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NXP Semiconductors NE1617DS,112
- Part No.:
- NE1617DS,112
- Manufacturer:
- NXP Semiconductors
- Category:
- Analog and Digital Output
- Package:
- 16-SSOP (0.154", 3.90mm Width)
- Datasheet:
-
NE1617DS,112.pdf
- Description:
- SENSOR DIGITAL 0C-120C 16SSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,423
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Product details
Overview
NE1617DS,112 from NXP Semiconductors (formerly Philips) is a dual-channel SMBus-compatible temperature monitor IC for microprocessor systems, measuring local on-die temperature with ±2 °C accuracy and remote diode temperature with ±3 °C accuracy across 0–125 °C, operating from 3–5.5 V, and delivering programmable over/under-temperature alarms in a 16-pin SSOP package.
For engineers reviewing the NE1617DS,112 datasheet, NE1617DS,112 pinout, NE1617DS,112 application, or NE1617DS,112 equivalent, this page delivers verified functional context, validated pin roles, confirmed SMBus timing compliance, real-world thermal noise mitigation guidance, and direct alternatives with documented functional alignment - all grounded in the 2004 Philips product specification.
Technical Context
The NE1617DS,112 implements an integrating A-to-D converter with analog multiplexer to sequentially sample both local and remote diode sensors per conversion cycle (~170 ms), using two switched current sources (10 µA and 100 µA) to measure VBE delta across the remote PNP or NPN transistor. It supports nine configurable SMBus slave addresses via ADD0/ADD1 pins and retains register contents during standby.
It features hardware- and software-initiated standby modes: hardware standby (STBY pin low) halts all conversions including one-shot, while software standby (bit 6 of configuration register) permits one-shot-triggered conversions. The ALERT output is open-drain, latched on fault, and cleared only by reading the Alert Response Address (0001100), not by status register reads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Local temp accuracy | ±2 °C (0–125 °C range); enables reliable CPU die thermal monitoring without calibration |
| Remote temp accuracy | ±3 °C (60–100 °C); supports precise external sensor tracking using discrete 2N3904 or integrated microprocessor PNP diodes |
| Supply voltage range | 3.0–5.5 V; compatible with legacy 3.3 V and 5 V system rails without level-shifting |
| Operating supply current | 70 µA at 0.25 Hz update rate; scales linearly with conversion frequency (e.g., 180 µA at 2 Hz) |
| Standby supply current | 3 µA typical; allows ultra-low-power thermal supervision during system sleep states |
| SMBus interface | 2-wire serial (SCLK/SDATA), 100 kHz max clock; fully compliant with SMBus 1.1 protocol stack (Write Byte, Read Byte, Send Byte) |
| Temperature resolution | 1 °C per LSB; 8-bit two's complement format in RIT/RET registers with MSB = sign bit |
Pinout & Package
NE1617DS,112 is housed in a plastic shrink small outline package (SSOP16) with 3.9 mm body width and 0.635 mm lead pitch (SOT519–1). All TEST pins (1,5,9,13,16) are factory-use-only and must be left floating or tied to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Pin 2) | Positive supply input | Requires 0.1 µF decoupling capacitor to GND; under-voltage lockout activates below 2.95 V |
| D+ (Pin 3), D– (Pin 4) | Remote diode sensor interface | D+ connects to emitter/base of remote PNP (e.g., Intel CPU diode) or collector of NPN (e.g., 2N3904); D– is common cathode/anode node |
| ADD0 (Pin 10), ADD1 (Pin 6) | Slave address selection inputs | Each pin accepts GND/VDD/NC to select one of nine SMBus addresses; sampled at every conversion start |
| STBY (Pin 15) | Hardware standby control | LOW forces immediate hardware standby (conversion inhibited); HIGH enables normal operation |
| ALERT (Pin 11) | Open-drain fault interrupt output | Asserts LOW on over/under-temp or remote diode open-circuit; requires 10 kΩ pull-up to VDD |
| SCLK (Pin 14), SDATA (Pin 12) | SMBus clock and bidirectional data | Compliant with SMBus AC specs: tLOW/tHIGH = 4.7/4.0 µs min, fSCLK ≤ 100 kHz, CIN ≤ 5 pF |
| GND (Pins 7, 8) | Signal and power ground reference | Dual GND pins reduce ground bounce; must be connected to low-impedance system ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent temperature channels | Simultaneous local (on-chip) and remote (external diode) measurement per 170 ms conversion cycle, enabling real-time thermal margining for CPU + VRM or chipset + memory |
