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NXP Semiconductors NE1618DS,118

Part No.:
NE1618DS,118
Manufacturer:
NXP Semiconductors
Category:
Analog and Digital Output
Package:
16-SSOP (0.154", 3.90mm Width)
Datasheet:
AetrixNE1618DS,118.pdf
Description:
SENSOR DIGITAL 0C-120C 16SSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,982

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Product details

Overview

NE1618DS,118 from NXP Semiconductors (formerly Philips) is a dual-channel SMBus-compatible temperature monitor IC for microprocessor systems, measuring local on-chip temperature with ±2 °C accuracy and remote diode temperature with ±1.5 °C (1 °C resolution) or ±1.0 °C (0.125 °C resolution), operating from 3.0–3.6 V, consuming 80 µA active / 3 µA standby current, in a 16-lead QSOP package.

For engineers reviewing the NE1618DS,118 datasheet, NE1618DS,118 pinout, NE1618DS,118 application, or NE1618DS,118 equivalent, key selection considerations include remote sensor interface compatibility (NPN/PNP diode-connected transistors), programmable SMBus address (9 options via ADD0/ADD1), extended-mode 0.125 °C remote resolution, hardware/software standby control (STBY pin & RUN/STOP bit), and alarm threshold programmability for thermal management in space-constrained embedded platforms.

Technical Context

The NE1618DS,118 implements a sigma-delta A-to-D converter for local sensing and a two-current-source (10 µA / 100 µA) diode VBE delta measurement architecture for remote sensing. It supports automatic periodic conversion at user-programmable rates (0.06–8 Hz) and immediate one-shot triggering via SMBus command 0Fh.

Its SMBus 2-wire interface uses open-drain SDATA/SCLK with external 10 kΩ pull-ups, complies with SMBus timing (fSCLK ≤ 100 kHz, tLOW/tHIGH ≥ 4.7/4.0 µs), and lacks SMBus timeout capability. Device addressing uses ADD0/ADD1 pins to select one of nine 7-bit slave addresses (e.g., 0011000b to 1001110b).

Key Specifications

ParameterValue and Actual Design Meaning
Local temp accuracy±2 °C over 0–120 °C - enables reliable die-temperature monitoring without calibration
Remote temp accuracy±1.0 °C (0.125 °C res.) or ±1.5 °C (1 °C res.) - supports precise CPU/die thermal tracking using integrated PNP diodes (e.g., Intel Pentium)
Supply voltage3.0–3.6 V - matches modern low-voltage microprocessor system rails
Active supply current80–270 µA depending on conversion rate - allows continuous thermal monitoring in power-sensitive notebooks
Standby supply current3 µA typical - extends battery life in smart battery packs during idle periods
SMBus address options9 unique addresses via ADD0/ADD1 (GND/NC/VDD) - permits multi-sensor thermal mapping on single bus
Conversion time150 ms (basic) or 750 ms (extended) - defines minimum polling interval and interrupt latency

Pinout & Package

NE1618DS,118 is housed in a 16-lead QSOP (SOT519-1) package, 3.9 mm × 4.9 mm body, 0.65 mm pitch, with exposed pad not electrically connected. Pin 1 is TEST1 (factory use only); pins 7 and 8 are GND; pin 15 is STBY (hardware standby control); pins 11, 12, and 14 serve ALERT, SDATA, and SCLK respectively for SMBus communication.

Pin/TerminalCircuit RoleDesign Meaning
VDD (Pin 2)Positive supply inputMust be decoupled with 0.1 µF capacitor; UVLO activates below 2.1 V to prevent erroneous readings
D+ / D– (Pins 3/4)Remote diode sensor interfaceAccepts diode-connected NPN (e.g., 2N3904) or PNP (e.g., Intel CPU on-die diode); anode to D+, cathode to D–
ADD0 / ADD1 (Pins 6/10)Slave address configurationSet to GND/NC/VDD to select one of nine SMBus addresses; sampled at power-up and every conversion start
STBY (Pin 15)Hardware standby enableLOW forces immediate hardware standby (A/D disabled); HIGH enables normal operation
ALERT (Pin 11)Open-drain interrupt outputAsserts LOW when local/remote temp exceeds programmed thresholds; requires external pull-up resistor
SDATA / SCLK (Pins 12/14)SMBus bidirectional data/clockOpen-drain signals requiring 10 kΩ pull-ups; support standard SMBus protocols including read/write register access

