onsemi NCP752BSN30T1G
- Part No.:
- NCP752BSN30T1G
- Manufacturer:
- onsemi
- Package:
- SOT-23-5 Thin, TSOT-23-5
- Datasheet:
-
NCP752BSN30T1G.pdf
- Description:
- IC REG LINEAR 3V 200MA 5TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,634
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NCP752BSN30T1G from onsemi is a 200 mA ultra-low-noise, ultra-low-quiescent-current LDO voltage regulator with fixed 3.0 V output, Power Good (PG) flag, and active output discharge. It delivers ±2% output accuracy over load/line/temperature, 11.5 µVRMS noise (100 Hz–100 kHz), and 68 dB PSRR at 1 kHz - optimized for RF power amplifiers in satellite radios and infotainment systems.
For engineers reviewing the NCP752BSN30T1G datasheet, pinout, applications, or equivalent options, key selection criteria include dropout voltage (130 mV @ 200 mA), enable threshold (0.9 V high / 0.4 V low), thermal shutdown (160°C), and compatibility with 1 µF ceramic output capacitors without external bypass.
Technical Context
The NCP752BSN30T1G employs a PMOS pass transistor architecture enabling reverse-current blocking and ultra-low quiescent current (12 µA typ. at no load). Its Auto Low-Power Mode dynamically reduces ground current under light loads, while internal soft-start limits inrush current during turn-on.
It integrates an open-drain Power Good output with 92–96% VOUT rising/falling thresholds and 2% hysteresis, plus active discharge via a 1 kΩ internal pull-down when disabled - ensuring fast, controlled turn-off in battery-sensitive portable systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | 200 mA max - supports RF PA biasing and microcontroller core rails in compact portable devices. |
| Dropout Voltage | 130 mV typical @ 200 mA - enables stable 3.0 V regulation from as low as 3.13 V input (e.g., single-cell Li-ion at end-of-discharge). |
| Quiescent Current | 12 µA typical @ no load - extends battery life in always-on GPS or Bluetooth® modules. |
| Output Noise | 11.5 µVRMS (100 Hz–100 kHz) - eliminates need for external noise-bypass capacitors in noise-sensitive RF signal chains. |
| PSRR | 68 dB @ 1 kHz - suppresses switching noise from upstream DC-DC converters feeding RF subsystems. |
| Accuracy | ±2% over load/line/temperature - ensures reliable logic-level compliance for 3.0 V I/O domains without calibration. |
| Enable Threshold | 0.9 V (high), 0.4 V (low) - compatible with standard GPIOs and supports clean sequencing in multi-rail systems. |
Pinout & Package
Package: XDFN-6 (1.5 mm × 1.5 mm, 0.5 mm pitch, Case 711AE), thermally enhanced with exposed pad for PCB heat sinking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (IN) | Input voltage supply | Accepts 2.0–5.5 V; requires ≥1 µF ceramic capacitor to GND for stability and transient immunity. |
| 2 (PG) | Open-drain Power Good output | Asserts low when VOUT drops below 92% of nominal; pulled up externally to monitor regulation status. |
| 3 (GND) | Power ground reference | Die ground connected to lead frame; must be soldered to large copper plane for thermal dissipation (RJA = 149°C/W). |
| 4 (EN) | Enable control input | Logic-high (>0.9 V) enables regulator; logic-low (<0.4 V) disables with <0.12 µA shutdown current and active discharge. |
| 5 (N/C) | No-connect terminal | Internally unconnected; may be tied to GND to improve thermal conduction without electrical impact. |
| 6 (OUT) | Regulated output | Delivers fixed 3.0 V; stable with ≥1 µF ceramic capacitor (ESR < 700 mΩ); supports fast load transients up to 200 mA. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low noise without bypass cap | 11.5 µVRMS noise achieved internally - eliminates BOM cost and board space for external RC filters in RF front-ends. |
| Active output discharge | 1 kΩ internal pull-down engages on disable - ensures rapid, predictable VOUT decay for safe power sequencing in multi-voltage SoC systems. |
| Auto Low-Power Mode | Reduces IQ to 12 µA at zero load - critical for maintaining >1-year shelf life in IoT sensors and wearable medical devices. |
| Stable with 1 µF ceramic output cap | No minimum ESR requirement - enables use of small, low-cost, high-reliability X5R/X7R MLCCs instead of larger tantalum or polymer caps. |
| Integrated protections | Thermal shutdown (160°C), current limit (~400 mA), and UVLO (1.2–1.9 V) - prevent fault propagation without external circuitry. |
Applications
| Satellite Radio Power Amplifier | Portable Medical Sensor Node |
|---|---|
|
Use Scenario: Biasing GaAs or SiGe RF power amplifier stages in handheld satellite radio receivers where supply ripple directly modulates carrier phase. IC Role / Device Role / Timing Role: Ultra-clean 3.0 V LDO providing stable PA collector voltage; PG signal validates rail integrity before transmission burst. Use Value: 11.5 µVRMS noise and 68 dB PSRR prevent AM-to-PM distortion and maintain EVM < 3% in QPSK modulation. |
Use Scenario: Powering low-power ADCs, analog front-ends, and BLE SoCs in disposable glucose monitors or pulse oximeters operating from coin-cell batteries. IC Role / Device Role / Timing Role: Primary 3.0 V system rail with EN-controlled wake-up; active discharge clears residual charge before deep-sleep entry. Use Value: 12 µA quiescent current extends 3V CR2032 battery life to >18 months in 1-min sampling intervals. |
| Infotainment Head Unit Core Logic | Smartphone Subsystem Rail |
|
Use Scenario: Supplying FPGA configuration memory and touch controller I/O in automotive infotainment displays subject to wide ambient temperature swings (−40°C to +105°C). IC Role / Device Role / Timing Role: Fixed 3.0 V LDO with ±2% accuracy and PG monitoring; thermal shutdown prevents latch-up during prolonged summer operation. Use Value: Stable output across −40°C to +125°C junction range ensures reliable boot and UI responsiveness without calibration drift. |
