My Inquiry
My Account
onsemi NCV6323BMTAATBG
- Part No.:
- NCV6323BMTAATBG
- Manufacturer:
- onsemi
- Package:
- 8-WFDFN Exposed Pad
- Datasheet:
-
NCV6323BMTAATBG.pdf
- Description:
- IC REG BUCK ADJ 2A 8WDFN
- Quantity:
- Payment:
- Shipping:
Inventory:14,353
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NCV6323BMTAATBG from onsemi is a synchronous buck converter optimized for sub-system power delivery in portable electronics powered by single-cell Li-ion or triple-cell alkaline/NiCd/NiMH batteries. It delivers up to 2 A at an externally adjustable output voltage (0.6 V to VIN), operates at 3 MHz switching frequency, features integrated high- and low-side MOSFETs (RDS(on) = 160 mΩ / 110 mΩ), and includes Power Good output, soft-start, and active output discharge. It serves as a point-of-load regulator in smartphone application processors or camera ISPs.
For engineers reviewing the NCV6323BMTAATBG datasheet, pinout, applications, or equivalent options, this page provides verified technical context, validated pin functions, confirmed automotive-grade AEC-Q100 qualification, exact WDFN8 package dimensions (2.0 × 2.0 × 0.75 mm), and two rigorously cross-referenced alternative parts with documented functional and application differences.
Technical Context
The NCV6323BMTAATBG employs input-voltage feedforward control to maintain regulation across its 2.5 V–5.5 V input range while sustaining fixed-frequency PWM operation at 3 MHz (±10%). Its dual-MOSFET synchronous rectification architecture-comprising a P-channel high-side switch and N-channel low-side switch-enables high efficiency (>85% at 1.8 V/1 A, VIN = 3.6 V) and low output ripple without external diodes.
It integrates cycle-by-cycle overcurrent protection (2.8 A typical peak limit), thermal shutdown (170 °C trip, 25 °C hysteresis), undervoltage lockout (2.4 V falling threshold, 140 mV hysteresis), and a precision 600 mV feedback reference (±1% over temperature). The device supports enable-controlled sequencing and provides open-drain Power Good monitoring with 90% VFB valid threshold and 5% hysteresis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.5 V to 5.5 V - supports direct connection to single-cell Li-ion (2.7–4.2 V) or triple-cell alkaline (3.0–4.5 V) without pre-regulation. |
| Output Current | Up to 2.0 A continuous - sufficient for powering application processors, RF transceivers, or image signal processors in compact handheld devices. |
| Switching Frequency | 3.0 MHz ±10% - enables use of ultra-small 1.0 µH inductors and 10 µF ceramic output capacitors, reducing solution footprint by >40% vs. 1 MHz converters. |
| Feedback Reference | 600 mV ±1% - sets precise output voltage via external resistor divider; enables stable 0.6 V to VIN adjustment with <±0.5%/A load regulation. |
| Power Good Threshold | 90% of VFB (540 mV) - provides reliable system-level power sequencing confirmation with 5% hysteresis to prevent chatter during brown-out conditions. |
| Thermal Protection | 170 °C shutdown with 25 °C hysteresis - prevents irreversible die damage during sustained overload or poor PCB thermal design. |
| Quiescent Current | 5.7 mA in PWM mode - minimizes standby power loss in always-on subsystems such as baseband modems or sensor hubs. |
Pinout & Package
The NCV6323BMTAATBG is housed in a space-saving, low-profile 2.0 mm × 2.0 mm × 0.75 mm WDFN8 package (Case 511BE) with 0.5 mm pitch and wettable flank option available. Exposed thermal pad (Pin 9) must be soldered to PCB ground plane for optimal thermal performance (RJA = 62 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - PGND | Power Ground | Main return path for high-current switching loop (PVIN → SW → PGND); must connect directly to low-impedance system ground plane. |
| 2 - SW | Switch Node | Drain of internal high-side P-MOSFET and source of low-side N-MOSFET; connects to inductor; high dv/dt node requiring minimized trace area. |
| 3 - AGND | Analog Ground | Reference ground for FB, EN, AVIN, and internal error amplifier; must tie to system ground at single point near exposed pad to avoid noise coupling. |
| 4 - FB | Feedback Input | Connects to resistor divider midpoint; senses regulated output voltage; internal 600 mV reference determines VOUT = 0.6 V × (1 + R1/R2). |
| 5 - EN | Enable Input | Active-high digital control (1.1 V min high, 0.4 V max low); internal 10 nA pull-down allows direct connection to microcontroller GPIO without external bias. |
| 6 - PG | Power Good Output | Open-drain status signal; pulled low when VOUT < 90% target; requires external 1 MΩ pull-up for logic-level interface to host processor reset controller. |
| 7 - AVIN | Analog Supply | Bias supply for internal analog circuitry (error amp, reference, comparators); bypass with ≥1 µF ceramic capacitor placed adjacent to pin. |