Key Features

FeatureDesign Value
Dual independent temperature channelsSimultaneous local (on-chip) and remote (external diode) sensing enables system-level thermal profiling with single IC
Two remote resolution modesSoftware-selectable 1 °C (basic) or 0.125 °C (extended) resolution - optimized for either fast polling or high-precision die monitoring
Programmable over/under temperature alarmsIndependent high/low limits per channel stored in dedicated registers (WIHL/WILL/WEHL/WELL) - eliminates need for external comparators
Hardware + software standby controlSTBY pin (hardware) and RUN/STOP bit (software) provide flexible power management - critical for battery-powered applications
No calibration requiredFactory-trimmed analog front-end ensures specified accuracy across full temperature range - reduces production test overhead

Applications

Desktop computersNotebook computers

Use Scenario: Real-time CPU and motherboard thermal monitoring during high-load computing tasks.

IC Role / Device Role / Timing Role: Local sensor tracks IC junction temperature; remote sensor monitors Intel Pentium on-die PNP diode; SMBus updates registers every 0.2–8 Hz.

Use Value: Prevents thermal throttling by triggering OS-level throttling or fan speed adjustments before critical temperatures are reached.

Use Scenario: Compact thermal management in space-constrained laptop chassis with multiple heat sources.

IC Role / Device Role / Timing Role: Measures local ambient PCB temperature and remote GPU diode temperature via 2-wire SMBus; operates in 3 µA standby between polls.

Use Value: Enables aggressive power-saving states without sacrificing thermal safety - extends battery runtime while maintaining reliability.

Smart battery packsIndustrial controllers

Use Scenario: Monitoring cell pack temperature during charge/discharge cycles in Li-ion battery management systems.

IC Role / Device Role / Timing Role: Remote sensor attached to battery cell array; local sensor monitors BMS IC temperature; alerts on overtemp via open-drain ALERT pin.

Use Value: Provides fail-safe thermal cutoff signal directly to protection circuitry - meets IEC 62133 safety requirements for portable energy storage.

Use Scenario: Thermal supervision of programmable logic controllers (PLCs) operating in harsh industrial environments (0–120 °C).

IC Role / Device Role / Timing Role: Monitors local controller die temperature and remote field I/O module temperature via shielded twisted-pair connection.

Use Value: Ensures deterministic thermal shutdown before silicon degradation occurs - supports 15-year operational lifetime in unattended deployments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature monitor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LM94022QDCSQ/NOPBSingle-channel, ±0.8 °C remote accuracy (0.0625 °C res.), 1.7–3.6 V supply, 25 µA standby, 8-pin WSONLacks local sensing; higher remote precision but no dual-channel capabilitySelect when only remote diode monitoring is needed and ultra-fine resolution is prioritized over local sensing
MAX6642AESA+Dual-channel, ±1 °C remote (1 °C res.), 3.0–5.5 V supply, 120 µA active, 16-pin SOIC, SMBus/I²C compatibleWider voltage range and larger package; no 0.125 °C extended mode; different register mapSelect when legacy 5 V systems or SOIC footprint compatibility is required over extended resolution

Compared with LM94022QDCSQ/NOPB and MAX6642AESA+, the NE1618DS,118 uniquely delivers both local and remote sensing with selectable 0.125 °C extended resolution in a compact QSOP, making it optimal for space-constrained, dual-point thermal monitoring where fine-grained remote die tracking is essential.

Availability

NE1618DS,118 is available at Aetrix Electronics and suitable for desktop computers, notebook computers, and smart battery packs requiring stable component supply throughout product lifecycles.