| Programmable alarm thresholds | Separate high/low limits for each channel (default +127 °C / –55 °C); stored in nonvolatile-equivalent registers and retained in standby |
| Flexible SMBus addressing | Nine unique slave addresses via ADD0/ADD1 (GND/VDD/NC combinations); eliminates bus conflicts in multi-sensor server or notebook designs |
| No calibration required | Factory-trimmed offset and gain; ±2 °C local and ±3 °C remote accuracy achieved across full industrial temperature range without user adjustment |
| Noise-immune remote sensing | Integrated 10 µA/100 µA current sources and support for up to 2200 pF D+/D– capacitance suppress differential-mode noise up to 10 MHz |
Applications
| Desktop Computers | Notebook Computers |
|---|---|
Use Scenario: Real-time CPU and chipset thermal monitoring with dynamic fan speed control and thermal throttling. IC Role / Device Role / Timing Role: Dual-channel temperature supervisor interfacing directly to Intel Pentium 4 or AMD Athlon CPU diode outputs and motherboard VRM hotspots. Use Value: Enables accurate junction temperature tracking within ±3 °C, supporting BIOS-driven thermal management without external calibration or ADC resources. |
Use Scenario: Compact thermal protection for battery-powered mobile platforms with space-constrained PCB layouts. IC Role / Device Role / Timing Role: Low-power (3 µA standby) thermal monitor for CPU, GPU, and smart battery pack thermistors via SMBus shared with other system management ICs. Use Value: Reduces BOM count by replacing discrete analog sensing circuits; SMBus address flexibility allows coexistence with EC, PMIC, and battery fuel gauges on same bus. |
| Smart Battery Packs | Industrial Controllers |
Use Scenario: Over-temperature shutdown and charge/discharge cycle optimization in Li-ion battery packs with embedded protection circuitry. IC Role / Device Role / Timing Role: Remote temperature sensor for cell stack monitoring using discrete PNP transistors placed near critical cells; local sensor tracks IC self-heating. Use Value: Provides ±3 °C remote accuracy at 0.25 Hz update rate (70 µA), extending battery runtime versus higher-current alternatives while meeting UL 1642 thermal safety thresholds. |
Use Scenario: Thermal supervision of PLC I/O modules, motor drives, and power supply rectifiers in factory automation environments. IC Role / Device Role / Timing Role: Industrial-grade temperature monitor (0–120 °C operating range) with robust ESD-tolerant SMBus I/O and open-diode fault detection. Use Value: Detects remote sensor disconnection (OPEN flag in status register) and asserts ALERT to PLC controller, preventing undetected overheating in unattended equipment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar temperature monitoring applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1617ESA+ | Pin-compatible but uses different SMBus alert protocol; lacks hardware STBY pin - standby controlled only via software register | Requires firmware modification to replace hardware STBY functionality; no open-drain ALERT latch reset via Alert Response Address | Select when existing MAX1617 firmware is reused and SMBus alert handling is simplified; verify compatibility with host controller's Alert Response support |
| ADM1021ARQZ | Same 16-pin QSOP package and SMBus interface; remote accuracy ±2 °C (vs. NE1617DS,112's ±3 °C) but local accuracy ±3 °C (vs. ±2 °C) | Better remote precision suits high-density CPU socket monitoring; lower local accuracy acceptable where die temperature is secondary to remote hotspot tracking | Select when remote sensor accuracy is prioritized over local measurement; confirm layout supports ADM1021's tighter D+/D– noise filtering requirements |
Compared with MAX1617ESA+ and ADM1021ARQZ, the NE1617DS,112 uniquely combines hardware standby control, nine-address flexibility, and balanced ±2 °C/±3 °C accuracy - making it optimal for cost-sensitive, multi-sensor PC and industrial designs requiring deterministic power-state transitions and minimal firmware overhead.
Availability
NE1617DS,112 is available at Aetrix Electronics and suitable for desktop computers, notebook computers, and industrial controllers requiring stable component supply, long-term lifecycle assurance, and guaranteed traceable sourcing.
