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NXP Semiconductors NE1619DS,112
- Part No.:
- NE1619DS,112
- Manufacturer:
- NXP Semiconductors
- Category:
- Thermal Management
- Package:
- 16-SSOP (0.154", 3.90mm Width)
- Datasheet:
-
NE1619DS,112.pdf
- Description:
- IC TEMP MONITOR 16SSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,413
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Product details
Overview
NE1619DS,112 from NXP Semiconductors (formerly Philips Semiconductors) is a system-level temperature and voltage monitor IC designed for microprocessor-based platforms. It integrates local/remote temperature sensing (±2 °C local, ±3 °C remote accuracy), six analog voltage inputs (12 V, 5 V, 3.3 V, 2.5 V, VCCP, VDD), SMBus 2-wire interface, and programmable alarm limits - enabling real-time hardware health monitoring in desktop and notebook computers.
For engineers reviewing the NE1619DS,112 datasheet, NE1619DS,112 pinout, NE1619DS,112 application, or NE1619DS,112 equivalent, this device delivers verified thermal/voltage supervision with Intel Heceta4 specification compliance, on-chip sigma-delta A/D conversion, and integrated VID decoding for Pentium/PRO processor voltage identification.
Technical Context
The NE1619DS,112 implements a dedicated sigma-delta A-to-D converter that sequentially samples eight channels - remote diode, local sensor, VDD, 12VIN, 5VIN, 3.3VIN, 2.5VIN, and VCCPVIN - completing a full cycle in ≤500 ms. All temperature data is stored in 8-bit two's complement format (1 °C resolution); voltage readings use 8-bit straight binary format scaled to 1/192 of nominal input (e.g., 192 = 3.3 V).
Its SMBus slave interface supports Write Byte, Read Byte, and Receive Byte protocols with fixed 7-bit address (0x2C or 0x2D depending on A0 pin state), and includes dual status registers (SR1/SR2) with individual flag bits per monitored parameter. The device also embeds VID0–VID4 digital inputs for processor voltage ID capture and a configurable open-drain reset output with ≥20 ms pulse width.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2.8 V to 5.5 V - supports operation across standard PC standby (3.3 VSB) and main rail domains. |
| Local Temp Accuracy | ±2 °C at 25 °C - enables reliable CPU die-adjacent thermal margining without calibration. |
| Remote Temp Accuracy | ±3 °C at 25 °C - validated for PNP transistor or discrete NPN (e.g., 2N3904) remote diode sensors. |
| VIN Measurement Accuracy | ±2% of full scale - ensures precise detection of out-of-spec supply deviations (e.g., 5 V ±100 mV). |
| SMBus Clock Frequency | Up to 400 kHz - compatible with standard SMBus 2.0 timing requirements. |
| Operating Temperature | 0 °C to +125 °C - rated for placement near high-power components in industrial and computing environments. |
| Package | 16-pin SSOP (QSOP), 3.9 mm body width - surface-mount compatible with dense motherboard layouts. |
Pinout & Package
NE1619DS,112 is housed in a plastic shrink small outline package (SSOP16, SOT519-1) with 0.635 mm lead pitch and 3.9 mm body width.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (SDA) | SMBus bidirectional data line | Open-drain I/O requiring external 10 kΩ pull-up; handles command/data transfer per SMBus protocol. |
| 2 (SCL) | SMBus clock input | Input-only; synchronizes all register reads/writes and initiates conversion cycles. |
| 3 (GND) | System ground reference | Mandatory low-impedance connection to PCB ground plane for stable A/D and thermal measurements. |
| 4 (VDD/3.3VSB) | Power supply & VDD monitor input | Supplies IC core logic and serves as analog input to monitor its own 3.3 V standby rail. |
| 9 (D–/NTEST_IN) | Remote sensor negative terminal / test mode enable | Analog input for remote diode; held high at power-up to enter NAND-tree connectivity test mode. |
| 10 (D+) | Remote sensor positive terminal | Paired with D– to measure ∆VBE of external diode; requires <1 nF bypass near pins in noisy environments. |
| 11 (12VIN/VID4) | Configurable analog/digital input | Default: 12 V analog monitor; programmable via CR bit 5 to read VID4 from Pentium/PRO processors. |
| 16 (A0/RESET/NTEST_OUT) | Address select / reset output / test output | Defines LSB of SMBus address at power-up; configurable as open-drain reset pulse (≥20 ms) or NAND-tree output. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated local + remote temperature sensing | On-die sensor + D+/D– interface eliminates need for external ADC or signal conditioning circuitry. |
| Multi-rail voltage monitoring | Simultaneous support for 12 V, 5 V, 3.3 V, 2.5 V, VCCP, and VDD enables full-system power integrity validation. |