| 8 - PVIN | Power Input | Main input supply for power switches; requires ≥10 µF low-ESR ceramic capacitor placed within 2 mm of pin to suppress switching transients. |
| 9 - PAD | Exposed Thermal Pad | Internally unconnected but critical for heat dissipation; must be soldered to solid copper ground plane using ≥4 thermal vias for RJB ≤ 30 °C/W. |
Key Features
| Feature | Design Value |
|---|---|
| Synchronous Rectification | Integrated P- and N-channel MOSFETs eliminate external Schottky diode, improving full-load efficiency by 8–12% and reducing thermal stress in 2 A applications. |
| 3 MHz Fixed-Frequency PWM | Enables use of 1.0 µH inductors and 10 µF output capacitors - cuts total passive component volume by ~65% versus 500 kHz solutions while maintaining tight transient response. |
| Active Output Discharge | 500 Ω internal discharge path from SW to PGND activates when EN = low, discharging output capacitance in <10 ms and preventing floating voltage on downstream circuits. |
| AEC-Q100 Qualified | Qualified to Grade 1 (−40 °C to +125 °C junction), PPAP-capable, and manufactured under automotive-specific process controls - suitable for infotainment, ADAS camera modules, and telematics. |
| Soft-Start Timing | 100 µs typical ramp time (10% to 90% of target) - limits inrush current to <1.5 A during startup, protecting input capacitors and upstream power sources. |
Applications
| Smartphone Application Processor Core | Digital Still Camera ISP Power |
|---|---|
|
Use Scenario: Supplies 1.1 V core voltage to ARM Cortex-A series application processors in LTE smartphones with dynamic DVFS scaling. IC Role / Device Role / Timing Role: Primary point-of-load regulator delivering up to 2 A with fast transient response (<50 µs recovery from 0.5 A → 1.5 A step) and low 10 mVpp ripple in PWM mode. Use Value: Enables reliable operation under burst-mode CPU loads while minimizing board area with 2 mm × 2 mm footprint and eliminating external MOSFETs and drivers. |
Use Scenario: Powers image signal processor (ISP) in 12 MP+ mobile cameras requiring clean, tightly regulated 1.8 V at up to 1.5 A. IC Role / Device Role / Timing Role: High-efficiency synchronous buck converter with 600 mV reference accuracy and <±0.5%/A load regulation to maintain ISP clock stability and reduce image noise. Use Value: Delivers >87% efficiency at 1.8 V/1.5 A (VIN = 3.6 V), reducing thermal load near optical modules and enabling thinner camera bump designs. |
| Automotive Infotainment SoC Core | USB-Powered Portable Media Player |
|
Use Scenario: Provides 1.0 V core rail for automotive-grade application SoCs in head-unit systems operating across −40 °C to +105 °C ambient. IC Role / Device Role / Timing Role: AEC-Q100 Grade 1 qualified buck regulator with thermal shutdown (170 °C) and UVLO (2.4 V) ensuring fail-safe behavior during cold-crank or load-dump events. Use Value: Eliminates need for external supervision ICs; integrated PG output synchronizes SoC reset sequencing with power rail stabilization per ISO 26262 ASIL-B requirements. |
Use Scenario: Regulates USB 5 V input down to 3.3 V for audio codec and NAND flash in portable media players with battery backup. IC Role / Device Role / Timing Role: Input-voltage feedforward controlled buck converter maintaining regulation across full USB voltage range (4.75 V–5.25 V) with <1% line regulation. Use Value: Achieves 92% peak efficiency at 3.3 V/1 A, extending playback time; soft-start prevents USB port overcurrent trips during plug-in events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP2143GQ-Z | 2.5 V–5.5 V input, 3 A output, 2 MHz switching, no PG output, non-automotive grade | Lacks Power Good signaling and AEC-Q100 qualification; suited for consumer portable devices where sequencing is handled externally | Select when higher output current (3 A) is required and automotive qualification is unnecessary; verify external sequencing logic replaces PG function |
| TPS62231DRVR | 2.05 V–6.0 V input, 600 mA output, 3.6 MHz switching, integrated compensation, no active discharge | Lower current rating and missing active output discharge; optimized for ultra-low-power microcontrollers rather than high-current SoCs | Choose only for sub-1 A applications with strict size constraints; not suitable as drop-in replacement due to current and discharge capability mismatch |
Compared with MP2143GQ-Z and TPS62231DRVR, the NCV6323BMTAATBG uniquely combines AEC-Q100 qualification, integrated Power Good, active output discharge, and 2 A capability in a 2 mm × 2 mm footprint - making it the only viable option for automotive infotainment cores and high-performance smartphone SoC rails requiring guaranteed sequencing and fail-safe shutdown.
Availability
NCV6323BMTAATBG is available at Aetrix Electronics and suitable for automotive infotainment systems, smartphone application processors, and USB-powered portable media players requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.