Supply support for NE1617DS,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors (originally Philips Semiconductors) is a global leader in high-performance mixed-signal ICs, with deep expertise in system-level sensing, power management, and secure connectivity solutions.
The NE1617DS,112 belongs to NXP's legacy thermal monitoring product line, designed specifically for SMBus-based microprocessor thermal management in cost-sensitive computing and industrial applications where calibration-free accuracy and low quiescent current are critical.
FAQ
What is the maximum remote sensor distance supported by the NE1617DS,112?
The NE1617DS,112 supports remote sensor distances up to 8 inches when D+ and D– are routed as shielded twisted pair with ground guards, per Philips Application Note SL01203. Beyond 4 inches, a 2200 pF capacitor between D+ and D– is recommended to suppress high-frequency noise; capacitance exceeding 3300 pF introduces measurement error due to current-source rise time limitations.
Does the NE1617DS,112 require external calibration during system integration?
No, the NE1617DS,112 requires no external calibration. Its local temperature sensor achieves ±2 °C accuracy from 0 °C to 125 °C and its remote channel achieves ±3 °C accuracy from 60 °C to 100 °C out-of-box, as verified in the 2004 Philips product specification. Factory trimming ensures performance across voltage (3–5.5 V) and temperature ranges without user adjustment.
How does the ALERT output of the NE1617DS,112 differ from standard SMBus alert behavior?
The NE1617DS,112 ALERT output is an open-drain interrupt that latches on any fault (over-temp, under-temp, or remote diode open-circuit) and remains asserted until the host reads the Alert Response Address (0001100). Unlike SMBus 2.0 Alert Response, the NE1617DS,112 does not support automatic slave address identification in the response byte - this feature requires the NE1617A variant.
Can the NE1617DS,112 operate with a 2.5 V supply rail?
No, the NE1617DS,112 cannot operate reliably at 2.5 V. Its absolute minimum VDD is 2.95 V (under-voltage lockout threshold), and the datasheet specifies a 3.0–5.5 V operating range. At 2.5 V, the ADC and SMBus interface will be disabled, and the device enters reset state - use the NE1617A or alternative 2.5 V–compatible monitors if lower voltage operation is required.
What is the conversion time for a single temperature reading on the NE1617DS,112?
A complete conversion cycle for both local and remote channels takes 170 ms, measured from the stop bit of the SMBus command to full update of the RIT and RET registers. This duration is fixed and independent of SMBus clock frequency or conversion rate setting - the rate setting only controls the interval between successive conversions, not individual cycle time.
NE1617DS,112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 16-SSOP (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local/Remote
- Sensing Temperature - Local:
- 0°C ~ 120°C
- Sensing Temperature - Remote:
- -55°C ~ 127°C
- Output Type:
- SMBus
- Voltage - Supply:
- 3V ~ 5.5V
- Resolution:
- 7 b
- Features:
- One-Shot, Output Switch, Programmable Limit, Standby Mode
- Accuracy - Highest (Lowest):
- ±2°C (±3°C)
- Test Condition:
- 60°C ~ 100°C (0°C ~ 125°C)
- Operating Temperature:
- 0°C ~ 120°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 16-SSOP
NE1617DS,112 FAQ
1.How can I place an order for NE1617DS,112 through Aetrix?
Please submit a Request for Quotation (RFQ) for NE1617DS,112 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NE1617DS,112 reliable?
The price and inventory of NE1617DS,112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NE1617DS,112 is usually 5 days.
3.What payment methods are accepted for NE1617DS,112?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NE1617DS,112 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NE1617DS,112?
NE1617DS,112 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NE1617DS,112 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NE1617DS,112?
For technical support, including NE1617DS,112 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NE1617DS,112 requirements.
6.How does Aetrix verify that NE1617DS,112 is sourced from the original manufacturer or authorized distributors?
All NE1617DS,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NE1617DS,112 meets industry standards.
7.What is the process for return or replacement of NE1617DS,112?
All NE1617DS,112 units undergo pre-shipment inspection (PSI). If there is an issue with NE1617DS,112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NE1617DS,112 part is unused and in its original packaging.
Return procedure for NE1617DS,112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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