| Processor VID decoding | Dedicated VID0–VID4 inputs capture Pentium/PRO voltage ID codes and store them in SMBus-accessible registers. |
| Programmable alarm thresholds | Separate high/low limit registers for each temperature and voltage channel allow custom trip-point configuration. |
| Heceta4 specification compliance | Fully matches Intel's Heceta4 reference design requirements for thermal/voltage supervision in desktop/notebook platforms. |
Applications
| Desktop Computers | Notebook Computers |
|---|---|
Use Scenario: Real-time monitoring of CPU core temperature, VRM output voltages (VCCP, 1.5 V), and 12 V/5 V/3.3 V rails during boot and load transitions. IC Role / Device Role / Timing Role: System health supervisor providing SMBus-accessible telemetry and generating hardware reset pulses on thermal/voltage violation. Use Value: Prevents thermal runaway and power-related crashes by triggering system-level throttling or shutdown before damage occurs. | Use Scenario: Compact thermal management in space-constrained laptop motherboards, tracking GPU die temperature and battery charging rail stability. IC Role / Device Role / Timing Role: Local temperature sensor + remote diode interface co-located with processor and GPU; performs cyclic conversions every ≤500 ms. Use Value: Enables fan speed control and dynamic voltage scaling based on validated, calibrated thermal data without host CPU overhead. |
| Industrial Controllers | Telecom Equipment |
Use Scenario: Monitoring ambient temperature and 24 V/12 V field power supplies in programmable logic controllers operating in extended temperature ranges. IC Role / Device Role / Timing Role: Standby current <100 µA at 3.3 V allows continuous supervision during low-power states without impacting system efficiency. Use Value: Provides deterministic fault detection for safety-critical systems where unmonitored voltage drift could cause control loop instability. | Use Scenario: Supervising redundant 48 V DC-DC converter outputs and FPGA junction temperature in carrier-grade base station line cards. IC Role / Device Role / Timing Role: Interfaces with baseband controller via SMBus to report voltage/temperature status and assert hardware reset on over-temperature events. Use Value: Meets telecom reliability standards by delivering ±3 °C remote accuracy and ESD protection exceeding 2000 V HBM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar temperature and voltage monitoring applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM92CIMX-3/NOPB | Single-channel remote temperature sensor only; no voltage monitoring or VID inputs; uses 2-wire I²C (not SMBus-specific). | Lacks multi-rail voltage supervision and processor ID decoding - suitable only for thermal-only use cases. | Select when only high-accuracy remote diode sensing is required and SMBus compatibility is not mandatory. |
| MAX6657ESA+ | Includes local/remote temp sensing and one analog voltage input (VCC); no VID support; SMBus-compatible but lacks 12 V/5 V/3.3 V/2.5 V/VCCP monitoring capability. | Cannot replace full NE1619DS,112 functionality in PC/platform applications requiring six independent voltage rails. | Choose for embedded systems needing basic thermal + single-supply monitoring with lower pin count and cost. |
Compared with LM92CIMX-3/NOPB and MAX6657ESA+, the NE1619DS,112 uniquely combines six-rail voltage supervision, Pentium/PRO VID decoding, and Intel Heceta4 compliance - making it irreplaceable in legacy x86 desktop/notebook designs requiring full hardware monitoring integration.
Availability
NE1619DS,112 is available at Aetrix Electronics and suitable for desktop computers, notebook computers, and industrial controllers requiring stable component supply across long-lifecycle production programs.
Supply support for NE1619DS,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips Semiconductors in 2006, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.
The NE1619DS,112 belongs to NXP's legacy system monitoring IC portfolio, originally developed to meet Intel's Heceta4 specification for thermal and power integrity supervision in x86-based computing platforms.
FAQ
What is the SMBus slave address of the NE1619DS,112?
The NE1619DS,112 supports two SMBus slave addresses: 0x2C (when pin 16/A0 is tied to GND) and 0x2D (when pin 16/A0 is tied to VDD). The address is latched at power-up and cannot be changed dynamically during operation. This dual-address capability allows two NE1619DS,112 devices to share the same SMBus if properly configured, though reset output functionality restricts concurrent use of pin 16 as RESET on both units.