Use Scenario: Delivering clean 3.0 V to camera ISP, audio codec, or NFC controller in smartphones where space and EMI are constrained. IC Role / Device Role / Timing Role: Secondary regulated rail enabled only during active use; PG signal synchronizes peripheral initialization with voltage stabilization. Use Value: 130 mV dropout allows operation from shared 3.3 V DC-DC bus even under heavy load, minimizing brownouts during video capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCP1700T-3002E/MB | 300 mA rating, 1.6 µA IQ, no PG or active discharge; SOT-23-5 package. | Lacks Power Good monitoring and fast turn-off - unsuitable for sequenced multi-rail systems requiring rail validation. | Choose for ultra-low-IQ battery backup rails where PG and discharge are unnecessary. |
| TPL7407LDR | 200 mA, 25 µA IQ, integrated 7-channel NMOS array; no fixed 3.0 V option - requires external feedback. | Configurable output but adds resistor network and layout complexity; no PG or thermal shutdown. | Choose when driving multiple low-side loads (e.g., LEDs, relays) alongside regulation - not a drop-in replacement. |
Compared with MCP1700T-3002E/MB and TPL7407LDR, the NCP752BSN30T1G uniquely combines ultra-low noise, integrated PG, and active discharge in a 1.5×1.5 mm footprint - making it optimal for RF and portable medical designs demanding both precision and safety-critical sequencing.
Availability
NCP752BSN30T1G is available at Aetrix Electronics and suitable for satellite radio, portable medical sensors, and automotive infotainment systems requiring stable component supply, long-lifecycle support, and guaranteed Pb-free compliance.
Supply support for NCP752BSN30T1G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi is a global semiconductor leader delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, and IoT applications.
The NCP752 series targets noise-sensitive, battery-constrained systems - designed specifically for RF power amplifiers, portable instrumentation, and always-on wireless peripherals needing ultra-low IQ and clean regulation.
FAQ
What is the maximum input voltage rating for the NCP752BSN30T1G?
The NCP752BSN30T1G has an absolute maximum input voltage of 6 V. Operation beyond this risks permanent damage. For reliable continuous operation, the recommended input range is 2.0 V to 5.5 V - sufficient to support single-cell Li-ion (2.7–4.2 V) and 3.3 V system buses with margin.
Does the NCP752BSN30T1G require an external noise-bypass capacitor?
No, the NCP752BSN30T1G achieves 11.5 µVRMS output noise (100 Hz–100 kHz) without any external bypass capacitor. Its internal design eliminates the need for additional RC filtering - reducing BOM count, PCB area, and potential resonance issues in RF layouts.
How does the Power Good (PG) output behave during startup and fault conditions?
The NCP752BSN30T1G's open-drain PG pin asserts high (via external pull-up) only when VOUT reaches and sustains ≥92% of 3.0 V. It de-asserts low if VOUT falls below 90% - providing precise rail validation for microcontroller reset sequencing or system-level health monitoring.
What thermal performance can be expected from the NCP752BSN30T1G in a standard PCB layout?
In a typical layout with 645 mm² copper area on 1 oz FR-4, the NCP752BSN30T1G exhibits RJA = 149°C/W (XDFN-6). At 200 mA load with 3.3 V input, power dissipation is ~60 mW - resulting in ~9°C junction rise above ambient, well within the 125°C max operating limit.
Can the NCP752BSN30T1G be used with a 0.5 µF output capacitor?
No - the NCP752BSN30T1G requires a minimum of 500 nF effective output capacitance for stability, but the datasheet specifies 1.0 µF as the recommended value to ensure robustness against DC bias, temperature, and tolerance variations. Using 0.5 µF risks instability and oscillation under load transients.
NCP752BSN30T1G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- SOT-23-5 Thin, TSOT-23-5
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- -
- Current - Output:
- 200mA
- Current - Quiescent (Iq):
- 25 µA
- Current - Supply (Max):
- -
- PSRR:
- -
- Control Features:
- Enable, Power Good
- Protection Features:
- Over Current, Over Temperature, Under Voltage Lockout (UVLO)
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-TSOP
NCP752BSN30T1G FAQ
1.How can I place an order for NCP752BSN30T1G through Aetrix?
Please submit a Request for Quotation (RFQ) for NCP752BSN30T1G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCP752BSN30T1G reliable?
The price and inventory of NCP752BSN30T1G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCP752BSN30T1G is usually 5 days.
3.What payment methods are accepted for NCP752BSN30T1G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCP752BSN30T1G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCP752BSN30T1G?
NCP752BSN30T1G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCP752BSN30T1G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCP752BSN30T1G?
For technical support, including NCP752BSN30T1G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCP752BSN30T1G requirements.
6.How does Aetrix verify that NCP752BSN30T1G is sourced from the original manufacturer or authorized distributors?
All NCP752BSN30T1G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCP752BSN30T1G meets industry standards.
7.What is the process for return or replacement of NCP752BSN30T1G?
All NCP752BSN30T1G units undergo pre-shipment inspection (PSI). If there is an issue with NCP752BSN30T1G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCP752BSN30T1G part is unused and in its original packaging.
Return procedure for NCP752BSN30T1G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NCP752BSN30T1G Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
