at 1.2–1.9 V, 60 dB PSRR at 1 kHz, and operates stably with only 1 µF ceramic output capacitance-reducing BOM count and board area versus traditional LDOs requiring ≥4.7 µF.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.0 V ±1% over line/load/temperature - ensures consistent core or I/O rail voltage without external feedback. |
| Max Dropout Voltage | 155 mV at 1 A load - enables operation down to VIN = 3.155 V, critical for single-cell Li-ion (2.7–4.2 V) systems near end-of-discharge. |
| Input Voltage Range | 2.4 V to 5.5 V - supports direct connection to Li-ion batteries and intermediate rails like 3.3 V or 5 V supplies. |
| Quiescent Current | Typ. 170–230 µA - minimizes standby power loss in always-on subsystems such as RTC or sensor hubs. |
| PSRR @ 1 kHz | 58 dB - suppresses switching noise from upstream DC-DC converters, improving signal integrity in analog/audio sections. |
| Stable Output Capacitance | As low as 1 µF ceramic - eliminates need for large tantalum capacitors, reduces footprint and cost in compact designs. |
| Enable Threshold | VEN_HI = 0.9 V, VEN_LO = 0.4 V - compatible with 1.8 V and 3.3 V GPIOs without level-shifting. |
Pinout & Package
XDFN8 1.6 × 1.2 mm, 0.4 mm pitch, thermally enhanced package with exposed pad electrically connected to GND. Optimized for high-density portable PCB layouts and improved thermal dissipation via soldered ground plane connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2 | OUT | Regulated 3.0 V output; requires ≥1 µF ceramic capacitor to GND for stability. |
| 3 | N/C | No internal connection; may be tied to GND to improve thermal conduction from die to PCB. |
| 4 | SNS | Remote sense input; connect directly to load-side VOUT to compensate for PCB trace voltage drop. |
| 5 | GND | Power ground reference; must be low-impedance connection to system ground plane. |
| 6 | EN | Active-high enable; drives regulator ON when >0.9 V, OFF when <0.4 V; float or tie to VIN if unused. |
| 7, 8 | IN | Input supply (2.4–5.5 V); requires local 4.7 µF decoupling capacitor close to pins. |
| Exposed Pad | GND | Thermal and electrical connection to GND; mandatory soldering to PCB ground plane for rated thermal performance (RJA = 160°C/W). |
Key Features
| Feature | Design Value |
|---|---|
| Very Low Dropout | 155 mV max at 1 A ensures usable headroom even with aging or discharged Li-ion cells (down to ~3.15 V). |
| ±1% Output Accuracy | Maintained across −40°C to +125°C, 0–1 A load, and 2.4–5.5 V input - eliminates need for post-production calibration in industrial/medical apps. |
| 1 µF Ceramic Stability | Enables smallest possible output filter solution, reducing layout area and cost vs. legacy LDOs requiring ≥4.7 µF. |
| Integrated Protection | Thermal shutdown (160°C) with 20°C hysteresis and current limit (1.1 A) prevent damage during overload or fault conditions. |
| High PSRR & Low Noise | 58 dB @ 1 kHz and 300 µVRMS output noise (100 Hz–100 kHz) preserve signal integrity in RF, audio, and precision analog circuits. |
Applications
| Smartphone Core Rail | Portable Medical Sensor |
|---|---|
Use Scenario: Powering application processor I/O or memory interface in smartphones with tight space constraints and dynamic load profiles. IC Role / Device Role / Timing Role: Primary 3.0 V post-regulator delivering clean, stable voltage to high-speed digital interfaces. Use Value: 155 mV dropout extends battery runtime during peak current bursts; 1 µF stability simplifies layout in multi-layer HDI boards. |
Use Scenario: Supplying analog front-end (AFE) and low-power MCU in handheld ECG or pulse oximeter devices. IC Role / Device Role / Timing Role: Precision 3.0 V bias source for ADC reference and op-amp rails where noise and drift directly impact measurement accuracy. Use Value: ±1% accuracy and 300 µVRMS noise ensure sub-12-bit effective resolution; EN pin enables synchronized power sequencing with MCU wake-up. |
| Wearable Wireless Headset | Industrial IoT Edge Node |
Use Scenario: Regulating 3.0 V for Bluetooth SoC and MEMS microphone in compact earbud form factor. IC Role / Device Role / Timing Role: Low-noise, low-quiescent LDO supporting always-on voice detection and short-burst transmission. Use Value: 170–230 µA IQ minimizes standby drain; SNS pin maintains voltage accuracy at the SoC despite narrow PCB traces. |
Use Scenario: Providing regulated 3.0 V to microcontroller, LoRa transceiver, and environmental sensors in battery- or energy-harvested edge nodes. IC Role / Device Role / Timing Role: Robust, wide-input LDO tolerant of variable solar/battery sources and industrial temperature extremes. Use Value: 2.4–5.5 V input range accepts unregulated 3.7 V LiPo or 5 V USB; thermal shutdown protects against enclosure overheating in sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6210B302MR-G | 3.0 V fixed, 1 A, 250 mV dropout (typ), 25 µA IQ, SOT-25 package (2.9×2.8 mm) | Larger footprint, higher dropout, lower quiescent current - suitable for less space-constrained, ultra-low-power designs. | Choose when board area is less critical than IQ; verify thermal derating above 500 mA in SOT-25. |
| Diodes AP7361-30SG-7 | 3.0 V fixed, 1 A, 300 mV dropout (max), 60 µA IQ, X2-DFN-8 (2.0×2.0 mm) | Higher dropout, smaller IQ, larger package - trades off efficiency for longer battery life in light-load scenarios. | Prefer for battery-only systems with long sleep cycles; avoid in high-current or low-VIN margin applications. |
Compared with NCP706MX300TAG, the XC6210B302MR-G offers lower IQ but requires more input headroom and occupies 3.5× more PCB area, while the AP7361-30SG-7 provides ultra-low IQ at the expense of 2× higher dropout and reduced thermal capability in its larger DFN.