Supply support for NE1618DS,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The NE1618DS,118 belongs to NXP's legacy temperature sensor portfolio originally developed by Philips Semiconductors, designed specifically for SMBus-based thermal management in microprocessor-centric systems with strict power and space constraints.

FAQ

What is the remote sensor compatibility for the NE1618DS,118?

The NE1618DS,118 supports diode-connected NPN transistors (e.g., 2N3904) or PNP transistors (e.g., 2N3906) as remote sensors, and is explicitly validated for use with on-die PNP diodes found in Intel Pentium-series microprocessors. The D+ and D– pins require proper polarity (anode to D+, cathode to D–) and operate within 0.25–0.95 V sensing range. Discrete diodes are not recommended due to mismatched current-source characteristics.

How does the NE1618DS,118 enter and exit extended resolution mode?

The NE1618DS,118 automatically enters extended resolution mode (0.125 °C remote) when the conversion rate register value is ≤ 04h (i.e., ≤ 0.7 Hz). It exits to basic mode (1 °C) when the rate is ≥ 05h (≥ 2 Hz). This transition is fully automatic and requires no firmware intervention - the device reads the conversion rate register at each conversion start to determine mode.

Can the NE1618DS,118 generate interrupts for both over-temperature and under-temperature conditions?

Yes, the NE1618DS,118 supports independent programmable high and low temperature thresholds for both local and remote channels. When either measured temperature equals or exceeds its corresponding high limit, or falls to or below its low limit, the ALERT pin asserts low and the relevant flag bit (bit 0–3) in the status register (RS) is set. All four thresholds are writable via dedicated registers (WIHL/WILL/WEHL/WELL).

What is the function of the STBY pin on the NE1618DS,118?

The STBY pin (Pin 15) provides hardware-controlled entry into low-power standby mode: driving STBY LOW disables the A-to-D converter and reduces supply current to ≤10 µA, while retaining register contents and SMBus responsiveness. Driving STBY HIGH restores full operation. Unlike software standby (RUN/STOP bit), hardware standby prevents any conversion - including one-shot - until STBY returns HIGH.

Does the NE1618DS,118 require external components for basic operation?

Yes, the NE1618DS,118 requires a 0.1 µF decoupling capacitor on VDD (Pin 2), 10 kΩ pull-up resistors on SDATA (Pin 12) and SCLK (Pin 14), and optionally a 2200 pF capacitor on the remote sensor lines (D+/D–) in noisy environments. The ALERT (Pin 11) output also requires an external pull-up resistor to generate a valid interrupt signal.

NE1618DS,118 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
16-SSOP (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Sensor Type:
Digital, Local/Remote
Sensing Temperature - Local:
0°C ~ 120°C
Sensing Temperature - Remote:
0°C ~ 120°C
Output Type:
SMBus
Voltage - Supply:
3V ~ 3.6V
Resolution:
8 b
Features:
One-Shot, Output Switch, Programmable Limit, Shutdown Mode, Standby Mode
Accuracy - Highest (Lowest):
±1.5°C (±3°C)
Test Condition:
60°C ~ 100°C (0°C ~ 120°C)
Operating Temperature:
0°C ~ 120°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
16-SSOP

NE1618DS,118 FAQ

1.How can I place an order for NE1618DS,118 through Aetrix?

Please submit a Request for Quotation (RFQ) for NE1618DS,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NE1618DS,118 reliable?

The price and inventory of NE1618DS,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NE1618DS,118 is usually 5 days.

3.What payment methods are accepted for NE1618DS,118?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NE1618DS,118 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for NE1618DS,118?

NE1618DS,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NE1618DS,118 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NE1618DS,118?

For technical support, including NE1618DS,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NE1618DS,118 requirements.

6.How does Aetrix verify that NE1618DS,118 is sourced from the original manufacturer or authorized distributors?

All NE1618DS,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NE1618DS,118 meets industry standards.

7.What is the process for return or replacement of NE1618DS,118?

All NE1618DS,118 units undergo pre-shipment inspection (PSI). If there is an issue with NE1618DS,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NE1618DS,118 part is unused and in its original packaging.

Return procedure for NE1618DS,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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