onsemi NCP717CMX330TCG
- Part No.:
- NCP717CMX330TCG
- Manufacturer:
- onsemi
- Package:
- 4-XDFN Exposed Pad
- Datasheet:
-
NCP717CMX330TCG.pdf
- Description:
- IC REG LINEAR 3.3V 300MA 4XDFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,811
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NCP717CMX330TCG from onsemi is a 300 mA, fixed 3.3 V low-dropout (LDO) regulator with ultra-low quiescent current (25 µA typ. at no-load), 22 µVRMS output noise (100 Hz–100 kHz), and 155 mV typical dropout at 300 mA. It features active output discharge (120 Ω), thermal shutdown, current limiting, and stable operation with only 1 µF ceramic output capacitor - optimized for space-constrained, battery-powered portable electronics.
For engineers reviewing the NCP717CMX330TCG datasheet, pinout, applications, or equivalent options, key selection criteria include its 3.3 V fixed output, XDFN4 1.0×1.0 mm package, EN-controlled enable/disable with hysteresis, ±2% output accuracy over load/line/temperature, and suitability for noise-sensitive RF and medical subsystems requiring low IQ and high PSRR.
Technical Context
The NCP717CMX330TCG employs a PMOS pass transistor architecture enabling reverse-current blocking and low dropout across its 1.8–5.5 V input range. Its adaptive ground current circuitry dynamically reduces IQ under light/no-load conditions while maintaining regulation stability.
It integrates an internal bandgap reference, precision error amplifier, current-limit protection, thermal shutdown (160°C trip, 20°C hysteresis), and an active discharge switch (120 Ω) activated when EN < 0.4 V - distinguishing it from non-discharge variants (e.g., 'A' and 'B' suffixes) and enabling rapid VOUT ramp-down in power sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.3 V ±2% over load/line/temperature - ensures stable rail for 3.3 V microcontrollers and RF ICs without external feedback. |
| Max Output Current | 300 mA continuous - supports moderate-power peripherals like Bluetooth modules and sensor hubs. |
| Quiescent Current | 25 µA typical at no-load - extends battery life in always-on wearable and IoT edge nodes. |
| Dropout Voltage | 155 mV typical at 300 mA - enables operation down to VIN = 3.455 V, critical for single-cell Li-ion (3.0–4.2 V) systems. |
| Output Noise | 22 µVRMS (100 Hz–100 kHz) - meets stringent noise requirements for ADC references and RF front-ends. |
| PSRR | 70 dB at 1 kHz - suppresses switching noise from DC-DC converters feeding the LDO input. |
| Enable Threshold | VEN_HI = 0.9 V, VEN_LO = 0.4 V with 56 mV hysteresis - ensures robust logic-level control and noise immunity on EN line. |
| Active Discharge | 120 Ω pull-down when disabled - discharges output within ~330 µs (COUT = 1 µF), preventing floating rails during power-down sequencing. |
Pinout & Package
XDFN4 1.0 × 1.0 mm, 0.65 mm pitch, exposed pad (EPAD) thermally connected to GND. Compact footprint ideal for ultra-thin mobile PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - OUT | Regulated output voltage node | Delivers stable 3.3 V; requires ≥1 µF ceramic capacitor to GND for stability and transient response. |
| 2 - GND | Power supply ground reference | Primary return path; EPAD must be soldered directly to large GND copper plane for thermal dissipation. |
| 3 - EN | Logic-enable input | High (>0.9 V) enables regulation; low (<0.4 V) disables output and activates 120 Ω discharge path. |
| 4 - IN | Input voltage supply | Accepts 1.8–5.5 V; requires ≥1 µF ceramic capacitor close to pin to suppress input ripple and transients. |
| EPAD | Thermal and electrical ground | Not electrically isolated - must be connected to GND plane to meet RJA = 250°C/W spec and prevent thermal shutdown. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low quiescent current | 25 µA typ. at zero load - enables >1-year battery life in coin-cell-powered sensors. |
| Active output discharge | 120 Ω internal FET - eliminates need for external bleed resistor in power sequencing designs. |
| Stable with 1 µF ceramic COUT | No ESR requirement - simplifies BOM and layout vs. traditional LDOs needing tantalum or specific ESR ranges. |
| High PSRR at 1 kHz | 70 dB - effectively filters noise from upstream buck converters operating at ~1 MHz with 1-kHz harmonics. |
| ±2% output accuracy | Guaranteed over −40°C to +125°C, full load range - eliminates need for post-regulation trimming in industrial applications. |
| Thermal shutdown with hysteresis | 160°C trip / 140°C reset - prevents latch-up during momentary overload while allowing recovery without system reset. |
Applications
| Smartphone Power Rail | Wireless Medical Sensor |
|---|---|
Use Scenario: Providing clean 3.3 V bias to cellular modem baseband processor and GNSS receiver in tight-board-space smartphones. IC Role / Device Role / Timing Role: Primary low-noise post-regulator for RF and digital subsystems requiring minimal voltage deviation and fast transient response. Use Value: 22 µVRMS noise and 70 dB PSRR prevent bit errors in LTE/GNSS receivers; 155 mV dropout enables operation across full Li-ion voltage range. | Use Scenario: Powering ultra-low-power ECG front-end ASIC and BLE radio in disposable patch monitors. IC Role / Device Role / Timing Role: Main system LDO delivering regulated 3.3 V from coin cell or small Li-poly battery with minimal self-discharge. Use Value: 25 µA quiescent current extends battery life beyond 12 months; active discharge ensures safe shutdown during firmware updates. |
| Industrial IoT Gateway | Portable Diagnostic Device |
Use Scenario: Supplying 3.3 V to ARM Cortex-M7 MCU, Ethernet PHY, and CAN transceiver in fanless edge gateway. IC Role / Device Role / Timing Role: High-reliability, thermally robust LDO supporting wide ambient temperature range (−40°C to +85°C). Use Value: ±2% accuracy and thermal shutdown (160°C) ensure consistent operation in unventilated enclosures; XDFN4 package minimizes board area. | Use Scenario: Regulating power for CCD image sensor, analog front-end, and LCD controller in handheld ultrasound probe. IC Role / Device Role / Timing Role: Low-noise, low-dropout source for analog signal chain where supply ripple directly impacts SNR. Use Value: 22 µVRMS noise preserves dynamic range of 14-bit ADCs; 1 µF stability allows use of smallest 0402 MLCCs to reduce solution size. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCP1700T-3302E/TT | 250 mA max output, 1.6 µA IQ, no active discharge, SOT-23-5 package | Lacks active discharge and higher current capability; suitable only for simpler, lower-power systems without strict sequencing needs | Select when ultra-low IQ dominates over discharge and current requirements |
| Torex XC6210B332MR-G | 300 mA, 25 µA IQ, 30 µVRMS noise, no active discharge, SOT-25 package | Higher noise, no discharge function, larger footprint - acceptable where sequencing is handled externally | Select when footprint and noise are secondary to cost and availability in high-volume consumer designs |
Compared with MCP1700T-3302E/TT and XC6210B332MR-G, the NCP717CMX330TCG uniquely combines 300 mA drive, 22 µVRMS noise, and 120 Ω active discharge in a 1.0×1.0 mm XDFN4 package - making it optimal for compact, sequenced, noise-critical portable systems where all three attributes are simultaneously required.