Availability
NCP706MX300TAG is available at Aetrix Electronics and suitable for smartphone power management, portable medical instrumentation, wearable audio systems, and industrial IoT edge nodes requiring stable component supply with guaranteed long-term availability.
Supply support for NCP706MX300TAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensor, and connectivity solutions for automotive, industrial, cloud, and consumer markets.
The NCP706MX300TAG belongs to onsemi's precision LDO family engineered for high-efficiency, low-noise power delivery in space- and battery-constrained portable electronics - emphasizing minimal dropout, tight accuracy, and robust protection.
FAQ
What is the minimum output capacitance required for stability of the NCP706MX300TAG?
The NCP706MX300TAG is stable with as little as 1 µF ceramic output capacitance, per the datasheet's APPLICATIONS INFORMATION section. This is confirmed for the 3.0 V version (NCP706MX300TAG) and enables significant board space savings compared to LDOs requiring ≥4.7 µF. Larger values improve PSRR and transient response but are not required for basic stability.
Does the NCP706MX300TAG support remote sensing, and how is it implemented?
Yes, the NCP706MX300TAG supports remote sensing via the SNS pin (Pin 4). To implement, connect SNS directly to the load-side VOUT node - not to the regulator's OUT pins - to compensate for voltage drop across PCB traces. This ensures the regulated voltage is maintained precisely at the point of load, critical for high-accuracy analog or high-current digital applications.
What is the maximum junction temperature and thermal shutdown behavior of the NCP706MX300TAG?
The NCP706MX300TAG triggers thermal shutdown at 160°C junction temperature and includes 20°C hysteresis, meaning it resumes operation only after cooling to ≤140°C. This protects the device during sustained overload or poor PCB thermal design. The XDFN8 package's RJA is 160°C/W, so proper grounding of the exposed pad to a thermal plane is essential to maintain safe operating temperatures at full 1 A load.
Can the NCP706MX300TAG be used with input voltages below 2.4 V?
No - the absolute minimum operating input voltage for the NCP706MX300TAG is 2.4 V, as specified in the Electrical Characteristics table for the 3.0 V version. Input voltages below this threshold may cause UVLO activation (trip point 1.2–1.9 V) or unpredictable regulation. For sub-2.4 V operation, consider alternative LDOs specifically rated for lower VIN, such as the NCP114 series.
Is the NCP706MX300TAG RoHS-compliant and lead-free?
Yes, the NCP706MX300TAG is a Pb-free device, as explicitly stated in the Features section and Ordering Information table of the datasheet. It complies with RoHS Directive 2011/65/EU and is marked with the "G" suffix and/or microdot to indicate lead-free packaging. The XDFN8 package uses matte tin terminations and meets JEDEC J-STD-020 reflow profile requirements.
NCP706MX300TAG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- 8-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.23V @ 1A
- Current - Output:
- 1A
- Current - Quiescent (Iq):
- 230 µA
- Current - Supply (Max):
- -
- PSRR:
- 58dB ~ 52dB (1kHz ~ 10khz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature, Soft Start, Under Voltage Lockout (UVLO)
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XDFN (1.6x1.2)
NCP706MX300TAG FAQ
1.How can I place an order for NCP706MX300TAG through Aetrix?
Please submit a Request for Quotation (RFQ) for NCP706MX300TAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCP706MX300TAG reliable?
The price and inventory of NCP706MX300TAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP706MX300TAG is usually 5 days.
3.What payment methods are accepted for NCP706MX300TAG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP706MX300TAG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCP706MX300TAG?
NCP706MX300TAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCP706MX300TAG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCP706MX300TAG?
For technical support, including NCP706MX300TAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP706MX300TAG requirements.
6.How does Aetrix verify that NCP706MX300TAG is sourced from the original manufacturer or authorized distributors?
All NCP706MX300TAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP706MX300TAG meets industry standards.
7.What is the process for return or replacement of NCP706MX300TAG?
All NCP706MX300TAG units undergo pre-shipment inspection (PSI). If there is an issue with NCP706MX300TAG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCP706MX300TAG part is unused and in its original packaging.
Return procedure for NCP706MX300TAG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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