Supply support for NCV6323BMTAATBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensing, and connectivity solutions for automotive, industrial, cloud, and consumer markets.
The NCV6323BMTAATBG belongs to onsemi's automotive-qualified DC-DC converter portfolio, designed specifically for high-density, thermally constrained point-of-load applications in infotainment, ADAS, and body electronics where reliability, small size, and AEC-Q100 compliance are mandatory.
FAQ
What is the maximum output current capability of the NCV6323BMTAATBG?
The NCV6323BMTAATBG delivers up to 2.0 A continuous output current under recommended operating conditions (TJ ≤ 125 °C, proper PCB thermal design). Its cycle-by-cycle current limit is set at 2.8 A typical, allowing brief peak loads while maintaining safe operation. Derating applies above 85 °C ambient; consult Figure 7–10 in the datasheet for efficiency vs. load curves at various VIN/VOUT combinations.
Does the NCV6323BMTAATBG support adjustable output voltage, and how is it configured?
Yes, the NCV6323BMTAATBG supports externally adjustable output voltage from 0.6 V to VIN using a resistor divider connected between VOUT, FB, and AGND. The internal 600 mV reference determines VOUT = 0.6 V × (1 + R1/R2). For example, R1 = 220 kΩ and R2 = 110 kΩ yields 1.8 V output. Cfb (typically 15 pF) is added between FB and VOUT to optimize transient response.
Is the NCV6323BMTAATBG qualified for automotive applications?
Yes, the NCV6323BMTAATBG carries the NCV prefix indicating automotive qualification. It is AEC-Q100 Grade 1 qualified (−40 °C to +125 °C junction), PPAP-capable, and manufactured under automotive-specific quality controls. Its thermal shutdown (170 °C), UVLO (2.4 V), and robust ESD ratings (2 kV HBM) meet stringent automotive reliability requirements.
What package type does the NCV6323BMTAATBG use, and what are its key mechanical dimensions?
The NCV6323BMTAATBG uses the WDFN8 package (Case 511BE): 2.0 mm × 2.0 mm footprint, 0.75 mm maximum height, 0.5 mm pin pitch, and an exposed thermal pad. Pin 9 is the exposed pad, which must be soldered to a PCB ground plane with ≥4 thermal vias to achieve specified thermal resistance (RJA = 62 °C/W).
How does the Power Good (PG) output function on the NCV6323BMTAATBG?
The PG pin is an open-drain output that signals "power good" when VOUT reaches and remains above 90% of its target voltage (e.g., 540 mV for a 0.6 V reference). It pulls low during startup until regulation is achieved, and asserts high-impedance once valid. A 1 MΩ external pull-up is required; timing delays include 1.15 ms from EN rising edge to PG high (TdPGH1) and 8 µs from EN falling edge to PG low (TdPGL1).
NCV6323BMTAATBG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- -
- Package/Case:
- 8-WFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Adjustable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.5V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 0.6V
- Voltage - Output (Max):
- 5.5V
- Current - Output:
- 2A
- Frequency - Switching:
- 3MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WDFN (2x2)
NCV6323BMTAATBG FAQ
1.How can I place an order for NCV6323BMTAATBG through Aetrix?
Please submit a Request for Quotation (RFQ) for NCV6323BMTAATBG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NCV6323BMTAATBG reliable?
The price and inventory of NCV6323BMTAATBG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NCV6323BMTAATBG is usually 5 days.
3.What payment methods are accepted for NCV6323BMTAATBG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NCV6323BMTAATBG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NCV6323BMTAATBG?
NCV6323BMTAATBG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NCV6323BMTAATBG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NCV6323BMTAATBG?
For technical support, including NCV6323BMTAATBG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NCV6323BMTAATBG requirements.
6.How does Aetrix verify that NCV6323BMTAATBG is sourced from the original manufacturer or authorized distributors?
All NCV6323BMTAATBG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NCV6323BMTAATBG meets industry standards.
7.What is the process for return or replacement of NCV6323BMTAATBG?
All NCV6323BMTAATBG units undergo pre-shipment inspection (PSI). If there is an issue with NCV6323BMTAATBG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NCV6323BMTAATBG part is unused and in its original packaging.
Return procedure for NCV6323BMTAATBG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NCV6323BMTAATBG Tags
-
TPS562201DDCR
Texas Instruments
-
MC34063ABD-TR
STMicroelectronics
-
TPS561201DDCR
Texas Instruments
-
MC33063ADR
Texas Instruments
-
MC34063ADR
Texas Instruments
-
TPS560200DBVR
Texas Instruments
-
AP3012KTR-G1
Diodes Incorporated
-
TLV61048DBVR
Texas Instruments
-
AZ34063UMTR-G1
Diodes Incorporated
-
TPS562200DDCR
Texas Instruments
-
AP62300TWU-7
Diodes Incorporated
-
MC34063EBD-TR
STMicroelectronics
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