Availability
NCP717CMX330TCG is available at Aetrix Electronics and suitable for smartphone power management, wireless medical sensors, industrial IoT gateways, and portable diagnostic devices requiring stable component supply, long-term lifecycle support, and Pb-free compliance.
Supply support for NCP717CMX330TCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient electronics, with leadership in power management, analog, sensing, and connectivity solutions.
The NCP717 series is designed for ultra-low-power, noise-sensitive portable applications - delivering high-performance LDO regulation in minimal footprint for battery-operated devices demanding extended runtime and signal integrity.
FAQ
What is the output voltage tolerance of the NCP717CMX330TCG over temperature and load?
The NCP717CMX330TCG maintains ±2% output voltage accuracy across −40°C to +125°C junction temperature, full 0–300 mA load range, and input voltage from VOUT(nom)+0.5 V to 5.5 V. This is verified per Electrical Characteristics table on page 3 of the datasheet, ensuring reliable 3.3 V rail delivery in automotive cabin and industrial environments where thermal stress is significant.
Does the NCP717CMX330TCG require an external discharge resistor?
No, the NCP717CMX330TCG does not require an external discharge resistor because it integrates an active output discharge FET with 120 Ω on-resistance. When EN is pulled below 0.4 V, this internal path pulls VOUT to GND, discharging a 1 µF capacitor in approximately 330 µs - eliminating BOM cost and board space otherwise needed for discrete discharge circuits.
What is the minimum input voltage required for the NCP717CMX330TCG to maintain regulation at 300 mA?
The NCP717CMX330TCG requires a minimum input voltage of 3.455 V to maintain 3.3 V regulation at 300 mA, based on its typical 155 mV dropout voltage (VDO) at that load. At worst-case 230 mV dropout (max spec), VIN must be ≥3.53 V. This enables compatibility with single-cell Li-ion batteries down to ~3.5 V under heavy load.
Can the NCP717CMX330TCG operate with a 100 nF output capacitor?
Yes, the NCP717CMX330TCG remains stable with a minimum 100 nF ceramic output capacitor, though the datasheet recommends ≥1 µF for optimal transient response and PSRR. The 100 nF lower bound accounts for capacitance loss due to DC bias and temperature; using 1 µF provides safety margin and meets typical design guidelines for load step performance.
How does the enable pin hysteresis improve system reliability in noisy environments?
The NCP717CMX330TCG's enable pin incorporates 56 mV of built-in hysteresis between turn-on (0.9 V) and turn-off (0.4 V) thresholds, plus deglitch timing. This prevents oscillatory on/off behavior caused by noise or slow-rising EN signals - ensuring clean, monotonic power-up and power-down sequences essential for microcontroller reset integrity and data retention in portable systems.
NCP717CMX330TCG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- 4-XDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.23V @ 300mA
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 35 µA
- Current - Supply (Max):
- -
- PSRR:
- -
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-XDFN (1x1)
NCP717CMX330TCG FAQ
1.How can I place an order for NCP717CMX330TCG through Aetrix?
Please submit a Request for Quotation (RFQ) for NCP717CMX330TCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCP717CMX330TCG reliable?
The price and inventory of NCP717CMX330TCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP717CMX330TCG is usually 5 days.
3.What payment methods are accepted for NCP717CMX330TCG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP717CMX330TCG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCP717CMX330TCG?
NCP717CMX330TCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCP717CMX330TCG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCP717CMX330TCG?
For technical support, including NCP717CMX330TCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP717CMX330TCG requirements.
6.How does Aetrix verify that NCP717CMX330TCG is sourced from the original manufacturer or authorized distributors?
All NCP717CMX330TCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP717CMX330TCG meets industry standards.
7.What is the process for return or replacement of NCP717CMX330TCG?
All NCP717CMX330TCG units undergo pre-shipment inspection (PSI). If there is an issue with NCP717CMX330TCG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCP717CMX330TCG part is unused and in its original packaging.
Return procedure for NCP717CMX330TCG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NCP717CMX330TCG Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