Does the NE1619DS,112 require external calibration for temperature or voltage measurements?
No, the NE1619DS,112 does not require external calibration. Its temperature sensing achieves ±2 °C local and ±3 °C remote accuracy without trimming, and voltage measurements maintain ±2% full-scale accuracy across the 2.8 V to 5.5 V supply range. All A/D conversion, offset, and gain characteristics are factory-trimmed and stored in on-chip circuitry - eliminating production-line calibration steps for the NE1619DS,112.
How does the NE1619DS,112 handle remote temperature sensor faults?
The NE1619DS,112 detects remote diode faults (open or short circuit) during each temperature conversion cycle and reports the condition via bit 6 (Remote Diode Fault) in Status Register 2 (SR2, address 0x42). When asserted, this flag indicates invalid D+/D– measurements and disables remote temperature reporting until the fault is resolved. The NE1619DS,112 continues monitoring all other parameters - including local temperature and voltage rails - unaffected by the remote sensor fault.
Can the NE1619DS,112 monitor both 12 V and VID4 simultaneously?
No, the NE1619DS,112 cannot monitor 12 V and VID4 simultaneously because pin 11 (12VIN/VID4) is functionally multiplexed. By default at power-up, it operates as the 12 V analog input. To read VID4, bit 5 (12VIN/VID4 SELECT) in the Configuration Register (CR, 0x40) must be set to 1 - which reassigns pin 11 to digital VID4 input and disables 12 V monitoring. This configuration is persistent until changed again via SMBus, and the NE1619DS,112 provides no hardware mechanism to time-share the pin between both functions.
What is the minimum pulse width of the RESET output on the NE1619DS,112?
The RESET output on the NE1619DS,112 generates a minimum 20 ms low-state pulse when triggered. This pulse is initiated by setting bit 4 (RESET) in the Configuration Register (CR, 0x40) from 0 to 1, provided the RESET ENABLE bit (bit 7) in the VID register (0x47) has been previously set to 1. The output is open-drain and requires an external ~100 kΩ pull-up resistor to VDD; the NE1619DS,112 guarantees pulse width but does not specify maximum duration.
NE1619DS,112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 16-SSOP (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Function:
- Temp Monitoring System (Sensor)
- Sensor Type:
- Internal and External
- Sensing Temperature:
- 0°C ~ 125°C, External Sensor
- Accuracy:
- ±3°C Local(Max), ±5°C Remote(Max)
- Topology:
- ADC, Multiplexer, Register Bank
- Output Type:
- SMBus
- Output Alarm:
- Yes
- Output Fan:
- No
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- 0°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SSOP
NE1619DS,112 FAQ
1.How can I place an order for NE1619DS,112 through Aetrix?
Please submit a Request for Quotation (RFQ) for NE1619DS,112 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NE1619DS,112 reliable?
The price and inventory of NE1619DS,112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NE1619DS,112 is usually 5 days.
3.What payment methods are accepted for NE1619DS,112?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NE1619DS,112 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NE1619DS,112?
NE1619DS,112 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NE1619DS,112 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NE1619DS,112?
For technical support, including NE1619DS,112 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NE1619DS,112 requirements.
6.How does Aetrix verify that NE1619DS,112 is sourced from the original manufacturer or authorized distributors?
All NE1619DS,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NE1619DS,112 meets industry standards.
7.What is the process for return or replacement of NE1619DS,112?
All NE1619DS,112 units undergo pre-shipment inspection (PSI). If there is an issue with NE1619DS,112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NE1619DS,112 part is unused and in its original packaging.
Return procedure for NE1619DS,112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NE1619DS,112 Tags
-
EMC2101-ACZL-TR
Microchip Technology
-
MCP9844T-BE/MNY
Microchip Technology
-
EMC2101-R-ACZL-TR
Microchip Technology
-
MCP98244T-BE/MNY
Microchip Technology
-
TC670ECHTR
Microchip Technology
-
SE98ATP,547
NXP Semiconductors
-
AMC6821SDBQR
Texas Instruments
-
MAX6604AATA+T
Analog Devices Inc./Maxim Integrated
-
ADT7475ARQZ-REEL
onsemi
-
MAX6643LBBAEE+
Analog Devices Inc./Maxim Integrated
-
MAX6684ESA+T
Analog Devices Inc./Maxim Integrated
-
MAX6639AEE+
Analog Devices Inc./Maxim Integrated
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